Patents by Inventor Nora Jeske

Nora Jeske has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11828622
    Abstract: Various embodiments of the teachings herein include a sensor element for recording process parameters at a measurement point in a sintering press/sintering plant. The sensor element comprises: a first temperature sensor; and a force sensor. A force and a temperature are recorded at the measurement point at which the sensor element is arranged.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: November 28, 2023
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Michael Hanisch, Nora Jeske, Jonas Massierer, Marco Matiwe, Dennis Sommerfeld, Ulrich Wittreich
  • Patent number: 11564310
    Abstract: The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (1), characterized by at least one separating element (2) formed in the wiring carrier plate (1), which separating element divides the wiring carrier plate (1) into sections separated by the separating element (2), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (2). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks (3) arranged on the wiring carrier plate (1), and power semiconductors (6).
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: January 24, 2023
    Assignee: Rolls-Royce Deutschland Ltd & Co KG
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Matthias Heimann, Nora Jeske, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke, Ulrich Wittreich
  • Publication number: 20220336408
    Abstract: Various embodiments of the teachings herein include a semifinished product for use in the populating of a power electronics component by a connecting method. The product includes an electrically insulating prepreg frame electrically insulated. The prepreg frame is configured for surrounding an applied connecting material at a metallized installation site during the population. A material of the prepreg frame enables simultaneous processability of electrical connection and electrical insulation by compression of the insulation material in the form of the semifinished product since the processing parameters of the electrical connecting material and the semifinished product are compatible.
    Type: Application
    Filed: September 3, 2020
    Publication date: October 20, 2022
    Applicant: Siemens Aktiengesellschaft
    Inventors: Nora Jeske, Bernd Müller, Christian Nachtigall-Schellenberg, Jörg Strogies, Klaus Wilke
  • Publication number: 20220333961
    Abstract: Various embodiments of the teachings herein include a sensor element for recording process parameters at a measurement point in a sintering press/sintering plant. The sensor element comprises: a first temperature sensor; and a force sensor. A force and a temperature are recorded at the measurement point at which the sensor element is arranged.
    Type: Application
    Filed: June 26, 2020
    Publication date: October 20, 2022
    Applicant: Siemens Aktiengesellschaft
    Inventors: Michael Hanisch, Nora Jeske, Jonas Massierer, Marco Matiwe, Dennis Sommerfeld, Ulrich Wittreich
  • Publication number: 20210161002
    Abstract: The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (1), characterized by at least one separating element (2) formed in the wiring carrier plate (1), which separating element divides the wiring carrier plate (1) into sections separated by the separating element (2), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (2). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks (3) arranged on the wiring carrier plate (1), and power semiconductors (6).
    Type: Application
    Filed: March 20, 2019
    Publication date: May 27, 2021
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Matthias Heimann, Nora Jeske, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke, Ulrich Wittreich
  • Publication number: 20210021179
    Abstract: A circuit arrangement is disclosed herein. The circuit arrangement includes a circuit carrier board, a power semiconductor arranged on the underside of the circuit carrier board, and a wiring carrier board arranged underneath the power semiconductor. The circuit arrangement further includes a metallic first spacer element arranged between the circuit carrier board and the wiring carrier board and via which an electric load current from the power semiconductor flows, wherein the first spacer element acts as a shunt through which current flows. The circuit arrangement further includes a voltage measuring unit, by which a voltage drop across the first spacer element, produced by the load current flow, may be determined. A converter having such a circuit arrangement, an aircraft having a converter, and a method for current measurement in power semiconductors are likewise specified.
    Type: Application
    Filed: February 28, 2019
    Publication date: January 21, 2021
    Inventors: Rene Blank, Martin Franke, Peter Frühauf, Matthias Heimann, Nora Jeske, Rüdiger Knofe, Bernd Müller, Stefan Nerreter, Jörg Strogies, Klaus Wilke, Ulrich Wittreich