Abstract: The present disclosure is directed to a system that includes a radio frequency (RF) board configured to support multiple frequency bands and antenna configurations through dynamic routing and selective component population. The RF board includes an antenna feed, first and second signal paths, and frequency processing sites, allowing a single antenna feed to connect to either path by populating specific components. This configuration enables processing of different signal frequencies without altering PCB substrate pathways. Integrated switches, such as SPDT or PIN diodes, facilitate software-driven routing adjustments in some embodiments, optimizing performance based on real-time requirements. A manufacturing process involves configuring the PCB with pre-existing signal paths and selectively populating components to meet SKU requirements. The RF board's layout supports signal routing to various processing components, ensuring proper impedance and minimal interference.

Abstract: The disclosure is directed to a system for mitigating noise propagated from one antenna to another. In a first configuration, a first control signal activates a second antenna switching component corresponding to a second antenna RX path to ground. This blocks noise transmitted to the second antenna by the first antenna TX signal, while maintaining the RX path for the first antenna through a first switching component to a signal processing unit for normal operation. In a second configuration, a second control signal activates the first switching component corresponding to the first antenna, grounding the first antenna RX path to mitigate noise caused by the second antenna TX signal. Simultaneously, the second antenna RX signal passes through the second antenna switching component to the signal processing unit for further processing. In some implementation, the control signal includes a transmission signal from the first or second antenna.

Abstract: A wireless communication device may include a first heat spreader including at least two main locating pins extending axially away from an inward-facing surface of the first heat spreader, a printed circuit board (PCB) adjacent to the first heat spreader, a second heat spreader adjacent to the PCB, a power board adjacent to the second heat spreader, and a third heat spreader adjacent to the power board. The third heat spreader may be secured to the at least two main locating pins to assemble the first heat spreader, PCB, second heat spreader, power board, and third heat spreader together. Various other devices and methods are related to such wireless communication devices.

Abstract: A wireless access point includes a physical form factor including a plurality of sides each adjacent to a bottom portion, wherein the physical form factor houses a plurality of components including i) at least one Printed Circuit Board (PCB) having one or more Wi-Fi radios and a Bluetooth radio and ii) a power supply; and an electrical plug connected to the power supply and extending from the bottom portion for insertion into an electrical outlet for power and for physical support of the wireless access point adjacent to the electrical plug.

Abstract: A wireless access point includes a physical form factor including a plurality of sides each adjacent to a bottom portion, wherein the physical form factor houses a plurality of components including i) at least one Printed Circuit Board (PCB) having one or more Wi-Fi radios and a Bluetooth radio and ii) a power supply; and an electrical plug connected to the power supply and extending from the bottom portion for insertion into an electrical outlet for power and for physical support of the wireless access point adjacent to the electrical plug.

Abstract: A compact electronic device includes a base with a plurality of sides each adjacent to a bottom portion, wherein the base houses components comprising a heatsink supporting a fan module located in an interior portion, a Printed Circuit Board (PCB), and a power supply, and wherein vents are disposed on the bottom portion and side vents are disposed on one or more of the plurality of sides; a top cover configured to attach to the base via the plurality of sides forming an air gap extending each of the plurality of sides, wherein the air gap supports air exhaust on one or more sides of the plurality of sides and air intake on the remaining sides; and an electrical plug connected to the power supply and extending out of the bottom portion for insertion into an electrical outlet for power and to physically support the compact electronic device.

Abstract: An electronic device includes a first circuit board and a second circuit board each stacked relative to one another; and a mid-spreader disposed between the first circuit board and the second circuit board, wherein the mid-spreader includes a heat conductive material in thermal contact with one or more components on each of the first circuit board and the second circuit board to act as a heat sink, and wherein the mid-spreader is thermally connected to one or more heat sinks, the mid-spreader is one of disposed to or integrally formed with the one or more heat sinks, and the mid-spreader extends beyond a size of at least one of the first circuit board and the second circuit board to conduct and transfer heat therefrom.

Abstract: An electronic device includes a first circuit board and a second circuit board each stacked relative to one another; and a mid-spreader disposed between the first circuit board and the second circuit board, wherein the mid-spreader includes a heat conductive material in thermal contact with one or more components on each of the first circuit board and the second circuit board to act as a heat sink, and wherein the mid-spreader is thermally connected to one or more heat sinks, the mid-spreader is one of disposed to or integrally formed with the one or more heat sinks, and the mid-spreader extends beyond a size of at least one of the first circuit board and the second circuit board to conduct and transfer heat therefrom.