Abstract: A current source inverter is disclosed, comprising: means for operating the inverter in fundamental frequency unregulated operation, means for operating the inverter in clocked voltage regulated operation, means for recording parameters from which conclusions can be drawn at an instantaneous operating point and/or at an instantaneous network condition, means for determining an appropriate operating condition from the recorded parameters and means for uninterrupted switching of the operation of the inverter to the operating condition as determined from the recorded parameters and a method for uninterrupted switching of such a current source inverter.

Abstract: The invention relates to a method for reducing the idle current requirement of a base frequency clocked supply side converter (1) on idle and with low motor loads, provided with controllable semiconductors (T1,T2,T3,T4, T5,T6), wherein the base frequency clocking of the semiconductor switches (T1,T2,T3,T4,T5,T6) occurs depending on the desired direction of flow of power. A converter (1) for carrying out said method is also disclosed.

Abstract: A method for monitoring fabrication processes of finely structured surfaces in a semiconductor fabrication includes the steps of providing reference signatures of finely structured surfaces, measuring at least one signature of a test specimen surface, comparing the measured signature with the reference signatures, and classifying the test specimen surface by using the comparison results, wherein the measurement of the reference signatures is carried out by measuring the local distribution and/or intensity distribution of diffraction images on production prototypes having a specified quality. The classification is preferably carried out here with a neural network having a learning capability and/or a fuzzy logic. Furthermore, a device for carrying out the method is provided.

Abstract: An apparatus for measuring angle-dependent diffraction effects includes a coherent radiation source, a device for deflecting the coherent radiation in different directions, a spherical or aspherical mirror or mirror segments configured to correspond to a spherical or aspherical mirror, and a detector unit for measuring the intensity of the radiation diffracted at a specimen. The radiation deflected in different directions is reflected by the mirror configuration in such a way that the coherent beam is deflected onto the specimen with different angles of incidence in a temporally successively sequential manner. For this purpose, the angle of incidence of the measuring beam is altered continuously or in small steps. The intensities of the direct reflection (zero-order diffraction) and also of the higher orders of diffraction that may occur are measured. This evaluation allows conclusions to be drawn regarding the form and material of the periodic structures examined.

Abstract: An apparatus for measuring angle-dependent diffraction effects includes a coherent radiation source, a device for deflecting the coherent radiation in different directions, a spherical or aspherical mirror or mirror segments configured to correspond to a spherical or aspherical mirror, and a detector unit for measuring the intensity of the radiation diffracted at a specimen. The radiation deflected in different directions is reflected by the mirror configuration in such a way that the coherent beam is deflected onto the specimen with different angles of incidence in a temporally successively sequential manner. For this purpose, the angle of incidence of the measuring beam is altered continuously or in small steps. The intensities of the direct reflection (zero-order diffraction) and also of the higher orders of diffraction that may occur are measured. This evaluation allows conclusions to be drawn regarding the form and material of the periodic structures examined.

Abstract: A method for monitoring fabrication processes of finely structured surfaces in a semiconductor fabrication includes the steps of providing reference signatures of finely structured surfaces, measuring at least one signature of a test specimen surface, comparing the measured signature with the reference signatures, and classifying the test specimen surface by using the comparison results, wherein the measurement of the reference signatures is carried out by measuring the local distribution and/or intensity distribution of diffraction images on production prototypes having a specified quality. The classification is preferably carried out here with a neural network having a learning capability and/or a fuzzy logic. Furthermore, a device for carrying out the method is provided.