Abstract: The method of dynamically monitoring a reticle includes preventively macro monitoring and defect inspecting with regard to mechanical loading, including particle deposits or electrostatically induced damage, and energy load, including the associated changes to the reticle material and surface characteristics. Different surface distributions of the absorber layer as well as characteristics of the exposure system, such as N2 purging of the projection lens/reticle area in order to reduce contamination and recrystallization on optically active surfaces are considered.

Abstract: A simulation is carried out of a projection based on an electronically stored circuit pattern and adjustable projection parameters and optical parameters which characterize the specific characteristics of a projection apparatus. Positions at which it is predicted that side lobes will occur in the event of an actual projection are identified in the calculated circuit pattern. The positions of the side lobes are transmitted to a manufacturing unit and are recorded in a measurement program. A wafer, which has been exposed by a mask, is inspected for side lobes, at least at precisely those transmitted positions using the measurement program. The adjustable projection parameters are adapted, a radiation-sensitive layer is removed from and reapplied to the wafer and the projection is repeated with the adapted projection parameters depending on the detection result. The control process is repeated until the side lobes have been completely prevented.

Abstract: The method of dynamically monitoring a reticle includes preventively macro monitoring and defect inspecting with regard to mechanical loading, including particle deposits or electrostatically induced damage, and energy load, including the associated changes to the reticle material and surface characteristics. Different surface distributions of the absorber layer as well as characteristics of the exposure system, such as N2 purging of the projection lens/reticle area in order to reduce contamination and recrystallization on optically active surfaces are considered.

Abstract: A reticle control system and method in which each reticle is unambiguously assigned a structured reticle data set, and the content of each reticle data set is automatically changed and/or supplemented depending on use of the associated reticle in the semiconductor component production process for which the reticle was produced. The reticle data set is used to identify and control the reticles over the entire production sequence. The ability to change or supplement the reticle data sets facilitates progressively storing production-dictated information related to the use of the associated reticles, thereby enabling effective control of the reticles in the production process.

Abstract: A simulation is carried out of a projection based on an electronically stored circuit pattern and adjustable projection parameters and optical parameters which characterize the specific characteristics of a projection apparatus. Positions at which it is predicted that side lobes will occur in the event of an actual projection are identified in the calculated circuit pattern. The positions of the side lobes are transmitted to a manufacturing unit and are recorded in a measurement program. A wafer, which has been exposed by a mask, is inspected for side lobes, at least at precisely those transmitted positions using the measurement program. The adjustable projection parameters are adapted, a radiation-sensitive layer is removed from and reapplied to the wafer and the projection is repeated with the adapted projection parameters depending on the detection result. The control process is repeated until the side lobes have been completely prevented.

Abstract: A multispectral sensor device comprises a plurality of optoelectrical conters. Each optoelectrical converter generates wavelength selectively from an optical signal an electrical measurement signal in a respective measurement channel. A processing circuit processes the generated electrical measurement signals to the respective measurement signal values. A fuzzy logic circuit performs a comparison of the generated measurement signal values with reference values and, on the basis of the comparison, assigns the measurement signal values to a number of channels, this number exceeding the number of measurement channels.