Abstract: An electronic component which comprises an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating at least part of at least one of the carrier and the electronic chip, and a functional structure covering a surface portion of the encapsulant, wherein at least part of the covered surface portion of the encapsulant is spatially selectively roughened.

Abstract: A method of forming a semiconductor device package includes providing a lead frame having a peripheral structure and a heat slug having an upper and lower surface, the heat slug being attached to the peripheral structure. A semiconductor die is attached to the heat slug. The semiconductor die is encapsulated with a molding compound while the heat slug is attached to the peripheral structure. The heat slug is completely devoid of fasteners before the encapsulating.

Abstract: A method of forming a semiconductor device package includes providing a lead frame having a peripheral structure and a heat slug having an upper and lower surface, the heat slug being attached to the peripheral structure. A semiconductor die is attached to the heat slug. The semiconductor die is encapsulated with a molding compound while the heat slug is attached to the peripheral structure. The heat slug is completely devoid of fasteners before the encapsulating.

Abstract: An electronic component which comprises an electrically conductive carrier, an electronic chip on the carrier, an encapsulant encapsulating at least part of at least one of the carrier and the electronic chip, and a functional structure covering a surface portion of the encapsulant, wherein at least part of the covered surface portion of the encapsulant is spatially selectively roughened.

Abstract: A lead frame strip includes an array of sites arranged in at least one row connected to two exterior side rails which traverse the lead frame strip on two opposite sides. Each of the sites is further connected to the two exterior side rails by subrails which extend between the two exterior side rails. Interior side rails extend between the subrails having a length dimension oriented along a first direction. The interior side rails include at least one punch degating aperture having an aperture length oriented along the first direction, wherein a total of the aperture length along the interior side rails is greater than or equal to the die pad length.

Abstract: A pellet loading apparatus includes a tablet pusher including a support surfaces including a pusher mechanism coupled thereto for vertical movement upon actuation. A tablet holder on the tablet pusher includes locations framed by sidewall members aligned in the vertical direction that form columns having open tops for holding a pellet stacks of mold component pellets. A pellet separator having a solid portion and apertures is sized to fit around a portion of a top mold pellet in the pellet stacks. The pellet separator includes a pellet drive for lateral moving the top mold pellets relative to under pellets so that after lateral movement the top mold pellets are laterally offset from the under pellets. A tablet lifter includes a pellet stopper having receiving positions for receiving top mold pellets upon receipt after a transfer actuation of the pusher mechanism.

Abstract: A lead frame strip includes an array of sites arranged in at least one row connected to two exterior side rails which traverse the lead frame strip on two opposite sides. Each of the sites is further connected to the two exterior side rails by subrails which extend between the two exterior side rails. Interior side rails extend between the subrails having a length dimension oriented along a first direction. The interior side rails include at least one punch degating aperture having an aperture length oriented along the first direction, wherein a total of the aperture length along the interior side rails is greater than or equal to the die pad length.

Abstract: A method of forming solder balls on package substrates includes attaching a semiconductor die to a frontside of a package substrate that includes a film over a bottomside of the package substrate including over a plurality of ball land areas configured to receive solder balls thereon, followed by forming an encapsulating mold layer over the semiconductor die. The film blocks contamination such as mold debris from reaching the ball land areas during die attachment and molding. The film is then removed from the bottomside of the package substrate after molding to expose the plurality of exposed ball land areas. Solder balls are dispensed onto the plurality of exposed ball land areas.

Abstract: A pellet loading apparatus includes a tablet pusher including a support surfaces including a pusher mechanism coupled thereto for vertical movement upon actuation. A tablet holder on the tablet pusher includes locations framed by sidewall members aligned in the vertical direction that form columns having open tops for holding a pellet stacks of mold component pellets. A pellet separator having a solid portion and apertures is sized to fit around a portion of a top mold pellet in the pellet stacks. The pellet separator includes a pellet drive for lateral moving the top mold pellets relative to under pellets so that after lateral movement the top mold pellets are laterally offset from the under pellets. A tablet lifter includes a pellet stopper having receiving positions for receiving top mold pellets upon receipt after a transfer actuation of the pusher mechanism.