Abstract: A power module includes a housing having a carrier plate, housing walls and a housing cover. Semiconductor elements and a temperature sensor unit having a temperature sensor are disposed in the interior of the housing on the carrier plate. Partitions disposed in the interior of the housing separate the temperature sensor unit from the semiconductor elements and enclose the temperature sensor unit in a chamber.

Abstract: A power module includes a housing having a carrier plate, housing walls and a housing cover. Semiconductor elements and a temperature sensor unit having a temperature sensor are disposed in the interior of the housing on the carrier plate. Partitions disposed in the interior of the housing separate the temperature sensor unit from the semiconductor elements and enclose the temperature sensor unit in a chamber.

Abstract: An electrical contacting interface includes a low and stable electrical transition resistance including at least two contacting partners, which interact for electrical contacting. According to an embodiment, in one of the two contacting partners, in the region of a contacting surface, a structure is formed which protrudes from the plane of the contacting surface of the one contacting partner. The structure deforms under the influence of a mechanical force and causes a corresponding deformation in the shape of a recess in the opposite contacting partner. The structure protruding from the plane is formed such that even after the deformation caused in the opposite contacting partner and the flat regions of the two contacting surfaces do not touch. Therefore, the electrical current is forced to flow solely through the contact interface created during the deformation process, such that the electricity transfer surfaces are precisely localized.

Abstract: A low-voltage switching device with a nominal device current range of up to 650 A, includes a defined cooling arrangement with a structure that has a lower and an upper device region. Power-electronic components are arranged in the lower device region. In at least one embodiment, only one coolant is provided in the low-voltage switching device. A second coolant is replaced with defined air flow channels.

Abstract: A low-voltage switching device includes a housing in which power-electronic components are arranged in the region of ventilation of a fan. In an embodiment, the power-electronic components operate under temperature regulation by virtue of an air flow that is guided asymmetrically proceeding from the fan. Therefore, the low-voltage switching device can be operated at a nominal device current range of up to 650 A as the result of the asymmetrically guided air flow.

Abstract: An electrical contacting interface includes a low and stable electrical transition resistance including at least two contacting partners, which interact for electrical contacting. According to an embodiment, in one of the two contacting partners, in the region of a contacting surface, a structure is formed which protrudes from the plane of the contacting surface of the one contacting partner. The structure deforms under the influence of a mechanical force and causes a corresponding deformation in the shape of a recess in the opposite contacting partner. The structure protruding from the plane is formed such that even after the deformation caused in the opposite contacting partner and the flat regions of the two contacting surfaces do not touch. Therefore, the electrical current is forced to flow solely through the contact interface created during the deformation process, such that the electricity transfer surfaces are precisely localized.

Abstract: A low-voltage switching device with a nominal device current range of up to 650 A, includes a defined cooling arrangement with a structure that has a lower and an upper device region. Power-electronic components are arranged in the lower device region. In at least one embodiment, only one coolant is provided in the low-voltage switching device. A second coolant is replaced with defined air flow channels.

Abstract: A low-voltage switching device includes a housing in which power-electronic components are arranged in the region of ventilation of a fan. In an embodiment, the power-electronic components operate under temperature regulation by virtue of an air flow that is guided asymmetrically proceeding from the fan. Therefore, the low-voltage switching device can be operated at a nominal device current range of up to 650 A as the result of the asymmetrically guided air flow.

Abstract: A motor starter for operating an electric motor connected to a multiphase power supply includes a semiconductor switch arranged in a current-carrying phase of the multiphase power supply, and an electromechanical switch arranged in parallel relation to the semiconductor switch in the current-carrying phase. The electromechanical switch includes a movable switching piece configured tiltable to reduce a current gradient in the semiconductor switch.

Abstract: A motor starter for operating an electric motor connected to a multiphase power supply includes a semiconductor switch arranged in a current-carrying phase of the multiphase power supply, and an electromechanical switch arranged in parallel relation to the semiconductor switch in the current-carrying phase. The electromechanical switch includes a movable switching piece configured tiltable to reduce a current gradient in the semiconductor switch.

Abstract: A device for connecting to a power network includes a circuit board, a first input-side connection point, to which a first phase of the power network can be connected, a second input-side connection point, to which a second phase of the power network can be connected, and a first and second electrical conductor. The first conductor is connected to the first input-side connection point and the second conductor is connected to the second input-side connection point inside the device. The first conductor is routed as a conductor trace in an interior layer of the circuit board and includes a constriction. The second conductor is routed past the constriction such that electrical insulation existing between the constriction of the first conductor and the second conductor is destroyed in the case of a short-circuit current, to provide an electrically conductive connection between the first and second conductor exists.

Abstract: A device for connecting to a power network includes a circuit board, a first input-side connection point, to which a first phase of the power network can be connected, a second input-side connection point, to which a second phase of the power network can be connected, and a first and second electrical conductor. The first conductor is connected to the first input-side connection point and the second conductor is connected to the second input-side connection point inside the device. The first conductor is routed as a conductor trace in an interior layer of the circuit board and includes a constriction. The second conductor is routed past the constriction such that electrical insulation existing between the constriction of the first conductor and the second conductor is destroyed in the case of a short-circuit current, to provide an electrically conductive connection between the first and second conductor exists.

Abstract: In order to enable in a motor system, in which a soft start of the motor has been implemented, the operation of the motor, wherein the power consumption is reduced, it is proposed to operate the driver circuit during a switch-on phase in order to carry out a soft start of the motor. In at least one embodiment, the driver circuit can be bypassed in a normal operational phase as a function of a load, by means of which the motor is operated.

Abstract: A cooling arrangement is disclosed for electrical components which are arranged in a housing of a soft starter which in particular may be designed for operation of an electric motor. In at least one embodiment, the cooling arrangement includes at least one fan arranged inclined in an opening in a housing wall such that the rotation axis of the fan is at an angle to the normal to the housing wall.

Abstract: A semiconductor switching module includes a power semiconductor element that is embodied in planar technology. In at least one embodiment, the power semiconductor element is provided with a base layer, a copper layer, and at least one power semiconductor chip that is mounted on the copper layer, and another electrically conducting layer which covers at least one load terminal of the power semiconductor chip. According to at least one embodiment of the invention, devices are provided for safely connecting the load terminal to a load circuit. The devices are configured such that a contact area thereof presses in a planar manner onto the electrically conducting layer.

Abstract: An engine control device, especially an engine control device having an internal by-pass, is disclosed. The universally applicable engine control device includes an integrated by-pass function. For this purpose, a housing includes chambers that are electrically insulated from one another and that are configured both to receive a respective power subunit, and, alternatively, to receive a continuous current-bearing element.

Abstract: In order to enable in a motor system, in which a soft start of the motor has been implemented, the operation of the motor, wherein the power consumption is reduced, it is proposed to operate the driver circuit during a switch-on phase in order to carry out a soft start of the motor. In at least one embodiment, the driver circuit can be bypassed in a normal operational phase as a function of a load, by means of which the motor is operated.

Abstract: A multi-component housing including a housing shell and a housing lid is disclosed. A support plate that is fitted with at least one power electronics component is disposed on a base plate of the housing shell. The housing lid supports a mounting device for fastening the housing to a cooling body by pressing the support plate to a supporting area of the cooling body. At least one supporting element is provided for transferring a pressing force that is applied in the direction of the base plate from the housing lid to the housing shell.

Abstract: A semiconductor switching module includes a power semiconductor element that is embodied in planar technology. In at least one embodiment, the power semiconductor element is provided with a base layer, a copper layer, and at least one power semiconductor chip that is mounted on the copper layer, and another electrically conducting layer which covers at least one load terminal of the power semiconductor chip. According to at least one embodiment of the invention, devices are provided for safely connecting the load terminal to a load circuit. The devices are configured such that a contact area thereof presses in a planar manner onto the electrically conducting layer.