Abstract: An apparatus includes a substrate, an integrated circuit positioned on the substrate, and a load plate positioned on the integrated circuit such that the load plate is arranged to absorb heat from the integrated circuit. The load plate includes a body and an extender. The body includes an upper surface and a bottom surface. The bottom surface contacts the integrated circuit such that the bottom surface is between the integrated circuit and the upper surface. A portion of the body extends beyond the integrated circuit. The extender is coupled to the portion of the body such that the extender extends from the bottom surface to define a cavity between the extender and the integrated circuit. The extender defines an aperture aligned with the integrated circuit.

Abstract: An electro-optical device is disclosed. In one aspect, an electro-optical device includes an electrical integrated circuit (EIC) and a photonic integrated circuit (PIC) chiplet bonded face-to-face with the EIC. The PIC chiplet is smaller in size than the EIC. The electro-optical device also includes a fiber array unit (FAU) having an optical fiber optically coupled with the PIC chiplet. Methods of fabricating electro-optical devices are also provided.

Abstract: In one embodiment, an optoelectronic assembly includes at least one grating coupler and at least one edge coupler in contact with and optically coupled to the at least one grating coupler. The optoelectronic assembly may also include a primary photonic integrated circuit (PIC) to secondary PIC interface using the edge coupler and grating coupler, or edge-to-grating optical coupling.

Abstract: An optical system is provided. The optical system includes an optical engine having a photonic integrated circuit (PIC) and an optical lens array, the optical lens array has a lens that is optically aligned with a waveguide in the PIC. The optical system also includes an optical connector optically aligned with the optical lens array to transfer optical signals between the optical connector and the waveguide in the PIC. The optical connector includes a ferrule and an optical fiber mated with the ferrule. The ferrule has a lens aligned with the lens of the optical lens array.

Abstract: The present disclosure describes an optical system and method of operating the optical system. The optical system includes a substrate and first and second photonic integrated circuits. The first photonic integrated circuit is positioned on the substrate. The second photonic integrated circuit is positioned on the first photonic integrated circuit. The second photonic integrated circuit receives a first optical signal that includes a first mode and a second mode. The second photonic integrated circuit includes a polarization splitter rotator, a first demultiplexer, and a second demultiplexer. The polarization splitter rotator separates the first optical signal into a second optical with the first mode and a third optical signal with the first mode. The first and second demultiplexers separate the second and third optical signals into first and second pluralities of optical signals. The first and second pluralities of optical signals couple into the first photonic integrated circuit.

Abstract: In a first embodiment aspect presented in this disclosure, an optical wafer-level (OWL) package includes a frontside electrical redistribution layer (RDL) and a molding compound layer, the OWL package further including at least one of (1) an optical transmitter at least partially embedded within the molding compound layer and electrically coupled to the frontside electrical RDL, the optical transmitter arranged for providing an optically modulated output data signal; or (2) an optical receiver at least partially embedded within the molding compound layer and electrically coupled to the frontside electrical RDL, the optical receiver arranged for receiving an optically modulated input data signal.

Abstract: The fiber array units (FAUs) described herein include an FAU substrate with a coupling surface, an array of V-grooves formed in a FAU substrate, and a plurality of optical channels individually disposed in a respective V-groove of the array of V-grooves. The array of V-grooves and the optical channels are configured to position the optical channels along a curve defined in the coupling surface such that the optical channels are aligned with waveguides in a warped photonic device.

Abstract: An electro-optical device is disclosed. The device includes a glass substrate having a plurality of through-glass vias. The device also includes a photonic integrated circuit hybrid bonded to the glass substrate by way of a metal-to-metal, oxide-to-oxide hybrid bond. The PIC has a plurality of through-silicon vias that are coupled with the through-glass vias. The device also includes an electronic integrated circuit coupled with the photonic integrated circuit. A method of assembling a device, or a plurality of devices, is also disclosed.

Abstract: A device having a hybrid silicon photonic-on-glass substrate is provided. The device includes a glass substrate having a plurality of through-glass vias (TGVs), an oxide layer, and metal contacts coupled with the TGVs. The device also includes a silicon photonic layer having metal pads and an oxide layer. The metal pads are bonded with the metal contacts and the oxide layer of the silicon photonic layer is bonded with the oxide layer of the glass substrate such that the silicon photonic layer is hybrid bonded to the glass substrate by a metal-to-metal, oxide-to-oxide hybrid bond. Methods of assembly are also provided.

Abstract: An optical package with increased mechanical stability of co-packaged optic components is described. The optical package includes an electronic mold compound (EMC) layer with copper pillars formed through the EMC layer. The optical package also includes a silicon interposer layer with through silicon vias (TSVs) and positioned on the EMC layer. A combined thickness of the EMC layer and the silicon interposer layer provide a combined mechanical coupling thickness for a connection component on a smooth diced edge side of the EMC layer and the silicon interposer layer. The optical package also includes devices attached to the silicon interposer layer.

Abstract: Aspects described herein include an apparatus including a socket. The socket includes an array of conductive connections, a frame at least partly circumscribing the array of conductive connections, and a sidewall having an optical receptacle extending therethrough. The optical receptacle is configured to receive an optical connector. The apparatus further includes an optical engine received in the frame into a seated configuration where a photonic integrated circuit of the optical engine is electrically coupled with the array of conductive connections, and is optically coupled with one or more optical fibers of the optical connector.

Abstract: Electro-optical assemblies are disclosed. In one aspect, an electro-optical assembly includes a substrate having a first side and a second side opposing the first side. The electro-optical assembly also includes an optical engine (OE) coupled with the first side of the substrate. The electro-optical assembly further includes a serializer/deserializer (SerDes) coupled with the second side of the substrate, as well as an integrated circuit (IC) coupled with the second side of the substrate. The IC is electrically coupled with the SerDes. The OE is electrically coupled with the SerDes by way of a signal channel that traverses through the substrate between the first side and the second side.

Abstract: The optical devices described herein include a lens arrangement for coupling light between light sources and optical fibers with a reduced size compared to the use of optical waveguides, while also allowing for the use of power sensitive optical components, such as components with lower power density configurations. The lens arrangements include a collimating lens, a focusing lens, and at least one optical component positioned between the collimating lens and the focusing lens.

Abstract: The present disclosure describes various optical systems with an optical connector. An optical system includes an integrated circuit and a connector. The integrated circuit includes a grating coupler array. The connector optically couples a plurality of optical fibers to the grating coupler array. The connector engages the integrated circuit at a first attachment point, a second attachment point, and a third attachment point. The first attachment point, second attachment point, and third attachment point are arranged such that a center of optical signals from the plurality of optical fibers remains substantially aligned with a center of the grating coupler array despite thermal expansion that occurs during operation of the integrated circuit.

Abstract: An optical engine and methods of assembly are disclosed. In one aspect, an optical engine has a lid defining an optical feedthrough configured to fully encircle an optical channel received therein. The optical feedthrough provides an access opening for the optical channel to be fed through so that the optical channel is coupled with a photonic integrated circuit of the optical engine.

Abstract: Heatsinking in laser devices may be improved via a device, including: a header disk having a first face with a circumference; a header post that is thermally conductive, and having: a second face connected to the first face coterminously with the circumference; a third face opposite to the second face; and a fourth face perpendicular to the second face and the third face; a lens holder, having a fifth face connected to the third face; and an optical subassembly connected to the fourth face and optically aligned with the lens holder. The device may also be understood to comprise: a header disk having a circumference; a header post that is thermally conductive, the header post having: an arc coterminous to a portion of the circumference; a mounting face, perpendicular to a plane in which the arc and the circumference are defined; and a bonding face perpendicular to the mounting face.

Abstract: An optical system is provided. The optical system includes an optical engine having a photonic integrated circuit (PIC) and an optical lens array, the optical lens array has a lens that is optically aligned with a waveguide in the PIC. The optical system also includes an optical connector optically aligned with the optical lens array to transfer optical signals between the optical connector and the waveguide in the PIC. The optical connector includes a ferrule and an optical fiber mated with the ferrule. The ferrule has a lens aligned with the lens of the optical lens array.

Abstract: An optical connector is provided. The optical connector includes an optical fiber and a ferrule mated with the optical fiber. The ferrule has a lens spaced from an end of the optical fiber. The lens is configured to focus an optical signal received from the optical fiber to converge to a beam waist before diverging thereafter.

Abstract: The present disclosure describes an optical system and method of operating the optical system. The optical system includes a substrate and first and second photonic integrated circuits. The first photonic integrated circuit is positioned on the substrate. The second photonic integrated circuit is positioned on the first photonic integrated circuit. The second photonic integrated circuit receives a first optical signal that includes a first mode and a second mode. The second photonic integrated circuit includes a polarization splitter rotator, a first demultiplexer, and a second demultiplexer. The polarization splitter rotator separates the first optical signal into a second optical with the first mode and a third optical signal with the first mode. The first and second demultiplexers separate the second and third optical signals into first and second pluralities of optical signals. The first and second pluralities of optical signals couple into the first photonic integrated circuit.

Abstract: An apparatus includes a substrate, an integrated circuit positioned on the substrate, and a load plate positioned on the integrated circuit such that the load plate is arranged to absorb heat from the integrated circuit. The load plate includes a body and an extender. The body includes an upper surface and a bottom surface. The bottom surface contacts the integrated circuit such that the bottom surface is between the integrated circuit and the upper surface. A portion of the body extends beyond the integrated circuit. The extender is coupled to the portion of the body such that the extender extends from the bottom surface to define a cavity between the extender and the integrated circuit. The extender defines an aperture aligned with the integrated circuit.