Patents by Inventor Norbert Sickmann

Norbert Sickmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and device for polishing semiconductor wafers
    Patent number: 5980361
    Abstract: A method is for the polishing of semiconductor wafers, which are mounted on a front side of a support plate and one side face of which is pressed anst a polishing plate, which is covered with a polishing cloth, with a specific polishing pressure and polished. A device is provided which is suitable for carrying out the method. The method includes a) applying a specific pressure to at least one of a plurality of pressure chambers prior to the polishing of the semiconductor wafers, and b) during the polishing of the semiconductor wafers, transmitting the polishing pressure to a rear side of the support plate via elastic bearing surfaces of the pressure chambers to which pressure has been applied.
    Type: Grant
    Filed: December 9, 1997
    Date of Patent: November 9, 1999
    Assignee: Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
    Inventors: Paul Muller, Thomas Buschhardt, Heinrich Hennhofer, Norbert Sickmann, Rainer Neumann, Franz Mangs, Manfred Thurner, Klaus Rottger