Abstract: An evaporation source for a metal or a metal alloy is described. The evaporation source includes an evaporation crucible, wherein the evaporation crucible is configured to evaporate the metal or metal alloy, a distribution pipe with one or more outlets provided along the length of the distribution pipe, wherein the distribution pipe is in fluid communication with the evaporation crucible, wherein the distribution pipe further comprises a first outer tube and a first inner tube, and wherein the distribution pipe and the evaporation crucible are provided as one single piece.

Abstract: According to the present disclosure, a semiconductor substrate handling systems and substrate carrier is provided. The substrate carrier for holding a substrate to be processed and for transporting the substrate in or through a processing area with a transport device includes a main portion for holding the substrate; a first end portion adapted to be supported by the transport device; and at least one first intermediate portion connecting the main portion with the first end portion. The at least one first intermediate portion includes one or more cut-outs adapted to reduce thermal energy transfer between the main portion and the first end portion.