Abstract: A memory module includes at least one memory chip arranged on the memory module. Information about the memory module and/or the at least one memory chip arranged on the memory module can be stored directly on the memory chip, making use of a suited element, fuses or flip-flops, for example. A memory chip contains such an element for containing information relating to the memory chip and/or a memory module with which the memory chip is compatible, wherein the information containing element can be read out by means of an external processor.

Abstract: The present invention provides an apparatus for signaling that a predetermined time value has elapsed, having a device for acquiring and storing the amplitude value of a clock signal at an acquisition instant in the temporal profile of the clock signal. A device is provided for continuously comparing the acquired and stored amplitude value of the clock signal with an instantaneous amplitude value of the clock signal and for outputting a comparison signal which has a first logic state if the instantaneous amplitude value of the clock signal is less than the stored amplitude value and has a second logic state if the instantaneous amplitude value of the clock signal is greater than the stored amplitude value.

Abstract: The invention relates to a method and a device (1, 11, 21) for detecting the overheating of a semiconductor device, comprising a temperature measuring means (3, 13, 23) that changes its electrical conductivity when the temperature of the semiconductor device changes.

Abstract: A method includes providing a semiconductor memory device having at least one memory cell array. The memory cell array has a multiplicity of memory cells arranged in a matrix-like manner. Each of the memory cells is assigned a physical address and an electrical address. The method also includes inputting a physical address of a memory cell that is to be addressed into an address input device of the semiconductor memory device, decoding the input physical address into the assigned electrical address of the memory cell to be addressed by an address decoder device of the semiconductor memory device, and outputting the electrical address to the memory cell array in order to address the memory cell.

Abstract: A configuration for identifying contact faults during the testing of integrated circuits with a multiplicity of pins which protrude from a housing and are connected to respective pads on a semiconductor body of the integrated circuit. Pull-up or pull-down devices are connected between respective pads and input buffers and in each case hold the pads at a high or low potential by impressing a holding current, if contact has not been made with a pin associated with the pad during testing, the result being that activation of the circuit section connected to the pin is avoided.

Abstract: An electronic circuit in an integrated circuit having memory cells is described. The circuit permits information to be written to particular memory cells only once, so that subsequent writing to the particular memory cells is blocked. The circuit is used in a test structure for integrated circuits on a wafer. A method for testing integrated circuits on a wafer that are connected to a test apparatus is also described. Once the supply voltage to a first circuit to be tested has been turned on, a preliminary test is carried out to ascertain parameters that need to be set. The supply voltage is then applied to a next circuit to be tested, a preliminary test is carried out, and memory cells have information written to them, until the parameters have been set for all the connected circuits to be tested. The test apparatus then carries out the actual operational test in parallel for all the connected circuits to be tested.

Abstract: An integrated memory circuit has first and second storage capacitors, addressed via first and second word lines and first and second bit lines, respectively. The first and second word lines are connected to an address decoder circuit, and the first and second bit lines are connected to a read/write amplifier. The address decoder circuit activates the first and second word lines during a write operation, so that, during the writing of a datum, the read/write amplifier writes the datum to the first memory cell and a complementary datum to the second memory cell. The address decoder circuit activates the first and second word lines during a read operation, so that the charge of the first memory cell flows onto the first bit line and the charge of the second memory cell flows onto the second bit line, the datum to be read out corresponding to the sign of the charge difference.

Abstract: A memory module includes at least one memory chip arranged on the memory module. Information about the memory module and/or the at least one memory chip arranged on the memory module can be stored directly on the memory chip, making use of a suited element, fuses or flip-flops, for example. A memory chip contains such an element for containing information relating to the memory chip and/or a memory module with which the memory chip is compatible, wherein the information containing element can be read out by means of an external processor.

Abstract: A circuit configuration and a method for the synchronization of signals include transmitting signals in parallel through data lines and buffer-storing the signals in a synchronizing unit. A clock signal is determined from the signals of a data line and is used for synchronizing the outputting of the signals. The signals are output in the order in which the signals were read. The signals are likewise output through a plurality of data lines, the signals being output temporally synchronously. Propagation time differences are compensated due to the buffer-storage. Moreover, the clock signal is determined from the signals themselves. Consequently, the use of an additional clock signal is not necessary.

Abstract: Apparatus for signaling that a predetermined time value has elapsed.

Abstract: The invention relates to a semiconductor memory device having

Abstract: The invention relates to a semiconductor module for a burn-in test configuration. The semiconductor module has a regulator which, when it is turned on, always supplies a constant low voltage to an internal circuit of the semiconductor module. The semiconductor module also contains a component which, when the burn-in voltage has been applied for a defined time period, supplies a different characteristic than when the internal voltage is applied.

Abstract: An input circuit for an integrated memory is described. The input circuit for the integrated memory has a signal input line, a memory element, and a clock recovery unit with which a clock signal is generated from the input signal on the signal input line so that the input signal can be read into the memory element using the clock signal which is generated. A further input circuit is described which contains an oscillator. The oscillator generates a clock signal that can be synchronized with the input signal, it being possible to read the input signal into the memory element using the clock signal which is generated.

Abstract: A circuit configuration and a method for the synchronization of signals include transmitting signals in parallel through data lines and buffer-storing the signals in a synchronizing unit. A clock signal is determined from the signals of a data line and is used for synchronizing the outputting of the signals. The signals are output in the order in which the signals were read. The signals are likewise output through a plurality of data lines, the signals being output temporally synchronously. Propagation time differences are compensated due to the buffer-storage. Moreover, the clock signal is determined from the signals themselves. Consequently, the use of an additional clock signal is not necessary.

Abstract: An electronic circuit in an integrated circuit having memory cells is described. The circuit permits information to be written to particular memory cells only once, so that subsequent writing to the particular memory cells is blocked. The circuit is used in a test structure for integrated circuits on a wafer. A method for testing integrated circuits on a wafer that are connected to a test apparatus is also described. Once the supply voltage to a first circuit to be tested has been turned on, a preliminary test is carried out to ascertain parameters that need to be set. The supply voltage is then applied to a next circuit to be tested, a preliminary test is carried out, and memory cells have information written to them, until the parameters have been set for all the connected circuits to be tested. The test apparatus then carries out the actual operational test in parallel for all the connected circuits to be tested.

Abstract: The device for generating digital signal levels can be used for signals of various logic standards. A voltage terminal for feeding an external reference voltage is provided as well as an internal voltage generator. An internal reference voltage of the voltage generator can be selectively connected to the device via a switch. The switch is actuated by a level converter. Coupling elements prevent faults caused by the supply voltage.

Abstract: The fuse refresh circuit for semiconductor memories has a set circuit for setting a fuse latch circuit. The fuse latch circuit is set by the set circuit in at least one refresh cycle after a voltage supply has been switched on. During the refresh cycle of the fuse latch circuit, the latter is driven with pulses in such a way that the state of the fuse latch circuit is evaluated and only an incorrectly set fuse latch circuit is set to be correct.

Abstract: An integrated semiconductor memory configuration includes a memory region having a plurality of segments. Each of the memory region segments have a plurality of read amplifiers and bit lines. Each two of the bit lines are connected to a respective one of the read amplifiers. A plurality of parallel data lines lead to the memory region. Each of the data lines have an end oriented toward and another end oriented away from a respective one of the memory region segments. Each of a plurality of read/write amplifier switches is disposed at one of the ends of the respective data lines. Each of a plurality of selector switches connects the read/write amplifier switch disposed on the end of a respective one of the data lines oriented toward the memory region segment to a respective one of the read amplifiers of the memory region segment.

Abstract: An integrated semiconductor memory array includes a memory region, a writing buffer memory associated with the memory region, a writing pointer and an input buffer associated with the writing buffer memory, a reading buffer memory associated with the memory region, a reading pointer and an output buffer associated with the reading buffer memory, and a control device being formed of a memory control circuit and a data flow control circuit. A reading column address decoder controlling the reading pointer is associated with the reading buffer memory. A reading address control unit is connected to the reading column address decoder, and a reading address register is connected to the reading address control unit. A writing column address decoder controlling the writing pointer is associated with the writing buffer memory. A writing address control unit is connected to the writing column address decoder, and a writing address register is connected to the writing address control unit.