Patents by Inventor Norein Narendra Patel

Norein Narendra Patel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Monitoring wafer temperature during thermal processing of wafers by measuring sheet resistance of a test wafer
    Patent number: 6033922
    Abstract: A method for monitoring the temperature of a product wafer during thermal processing of the product wafer in an emissivity independent thermal processing system includes processing a test wafer in the emissivity independent thermal processing system that thermally processes the product wafer. The test wafer is pretreated before being thus placed in the thermal processing system. The test wafer is thermally processed following a substantially same thermal processing recipe as that used for thermal processing of the product wafers. After the thermal processing of the test wafer, a sheet resistance of the test wafer is measured. This sheet resistance is correlated to a wafer temperature at the test wafer that was achieved during the thermal processing of the test wafer.
    Type: Grant
    Filed: July 28, 1999
    Date of Patent: March 7, 2000
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Daniel V. Rowland, Robert A. Huertas, Norein (Narendra) Patel
  • Monitoring wafer temperature during thermal processing of wafers by measuring sheet resistance of a test wafer
    Patent number: 5970313
    Abstract: A method for monitoring the temperature of a product wafer during thermal processing of the product wafer in an emissivity independent thermal processing system includes processing a test wafer in the emissivity independent thermal processing system that thermally processes the product wafer. The test wafer is pretreated before being thus placed in the thermal processing system. The test wafer is thermally processed following a substantially same thermal processing recipe as that used for thermal processing of the product wafers. After the thermal processing of the test wafer, a sheet resistance of the test wafer is measured. This sheet resistance is correlated to a wafer temperature at the test wafer that was achieved during the thermal processing of the test wafer.
    Type: Grant
    Filed: December 19, 1997
    Date of Patent: October 19, 1999
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Daniel V. Rowland, Robert A. Huertas, Norein Narendra Patel