Patents by Inventor Nori Yoshihara
Nori Yoshihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6811862Abstract: The present invention provides a resin composition for a slide fastener. In one embodiment, upon setting, the resin composition does not melt even upon contact with a hot surface. In addition, the fastener provides low sliding resistance or friction, as well as durability and structural strength to withstand repeated opening and closing operations. Finally, the fastener can be dyed with cloth in the same bath.Type: GrantFiled: October 11, 2002Date of Patent: November 2, 2004Assignee: Toyo Boseki Kabushiki KaishaInventors: Nori Yoshihara, Akira Taniguchi
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Patent number: 6800685Abstract: The present invention provides a polyester resin composition for engine peripheral parts, the resin composition comprising at least one polymer selected from the group consisting of polyethylene terephthalate and an ethylene terephthalate copolymer; an inorganic reinforcement material; and an olefin polymer, wherein a molded article produced from the resin composition has a flexural strain at break of 3.5% or higher and a deflection temperature under load of 180° C. or higher.Type: GrantFiled: June 9, 2000Date of Patent: October 5, 2004Assignees: Toyo Boseki Kabushiki Kaisha, Toyoda Gosei Co., Ltd.Inventors: Nori Yoshihara, Satoshi Kosugi, Kenjiro Ogami, Hidehiro Nakamura, Yutaka Ogasawara, Masahiro Ogata, Satoru Watanabe, Junji Koizumi
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Patent number: 6780940Abstract: The present invention relates to an adhesive resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic, the thermoplastic resin (B) having a melting point ranging from 90° C. to 200° C. The present invention also relates to a method for separating a bonded article into adherends, the method comprising detaching by induction heating the bonded portions of adherends bonded together by the thermoplastic resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic substance and has a melting point ranging from 90° C. to 200° C.Type: GrantFiled: September 25, 2001Date of Patent: August 24, 2004Assignee: Toyo Boseki Kabushiki KaishaInventors: Nori Yoshihara, Kenji Ohama, Satoshi Sakai, Hitoshi Kosugi, Koji Nakanishi
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Patent number: 6706136Abstract: A resin composition for high-frequency bonding with a dielectric loss tangent of 0.03 or higher at a frequency of 40 MHz, containing a thermoplastic resin having a melting point of 80° C. to 200° C. in an amount of 70% to 99% by volume, based on the total volume of the composition, and a conductive material having a volume resistivity of 10−2 &OHgr;.cm or lower in an amount of 30% to 1% by volume, based on the total volume of the composition.Type: GrantFiled: October 11, 2002Date of Patent: March 16, 2004Assignee: Toyo Boseki Kabushiki KaishaInventors: Nori Yoshihara, Akira Taniguchi
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Patent number: 6629769Abstract: A light-reflecting molded article is constituted of a molded article made from a polyester resin composition and a light-reflecting metal layer formed on the molded article. The light-reflecting molded article has an average surface roughness of at most 0.3 &mgr;m and a deflection temperature under load of at least 160° C. The polyester resin composition includes 100 parts by weight of polybutylene terephthalate resin and 1 to 100 parts by weight of polyalkylene naphthalate resin.Type: GrantFiled: December 13, 2001Date of Patent: October 7, 2003Assignee: Toyo Boseki Kabushiki KaishaInventors: Satoshi Kosugi, Nori Yoshihara, Koji Nakanishi
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Publication number: 20030152762Abstract: The present invention provides a resin composition for a slide fastener. In one embodiment, upon setting, the resin composition does not melt even upon contact with a hot surface. In addition, the fastener provides low sliding resistance or friction, as well as durability and structural strength to withstand repeated opening and closing operations. Finally, the fastener can be dyed with cloth in the same bath.Type: ApplicationFiled: October 11, 2002Publication date: August 14, 2003Inventors: Nori Yoshihara, Akira Taniguchi
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Publication number: 20030109658Abstract: A resin composition for high-frequency bonding with a dielectric loss tangent of 0.03 or higher at a frequency of 40 MHz, containing a thermoplastic resin having a melting point of 80° C. to 200° C. in an amount of 70% to 99% by volume, based on the total volume of the composition, and a conductive material having a volume resistivity of 10−2 &OHgr;.cm or lower in an amount of 30% to 1% by volume, based on the total volume of the composition.Type: ApplicationFiled: October 11, 2002Publication date: June 12, 2003Applicant: Toyo Boseki Kabushiki KaishaInventors: Nori Yoshihara, Akira Taniguchi
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Publication number: 20020075686Abstract: A light-reflecting molded article is constituted of a molded article made from a polyester resin composition and a light-reflecting metal layer formed on the molded article. The light-reflecting molded article has an average surface roughness of at most 0.3 &mgr;m and a deflection temperature under load of at least 160° C. The polyester resin composition includes 100 parts by weight of polybutylene terephthalate resin and 1 to 100 parts by weight of polyalkylene naphthalate resin.Type: ApplicationFiled: December 13, 2001Publication date: June 20, 2002Applicant: Toyo Boseki Kabusiki KaisyaInventors: Satoshi Kosugi, Nori Yoshihara, Koji Nakanishi
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Publication number: 20020061968Abstract: The present invention relates to an adhesive resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic, the thermoplastic resin (B) having a melting point ranging from 90° C. to 200° C. The present invention also relates to a method for separating a bonded article into adherends, the method comprising detaching by induction heating the bonded portions of adherends bonded together by the thermoplastic resin composition comprising a heat-generating material (A) which generates heat when subjected to high frequency induction and a thermoplastic resin (B) modified with a monomer having a functional group which reacts with an inorganic substance and has a melting point ranging from 90° C. to 200° C.Type: ApplicationFiled: September 25, 2001Publication date: May 23, 2002Applicant: TOYO BOSEKI KABUSHIKI KAISHAInventors: Nori Yoshihara, Kenji Ohama, Satoshi Sakai, Hitoshi Kosugi, Koji Nakanishi
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Patent number: 5583177Abstract: There is disclosed a polyamide resin composition containing: (A) 85 to 95 parts by weight of a polyamide resin; (B) 5 to 15 parts by weight of wollastonite; (C) 3 to 10 parts by weight, to 100 parts by the total weight of ingredients (A) and (B), of a styrene copolymer modified with at least one modifier selected from the group consisting of unsaturated carboxylic acids and unsaturated dicarboxylic anhydrides; and (D) 0.5 to 5 parts by weight, to 100 parts by the total weight of ingredients (A) and (B), of a high-density polyethylene modified with at least one modifier selected from the group consisting of unsaturated carboxylic acids and unsaturated dicarboxylic anhydrides, the high-density polyethylene having a weight-average molecular weight of 50,000 to 400,000.Type: GrantFiled: June 10, 1994Date of Patent: December 10, 1996Assignees: Toyo Boseki Kabushiki Kaisha, Aisin Seiki Kabushiki KaishaInventors: Koji Kinoshita, Nori Yoshihara, Minoru Hayashi, Kiyotaka Nakai
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Patent number: 5399605Abstract: There is disclosed a polyester resin composition comprising: (a) 50 to 70 parts by weight of a polyester resin composed mainly of a repeating unit of butylene terephthalate; (b) 30 to 50 parts by weight of a polyester resin composed mainly of a repeating unit of ethylene terephthalate; (c) 0.1 to 10 parts by weight of a polyalkylene glycol derivative having at least one end group of carboxylate and alkyl ether, per 100 parts by the total weight of the polyester resins (a) and (b); and if necessary or required, (d) not more than 120 parts by weight of an inorganic reinforcing agent, per 100 parts by the total weight of the polyester resins (a) and (b).Type: GrantFiled: July 12, 1993Date of Patent: March 21, 1995Assignee: Toyo Boseki Kabushiki KaishaInventors: Nori Yoshihara, Yukio Gotoh
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Patent number: 4795771Abstract: A polyester composition wich comprises(a) 100 parts by weight of a polyester containing at least 80 mol % of ethylene terephthalate repeating unit,(b) 1 to 15 parts by weight of a carboxylic acid ester of a polyalkylene glycol or its derivative,(c) 0.01 to 10 parts by weight of an epoxy compound having a polyoxyalkylene chain, and(d) 0.1 to 50 parts by weight of an inorganic filler.Type: GrantFiled: February 24, 1987Date of Patent: January 3, 1989Assignee: Toyo Boseki Kabushiki KaishaInventor: Nori Yoshihara
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Patent number: 4215032Abstract: The present application provides a polyester composition composed of polyethylene terephthalate or a polyester containing at least 80 mol % of ethylene terephthalate repeating units and 0.1 to 15 weight %, based on the polyester, of an organic crystallization promoting agent having a polyoxyalkylene chain and at least one epoxy group. The latter promoting agents are represented by such materials as a glycidyl ether of a polyalkylene glycol having a molecular weight less than 5000. Such crystallization promoting agents serve to prevent streaks and pock marks on the surface of articles molded from such polyester compositions.Type: GrantFiled: May 9, 1979Date of Patent: July 29, 1980Assignee: Toyo Boseki Kabushiki KaishaInventors: Shigeo Kobayashi, Nori Yoshihara, Kiyoji Nanbu, Yukio Goto