Abstract: A one-part curing composition comprising a compound (a) having two or more structural groups, per molecule, expressed by the general formula: ##STR1## wherein R.sup.1, R.sup.2, and R.sup.3 are groups selected from an alkyl group having 1 to 6 carbon atoms, a phenyl group, and a chloromethyl group, and a polymer (b) having two or more isocyanate groups per molecule, has a good stability in storage under conditions which exclude moisture and humidity, and which further cures in the presence of humidity. This composition does not foam under high temperatures and humidities and has a good heat resistance.

Abstract: Disclosed is a one-pack curing type composition having an excellent storage stability and rapid curing property after application. The composition comprises a polymer having in the molecule at least two structures represented by the formula: ##STR1## wherein R.sup.1, R.sup.2 and R.sup.3 independently represent a group selected from an alkyl group having 1 to 6 carbon atoms, a phenyl group and a chloromethyl group, and an oxidizing agent.

Abstract: Permselective membranes are prepared from novel synthetic organic aromatic or alicyclic polyamides or polyhydrazides of the formula ##EQU1## The membranes are useful in separating components of fluid mixtures or solutions such as water containing dissolved salts or lactam.

Abstract: A process is provided for manufacturing heat resistant polymeric film. A concentrated polymer composition containing solvent is provided, which composition is a solid at room temperature. The composition comprises (a) a polymer having in the repeating units thereof a member selected from the group consisting of precursor units which on heat curing form heterocyclic rings, and a mixture of said precursor units and heterocyclic rings formed from said precursor units and (b) 25-130% by weight of an organic solvent for said polymer, the composition being a solid at room temperature.According to the process, the solid composition is heated to a temperature above room temperature and is extruded into film at this high temperature to form film at a temperature above room temperature and below the curing temperature of the polymer.