Abstract: The present invention provides a process for simply and easily producing fine metal particles or fine metal oxide particles in the form of a dry powder which can be used as extremely fine particles in a good dispersion state without causing coagulation for a long time even if not stored in a dispersion solvent.

Abstract: According to the present invention, a metal nanoparticle dispersion suitable to multiple layered coating by jetting in the form of fine droplets is prepared by dispersing metal nanoparticles having an average particle size of 1 to 100 nm in a dispersion solvent having a boiling point of 80° C. or higher in such a manner that the volume percentage of the dispersion solvent is selected in the range of 55 to 80% by volume and the fluid viscosity (20° C.) of the dispersion is chosen in the range of 2 mPa·s to 30 mPa·s, and then when the dispersion is discharged in the form of fine droplets by inkjet method or the like, the dispersion is concentrated by evaporation of the dispersion solvent in the droplets in the course of flight, coming to be a viscous dispersion which can be applicable to multi-layered coating.

Abstract: The present invention provides a process for simply and easily producing fine metal particles or fine metal oxide particles in the form of a dry powder which can be used as extremely fine particles in a good dispersion state without causing coagulation for a long time even if not stored in a dispersion solvent.

Abstract: The present invention provides a process for simply and easily producing fine metal particles or fine metal oxide particles in the form of a dry powder which can be used as extremely fine particles in a good dispersion state without causing coagulation for a long time even if not stored in a dispersion solvent.

Abstract: A method of preparing substrates, including the steps of depositing metal particulates into a pillar form at a prescribed position of a substrate (1) by the use of a fine inkjet method, and then sintering the resultant to form a metal pillar (2).

Abstract: The present invention provides a conductive metal paste, available for fabrication of a metal fine particle sintered product layer, which has excellent adhesion to a surface of an underlying substrate such as a glass substrate and also has good conductivity. The conductive metal paste according to the present invention contains, per 100 parts by mass of the metal fine particles whose average particle size is 1 to 100 nm, 10 to 60 parts by mass in total of one or more compounds which are used in a coating molecular layer on a surface of a metal fine particle and which have a group capable of coordinate bonding to a metal element contained in the metal fine particles via a lone pair held by a nitrogen, oxygen, or sulfur atom, and also contains one or more metal compounds which are reduced by heating up to 250° C. or higher to be able to precipitate a metal atom such that a total amount of metals contained in the metal compound is within a range from 0.

Abstract: The present invention provides a process for forming a copper fine particle sintered product type of a fine-shaped electric conductor showing superior electroconductivity, which comprises steps of drawing a fine pattern with the use of a dispersion containing the copper fine particles having a surface oxide film layer, conducting a treatment for reducing the copper fine particles with the surface oxide film layer or copper oxide fine particles included in the pattern at a comparatively low temperature, and baking the resultant copper fine particles. Specifically, the process carries out the processes of; applying a dispersion containing the copper fine particles having the surface oxide film layer thereon or the copper oxide fine particles with an average particle diameter of 10 ?m or smaller onto a substrate; and then performing a series of the heat treatment steps of heating the particles in the coated layer at temperature of 350° C.

Abstract: The present invention provides a conductive metal paste, available for fabrication of a metal fine particle sintered product layer, which has excellent adhesion to a surface of an underlying substrate such as a glass substrate and also has good conductivity. The conductive metal paste according to the present invention contains, per 100 parts by mass of the metal fine particles whose average particle size is 1 to 100 nm, 10 to 60 parts by mass in total of one or more compounds which are used in a coating molecular layer on a surface of a metal fine particle and which have a group capable of coordinate bonding to a metal element contained in the metal fine particles via a lone pair held by a nitrogen, oxygen, or sulfur atom, and also contains one or more metal compounds which are reduced by heating up to 250° C. or higher to be able to precipitate a metal atom such that a total amount of metals contained in the metal compound is within a range from 0.

Abstract: The present invention provides a dispersion usable for forming an electroconductive layer having an extremely fine pattern and a high thickness/minimum width ratio in the cross-section, and which has a high fluidity enabling application of inkjet to draw a fine pattern at high accuracy and contains only metal nanoparticles as a conductive medium. According to the present invention, a metal nanoparticle dispersion suitable to multiple layered coating by jetting in the form of fine droplets is prepared by dispersing metal nanoparticles having an average particle size of 1 to 100 nm in a dispersion solvent having a boiling point of 80° C. or higher in such a manner that the volume percentage of the dispersion solvent is selected in the range of 55 to 80% by volume and the fluid viscosity (20° C.

Abstract: The present invention provides a process for simply and easily producing fine metal particles or fine metal oxide particles in the form of a dry powder which can be used as extremely fine particles in a good dispersion state without causing coagulation for a long time even if not stored in a dispersion solvent.

Abstract: A method of preparing substrates, including the steps of depositing metal particulates into a pillar form at a prescribed position of a substrate (1) by the use of a fine inkjet method, and then sintering the resultant to form a metal pillar (2).

Abstract: The present invention provides a process for forming a copper fine particle sintered product type of a fine-shaped electric conductor showing superior electroconductivity, which comprises steps of drawing a fine pattern with the use of a dispersion containing the copper fine particles having a surface oxide film layer, conducting a treatment for reducing the copper fine particles with the surface oxide film layer or copper oxide fine particles included in the pattern at a comparatively low temperature, and baking the resultant copper fine particles. Specifically, the process carries out the processes of; applying a dispersion containing the copper fine particles having the surface oxide film layer thereon or the copper oxide fine particles with an average particle diameter of 10 ?m or smaller onto a substrate; and then performing a series of the heat treatment steps of heating the particles in the coated layer at temperature of 350° C.

Abstract: The present invention provides a stabilizer comprising a substituted cyclohexene compound of a hindered piperidine type wherein the 1- and 2-positions on a cyclohexene ring are doubly bonded, a carbon atom situated at the 4-position and/or the 5-position of the cyclohexene ring contains a substituent having a C.dbd.O group at its alpha-position, at least one carbon atom of the cyclohexene ring located adjacent to said carbon atom having the C.dbd.O group has a hydrogen atom as a substituent, and at least one group containing a 2,2,6,6-tetramethyl-4-piperidyl group attached to the 3-, 4-, 5- or 6-position of the cyclohexene ring; and/or other substituted cyclohexene compound of a hindered piperidine and/or a compound of a hindered piperidine. The stabilizers of the present invention can exhibit improved properties in light stability and in bleed out resistance even without a phenol type antioxidant.