Patents by Inventor Noriaki KAMEKAWA

Noriaki KAMEKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND APPARATUS FOR LIQUID TREATMENT OF WAFER SHAPED ARTICLES
    Publication number: 20140041803
    Abstract: In an apparatus and method for treating a wafer-shaped article, a rotary chuck is configured to hold a wafer-shaped article of a predetermined diameter such that a surface of the wafer-shaped article facing the rotary chuck is spaced from an opposing peripheral surface of the rotary chuck. The opposing peripheral surface comprises a first surface overlapping an outer peripheral edge of a wafer-shaped article when positioned on the spin chuck and a second surface positioned radially inwardly of the first surface and meeting the first surface at an interface that is radially inward of and substantially concentric with a wafer-shaped article when positioned on the rotary chuck. The second surface is substantially more hydrophobic than the first surface.
    Type: Application
    Filed: August 8, 2012
    Publication date: February 13, 2014
    Applicant: LAM RESEARCH AG
    Inventors: Takehito KOSHIZAWA, Noriaki KAMEKAWA, Kei KINOSHITA, Michael PUGGL