Abstract: A resin-sealing mold for sealing a semiconductor element with resin includes an upper die (12), a lower die (14) disposed so as to be opposed to the upper die (12), and a plurality of middle dies (13a, 13b) sandwiched between the upper die (12) and the lower die (14), wherein the plurality of middle dies (13a, 13b) are provided with molding faces at tip ends and are placed so that the molding faces are opposed to each other during the sealing. Because of this, the middle dies (13a, 13b) can be opened to the right and left from dividing faces I, and even a resin package of a semiconductor device with a concave part formed in a side surface can be molded.

Abstract: A light-emitting diode 1 according to the present invention includes: a semiconductor light-emitting device 4 mounted on the surface of lead frames 2 and 3; and a transparent resin package 5 covering the front side of the semiconductor light-emitting device 4. A convex lens portion 8 for concentrating light emitted from the semiconductor light-emitting device 4 toward the front is provided in a surface part of the resin package 5. A circular flat portion 11 for diffusing light emitted from the semiconductor light-emitting device 4 toward the sides is provided in a part of the convex lens portion 8 intersecting the optical axis of the convex lens portion 8. Part of the convex lens portion 8 surrounding the circular flat portion 11 is a convex-lens side face. A recess 7 whose side wall is partly the convex-lens side face is provided to surround the convex lens portion.

Abstract: A resin-sealing mold for sealing a semiconductor element with resin includes an upper die (12), a lower die (14) disposed so as to be opposed to the upper die (12), and a plurality of middle dies (13a, 13b) sandwiched between the upper die (12) and the lower die (14), wherein the plurality of middle dies (13a, 13b) are provided with molding faces at tip ends and are placed so that the molding faces are opposed to each other during the sealing. Because of this, the middle dies (13a, 13b) can be opened to the right and left from dividing faces I, and even a resin package of a semiconductor device with a concave part formed in a side surface can be molded.

Abstract: A light-emitting diode 1 according to the present invention includes: a semiconductor light-emitting device 4 mounted on the surface of lead frames 2 and 3; and a transparent resin package 5 covering the front side of the semiconductor light-emitting device 4. A convex lens portion 8 for concentrating light emitted from the semiconductor light-emitting device 4 toward the front is provided in a surface part of the resin package 5. A circular flat portion 11 for diffusing light emitted from the semiconductor light-emitting device 4 toward the sides is provided in a part of the convex lens portion 8 intersecting the optical axis of the convex lens portion 8. Part of the convex lens portion 8 surrounding the circular flat portion 11 is a convex-lens side face. A recess 7 whose side wall is partly the convex-lens side face is provided to surround the convex lens portion.