Abstract: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anistropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.

Abstract: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.

Abstract: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.

Abstract: A flexible flat cable is provided. The FFC comprises multiple conductors with widths of 0.3(±0.03)mm arranged in a parallel manner with a pitch of 0.5 (±0.05)mm, the first insular material and the second insular material sandwiching these conductors from both sides, shield material, and the reinforcement board. The first insular material is porous PET possessing a 34 ?m thick porous layer and the shield material is a polymer-based shield material possessing a shield layer made of a polymer-based conductive layer equal to or less than 20 ?m thick that is a prescribed resin formed including air with uniformly dispersed conductive particles. Due to this, the FFC maintains the shield effect without damaging the electrical characteristics and also, along with being compatible with existing connecters, can combine with the electrical traits by existing processes and furthermore is capable of being established with any number of wires, any length of cable, and any alignment of wiring.

Abstract: A process for preparing 3,6-dichloropyridazine-1-oxide which comprises reacting 3,6-dichloropyridazine with an acid anhydride and hydrogen peroxide of a concentration of 60% or less or a urea hydrogen peroxide addition compound.

Abstract: The FFC (50) comprises multiple conductors (51) with widths of 0.3 (±0.03)mm arranged in a parallel manner with a pitch of 0.5 (±0.05)mm, the first insular material (52) and the second insular material (53) sandwiching these conductors (51) from both sides, shield material (54), and the reinforcement board (55). The first insular material (52) is porous PET possessing a 34 ?m thick porous layer (62) and the shield material (54) is a polymer-based shield material possessing a shield layer made of a polymer-based conductive layer (69) equal to or less than 20 ?m thick that is a prescribed resin formed including air with uniformly dispersed conductive particles. Due to this, the FFC (50) maintains the shield effect without damaging the electrical characteristics and also, along with being compatible with existing connecters, can combine with the electrical traits by existing processes and furthermore is capable of being established with any number of wires, any length of cable, and any alignment of wiring.

Abstract: A polyamic acid varnish composition, which is composed of a polyamic acid obtained by the addition polymerization of an diamine and an aromatic acid dianhydride, contains as an additive a specific imidazolyl-diaminoazine.

Abstract: A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×102 mPa·s or more and 1.0×105 mPa·s or less.

Abstract: A polyamic acid varnish composition, which is composed of a polyamic acid obtained by the addition polymerization of an diamine and an aromatic acid dianhydride, contains as an additive a specific imidazolyl-diaminoazine.

Abstract: A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm2, and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on the zinc-based metallic layer.

Abstract: A polyamic acid varnish composition, which is composed of a polyamic acid obtained by the addition polymerization of an diamine and an aromatic acid dianhydride, contains as an additive a specific imidazolyl-diaminoazine.

Abstract: A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm2, and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on the zinc-based metallic layer.

Abstract: A flexible printed substrate is constituted of metallic foil and provided thereon a polyimide layer which is produced by forming a film of a polyamic acid varnish on the metallic foil, followed by imidating. The polyimide layer has a linear expansion coefficient of 10×10−6 to 30×10−6 (1/K) and a softening point not more than the imidation temperature.

Abstract: A flexible printed circuit board that is intended to minimize curling is formed having a first polyimide-resin layer with a conductor pattern formed on one surface thereof and supporting that conductor pattern. A second polyimide-resin is formed on another surface of the conductor pattern and covers and protects the circuit of the conductor pattern. The polyimide-resin layers are chosen so that a difference between a coefficient of linear thermal expansion of the first polyimide-resin layer and the coefficient of linear thermal expansion of the second polyimide-resin layer is 3×10−6/K or smaller.

Abstract: A polyamic acid varnish composition, which is composed of a polyamic acid obtained by the addition polymerization of an diamine and an aromatic acid dianhydride, contains as an additive a specific imidazolyl-diaminoazine.

Abstract: A flexible printed substrate is constituted of metallic foil and provided thereon a polyimide layer which is produced by forming a film of a polyamic acid varnish on the metallic foil, followed by imidating. The polyimide layer has a linear expansion coefficient of 10×10−6 to 30×10−6 (1/K) and a softening point not more than the imidation temperature.

Abstract: The present invention aims to obtain a flexible printed wiring board with good flatness. According to the present invention, a copper-clad film 3 is formed by applying a polyamic acid solution on one surface of a copper foil 2 and thermally contracting the polyamic acid layer la so that the other surface of the copper foil 2 may form a convex surface of a curling surface to form a polyimide film 1. A polyamic acid solution is applied on the other surface of the copper foil 2 of the copper-clad film 3, and then the polyamic acid layer 5a is thermally contracted to form a protective film 5, whereby a flexible printed wiring board 10 is obtained.

Abstract: In a magnetic head for writing/reading a magnetic disk comprising sliders (15, 16) having sliding surfaces which are brought into contact with a surface of the magnetic disk so as to slide relatively to the magnetic disk and a spacer (20) for adjusting height of the sliders (15, 16), each of the sliders (15, 16) is formed from a nonmagnetic material consisting of calcium titanate, and the spacer (20) is formed from a ferrite-group magnetic material, the ferrite-group magnetic material being selected to have substantially the same coefficient of thermal expansion as that of the nonmagnetic material.

Abstract: A magnetic head for use with a floppy disk device includes sliders (15, 16) formed in such a way that a magnetic head core (11) having a normal capacity is interposed between them and a magnetic head core having a large capacity (12) formed so as to be adjacent to one of the sliders. Grooves (15b, 15c, 20, 21) are respectively formed in the joints between the magnetic head core (11) having a standard capacity and the sliders (15, 16) and the joint between the magnetic head core having a large capacity (12) and the adjacent slider.

Abstract: Compounds of formula (I): ##STR1## (wherein: R.sup.1 is optionally substituted alkyl, cycloalkyl, optionally substituted alkoxy, or optionally substituted alkylthio; R.sup.2 is hydrogen, optionally substituted alkyl, cycloalkyl, optionally substituted alkenyl, optionally substituted alkynyl or a group of formula --YR.sup.7 ; R.sup.3 is optionally substituted alkyl, cycloalkyl, optionally substituted alkoxy group, optionally substituted alkenyl, optionally substituted alkynyl, halogen, nitro or a group of formula --COR.sup.8, wherein R.sup.8 is hydrogen, alkyl, cycloalkyl or alkoxy; R.sup.4 and R.sup.5 are each hydrogen atom or alkyl; R.sup.6 is optionally substituted alkyl, cycloalkyl, optionally substituted alkoxy group, optionally substituted alkenyl, optionally substituted alkynyl, halogen, nitro, or a group of formula --COR.sup.8, as defined above;A, Q and X are each oxygen or sulfur; Y is a group of formula --CO--, --COO--, --CH.sub.2 O--, --CH.sub.2 S--, --CH.sub.2 CH.sub.2 O--, --CH.sub.2 CH.sub.