Abstract: A heat exchanger includes: each of the fin plates having a V shaped or trapezoid corrugated shape, and including top walls positioned at top portions of the corrugated shape, bottom walls positioned at bottom portions of the corrugated shape, and foot portions each connecting one of the top walls and one of the bottom walls, each of the foot portions having a rectangular corrugated shape along one of the top walls and one of the bottom walls, and including stepped walls formed at a predetermined interval along the one of the top walls and the one of the bottom walls, and opening portions each formed in one of the stepped walls, and being an elongated through holes having a width equal to or smaller than a thickness of one of the fin plates.

Abstract: A heat exchanger includes: each of the fin plates having a V shaped or trapezoid corrugated shape, and including top walls positioned at top portions of the corrugated shape, bottom walls positioned at bottom portions of the corrugated shape, and foot portions each connecting one of the top walls and one of the bottom walls, each of the foot portions having a rectangular corrugated shape along one of the top walls and one of the bottom walls, and including stepped walls formed at a predetermined interval along the one of the top walls and the one of the bottom walls, and opening portions each formed in one of the stepped walls, and being an elongated through holes having a width equal to or smaller than a thickness of one of the fin plates.

Abstract: With this method for manufacturing fluorine-containing imide compounds, a method for manufacturing a fluorine-containing imide compound ((Rf1SO2)(Rf2SO2)NH) is selected which includes reaction of a fluorine-containing sulfonic acid (Rf1SO3H) and a fluorine-containing sulfonamide (Rf2SO2NH) in the presence of thionyl chloride. Wherein, Rf1 and Rf2 are fluorine, or straight-chain or branched perfluoroalkyl groups with a carbon number of 1-4.

Abstract: With this method for manufacturing fluorine-containing imide compounds, a method for manufacturing a fluorine-containing imide compound ((Rf1SO2)(Rf2SO2)NH) is selected which includes reaction of a fluorine-containing sulfonic acid (Rf1SO3H) and a fluorine-containing sulfonamide (Rf2SO2NH) in the presence of thionyl chloride. Wherein, Rf1 and Rf2 are fluorine, or straight-chain or branched perfluoroalkyl groups with a carbon number of 1-4.

Abstract: An apparatus and method in which the lateral surface of a sealed container (11) containing a beverage liquid (12) is pressed (21, 22) for deformation to measure the internal pressure (P) of the container, and displacement caused by the pressure and the load (F, 31) applied by the pressure is detected (35) so that the gas density of the beverage liquid may be evaluated from these values. An ultrasonic pressure wave is applied (111) to the sealed container to measure the sugar content of the beverage from the propagation velocity of the pressure wave received by an ultrasonic receiver (112), container surface temperature and the ambient temperature resulting from sensors (121, 122) and a calculation unit (50). For simultaneously measuring the gas density and the sugar content a gas density measuring unit (220, 230, 240) and a sugar content measuring unit (290) are provided.

Abstract: In a package comprising a chip mounting base and a cap to be fitted on the base, the base comprises a metal substrate, an electrically insulating ceramic layer formed on the metal substrate, a patterned metal layer formed on the ceramic layer in a selected area thereof, a first mixed layer formed in an area near the interface between the metal substrate and the ceramic layer, and a second mixed layer formed in an area near the interface between the ceramic layer and the metal layer, and the cap comprises a metal substrate, an electrically insulating ceramic layer formed in at least the marginal portion of the side of the metal substrate which faces the base, and a mixed layer that is formed in an area near the interface between the metal substrate and the ceramic layer.

Abstract: In a package comprising a chip mounting base and a cap to be fitted on the base, the base comprises a metal substrate, an electrically insulating ceramic layer formed on the metal substrate, a patterned metal layer formed on the ceramic layer in a selected area thereof, a first mixed layer formed in an area near the interface between the metal substrate and the ceramic layer, and a second mixed layer formed in an area near the interface between the ceramic layer and the metal layer, and the cap comprises a metal substrate, an electrically insulating ceramic layer formed in at least the marginal portion of the side of the metal substrate which faces the base, and a mixed layer that is formed in an area near the interface between the metal substrate and the cermaic layer.