Patents by Inventor Noriaki Matsunage

Noriaki Matsunage has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method for manufacturing the same
    Publication number: 20010045662
    Abstract: A semiconductor comprising a semiconductor device formed on a semiconductor substrate, an interlevel insulating film having holes and a ring-shaped groove in a circuit area formed on the semiconductor substrate and having the semiconductor element formed therein, the ring-shaped groove seamlessly surrounding an outer periphery of the circuit area, via plugs formed in the holes in the interlevel insulating film, a wiring connected to the plug electrodes and mainly comprising copper, and a via ring having a layer formed in the ring-shaped groove and mainly comprising aluminum, wherein no layer mainly comprising copper is formed in the via ring layer.
    Type: Application
    Filed: July 27, 2001
    Publication date: November 29, 2001
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Akihiro Kajita, Noriaki Matsunage, Kazuyuki Higashi