Patents by Inventor Noriaki Nogami
Noriaki Nogami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11424049Abstract: While a water reaction system containing silver ions is irradiated with ultrasonic waves to cause cavitation therein, a reducing agent containing solution, which contains an aldehyde as a reducing agent, is mixed with the water reaction system to deposit silver particles, the solid-liquid separation of which is carried out, and thereafter, the separated silver particles are washed and dried to produce a spherical silver powder which has a closed cavity in each particle thereof.Type: GrantFiled: February 12, 2013Date of Patent: August 23, 2022Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Koji Hirata, Noriaki Nogami
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Patent number: 11270810Abstract: There is provided an electrically conductive paste which can prevent the increase of the volume resistivity of an electrically conductive film formed from the electrically conductive paste even if the electrically conductive film is heated to a soldering temperature of about 380° C. when the electrically conductive paste is a resin type electrically conductive paste using a silver powder and a silver-coated copper powder. In an electrically conductive paste containing a resin, a silver powder and a silver-coated copper powder having a copper powder, the surface of which is coated with a silver layer, the resin is an epoxy resin having a naphthalene skeleton, and there is added a dicarboxylic acid, preferably a dicarboxylic acid having a rational formula of HOOC—(CH2)n—COOH (n=1-8), and more preferably a dicarboxylic acid having a rational formula of HOOC—(CH2)n—COOH (n=4-7).Type: GrantFiled: June 27, 2018Date of Patent: March 8, 2022Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Aiko Hirata, Noriaki Nogami
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Patent number: 11081253Abstract: There is provided an inexpensive silver particle dispersing solution being usable as a slurry for ink jet, a method for producing the same, and a method for producing a conductive film using the silver particle dispersing solution. In a silver particle dispersing solution containing a silver powder and a solvent, the silver powder has an average primary particle diameter (DSEM) of 0.15 to 0.5 ?m, and the ratio (D50/DSEM) of a particle diameter (D50), which corresponds to 50% of accumulation in volume-based cumulative distribution of the silver powder, to the average primary particle diameter (DSEM) is not less than 1.7, the silver powder having a fatty acid adhered to the surface thereof, and the solvent containing a monohydric higher alcohol having a carbon number of 6 to 12, butyl carbitol or butyl carbitol acetate as the main component thereof.Type: GrantFiled: June 11, 2017Date of Patent: August 3, 2021Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Taku Okano, Noriaki Nogami
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Patent number: 10833209Abstract: A conductive paste including: a conductive powder containing silver; an indium powder; a silver-tellurium-coated glass powder; a solvent; and an organic binder, wherein the silver-tellurium-coated glass powder is a silver-tellurium-coated glass powder including a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more, and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component.Type: GrantFiled: September 5, 2017Date of Patent: November 10, 2020Assignee: DOWA Electronics Materials Co., Ltd.Inventors: Kenichi Harigae, Hiroshi Kamiga, Noriaki Nogami
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Patent number: 10807161Abstract: A silver powder, wherein the silver powder satisfies D50-IPA>D50-W, where in measurement of a volume-based particle size distribution of the silver powder by a laser diffraction particle size distribution analysis, D50-IPA (?m) is a cumulative 50% point of particle diameter of the silver powder when isopropyl alcohol (IPA) is used as a measurement solvent for dispersing the silver powder, and D50-W (?m) is a cumulative 50% point of particle diameter of the silver powder when water is used as a measurement solvent for dispersing the silver powder, and wherein a phosphorus content in the silver powder is 0.01% by mass or more but 0.3% by mass or less.Type: GrantFiled: March 11, 2019Date of Patent: October 20, 2020Assignee: DOWA Electronics Materials Co., Ltd.Inventors: Naoki Tahara, Noriaki Nogami, Hiroshi Kamiga
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Patent number: 10773961Abstract: To provide a silver-coated graphite mixed powder including: silver-coated graphite particles each including a graphite particle and silver coated on a surface of the graphite particle, where when a solution obtained by dissolving the silver-coated graphite mixed powder in nitric acid is analyzed through inductively coupled plasma (ICP) emission spectrometry, an amount of silver is 5% by mass or more but 90% by mass or less, an amount of tin is 0.01% by mass or more but 5% by mass or less, and an amount of zinc is 0.002% by mass or more but 1% by mass or less.Type: GrantFiled: December 6, 2016Date of Patent: September 15, 2020Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Kairi Otani, Noriaki Nogami, Yoshio Moteki, Taku Okano
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Publication number: 20200118703Abstract: There is provided an electrically conductive paste which can prevent the increase of the volume resistivity of an electrically conductive film formed from the electrically conductive paste even if the electrically conductive film is heated to a soldering temperature of about 380° C. when the electrically conductive paste is a resin type electrically conductive paste using a silver powder and a silver-coated copper powder. In an electrically conductive paste containing a resin, a silver powder and a silver-coated copper powder having a copper powder, the surface of which is coated with a silver layer, the resin is an epoxy resin having a naphthalene skeleton, and there is added a dicarboxylic acid, preferably a dicarboxylic acid having a rational formula of HOOC—(CH2)n—COOH (n=1-8), and more preferably a dicarboxylic acid having a rational formula of HOOC—(CH2)n—COOH (n=4-7).Type: ApplicationFiled: June 27, 2018Publication date: April 16, 2020Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Aiko Hirata, Noriaki Nogami
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Patent number: 10580910Abstract: There is provided a silver-coated copper powder which can improve the conversion efficiency of a solar cell in comparison with conventional silver-coated copper powders when it is used in an electrically conductive paste used for forming the busbar electrodes of the solar cell, the silver-coated copper powder being capable of producing a solar cell having a high conversion efficiency which is the same degree as that of a solar cell using silver powder, and a method for producing the same.Type: GrantFiled: January 26, 2017Date of Patent: March 3, 2020Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Hiroshi Kamiga, Noriaki Nogami, Aiko Hirata
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Patent number: 10460851Abstract: Provided is a silver-tellurium-coated glass powder including: a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more; and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component. Preferable aspects include an aspect where the coating layer containing silver and tellurium as a main component further contains a component that is other than silver and tellurium and contained in the tellurium-based glass powder, and an aspect where the component that is lo other than silver and tellurium and contained in the tellurium-based glass powder contains one or more kinds selected from zinc, lead, bismuth, silicon, lithium, and aluminum.Type: GrantFiled: March 15, 2017Date of Patent: October 29, 2019Assignee: DOWA Electronics Materials Co., Ltd.Inventors: Hiroshi Kamiga, Taro Nakanoya, Noriaki Nogami, Kenichi Harigae
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Publication number: 20190259510Abstract: There is provided an inexpensive silver particle dispersing solution being usable as a slurry for ink jet, a method for producing the same, and a method for producing a conductive film using the silver particle dispersing solution. In a silver particle dispersing solution containing a silver powder and a solvent, the silver powder has an average primary particle diameter (DSEM) of 0.15 to 0.5 ?m, and the ratio (D50/DSEM) of a particle diameter (D50), which corresponds to 50% of accumulation in volume-based cumulative distribution of the silver powder, to the average primary particle diameter (DSEM) is not less than 1.7, the silver powder having a fatty acid adhered to the surface thereof, and the solvent containing a monohydric higher alcohol having a carbon number of 6 to 12, butyl carbitol or butyl carbitol acetate as the main component thereof.Type: ApplicationFiled: June 11, 2017Publication date: August 22, 2019Applicant: Dowa Electronics Materials Co., Ltd.Inventors: Taku Okano, Noriaki Nogami
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Publication number: 20190247920Abstract: A silver powder, wherein the silver powder satisfies D50-IPA>D50-W, where in measurement of a volume-based particle size distribution of the silver powder by a laser diffraction particle size distribution analysis, D50-IPA (?m) is a cumulative 50% point of particle diameter of the silver powder when isopropyl alcohol (IPA) is used as a measurement solvent for dispersing the silver powder, and D50-W (?m) is a cumulative 50% point of particle diameter of the silver powder when water is used as a measurement solvent for dispersing the silver powder, and wherein a phosphorus content in the silver powder is 0.01% by mass or more but 0.3% by mass or less.Type: ApplicationFiled: March 11, 2019Publication date: August 15, 2019Inventors: Naoki TAHARA, Noriaki NOGAMI, Hiroshi KAMIGA
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Patent number: 10376962Abstract: After preparing a silver-coated copper powder wherein the surface of a copper powder having an average particle diameter of 0.1 to 100 ?m is coated with silver, the silver-coated copper powder is sprayed into the tail flame region of a thermal plasma to cause silver on the surface of the copper powder to diffuse in the grain boundaries of copper on the inside of the copper powder, and thereafter, the surface of the copper powder is coated with silver to produce a metal composite powder wherein the percentage of the area occupied by silver on a cross section of the metal composite powder is 3 to 20% and wherein the surface thereof is coated with silver.Type: GrantFiled: October 24, 2016Date of Patent: August 13, 2019Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Hiroaki Koubu, Noriaki Nogami
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Publication number: 20190189810Abstract: A conductive paste including: a conductive powder containing silver; an indium powder; a silver-tellurium-coated glass powder; a solvent; and an organic binder, wherein the silver-tellurium-coated glass powder is a silver-tellurium-coated glass powder including a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more, and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component.Type: ApplicationFiled: September 5, 2017Publication date: June 20, 2019Inventors: Kenichi Harigae, Hiroshi Kamiga, Noriaki Nogami
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Patent number: 10272490Abstract: A silver powder, wherein the silver powder satisfies D50-IPA>D50-W, where in measurement of a volume-based particle size distribution of the silver powder by a laser diffraction particle size distribution analysis, D50-IPA (?m) is a cumulative 50% point of particle diameter of the silver powder when isopropyl alcohol (IPA) is used as a measurement solvent for dispersing the silver powder, and D50-W (?m) is a cumulative 50% point of particle diameter of the silver powder when water is used as a measurement solvent for dispersing the silver powder, and wherein a phosphorus content in the silver powder is 0.01% by mass or more but 0.3% by mass or less.Type: GrantFiled: September 25, 2015Date of Patent: April 30, 2019Assignee: DOWA Electronics Materials Co., Ltd.Inventors: Naoki Tahara, Noriaki Nogami, Hiroshi Kamiga
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Publication number: 20190080815Abstract: Provided is a silver-tellurium-coated glass powder including: a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more; and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component. Preferable aspects include an aspect where the coating layer containing silver and tellurium as a main component further contains a component that is other than silver and tellurium and contained in the tellurium-based glass powder, and an aspect where the component that is lo other than silver and tellurium and contained in the tellurium-based glass powder contains one or more kinds selected from zinc, lead, bismuth, silicon, lithium, and aluminum.Type: ApplicationFiled: March 15, 2017Publication date: March 14, 2019Inventors: Hiroshi Kamiga, Taro Nakanoya, Noriaki Nogami, Kenichi Harigae
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Publication number: 20190027620Abstract: There is provided a silver-coated copper powder which can improve the conversion efficiency of a solar cell in comparison with conventional silver-coated copper powders when it is used in an electrically conductive paste used for forming the busbar electrodes of the solar cell, the silver-coated copper powder being capable of producing a solar cell having a high conversion efficiency which is the same degree as that of a solar cell using silver powder, and a method for producing the same.Type: ApplicationFiled: January 26, 2017Publication date: January 24, 2019Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Hiroshi Kamiga, Noriaki Nogami, Aiko Hirata
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Publication number: 20180362348Abstract: To provide a silver-coated graphite mixed powder including: silver-coated graphite particles each including a graphite particle and silver coated on a surface of the graphite particle, where when a solution obtained by dissolving the silver-coated graphite mixed powder in nitric acid is analyzed through inductively coupled plasma (ICP) emission spectrometry, an amount of silver is 5% by mass or more but 90% by mass or less, an amount of tin is 0.01% by mass or more but 5% by mass or less, and an amount of zinc is 0.002% by mass or more but 1% by mass or less.Type: ApplicationFiled: December 6, 2016Publication date: December 20, 2018Inventors: Kairi Otani, Noriaki Nogami, Yoshio Moteki, Taku Okano
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Publication number: 20180308603Abstract: To provide a conductive paste including: a filler containing a silver powder and a graphite powder; a polymer; and a solvent, where a 1%-weight-reduction starting temperature of the graphite powder, which is determined through a thermogravimetry-differential thermal analysis method, is 300° C. or more but 640° C. or less.Type: ApplicationFiled: September 23, 2016Publication date: October 25, 2018Inventors: Taku Okano, Noriaki Nogami, Yoshio Moteki
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Publication number: 20180272425Abstract: A silver-coated copper powder obtained by coating the surface of a copper powder, which is obtained by the atomizing method or the like, with 5 wt % or more (with respect to the silver-coated copper powder) of a silver containing layer of silver or a silver compound, is added to a silver supporting solution of a potassium silver cyanide solution (or a potassium silver cyanide solution containing at least one selected from the group consisting of potassium pyrophosphate, boric acid, tripotassium citrate monohydrate, anhydrous citric acid and L-aspartic acid) to cause 0.01 wt % or more (with respect to the silver-coated copper powder) of silver to be supported on the surface of the copper powder coated with the silver containing layer.Type: ApplicationFiled: January 6, 2016Publication date: September 27, 2018Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Noriaki Nogami, Hiroshi Kamiga
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Publication number: 20180096747Abstract: While a water reaction system containing silver ions is irradiated with ultrasonic waves to cause cavitation therein, a reducing agent containing solution, which contains an aldehyde as a reducing agent, is mixed with the water reaction system to deposit silver particles, the solid-liquid separation of which is carried out, and thereafter, the separated silver particles are washed and dried to produce a spherical silver powder which has a closed cavity in each particle thereof.Type: ApplicationFiled: December 5, 2017Publication date: April 5, 2018Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Koji Hirata, Noriaki Nogami