Patents by Inventor Noriaki Nogami

Noriaki Nogami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11424049
    Abstract: While a water reaction system containing silver ions is irradiated with ultrasonic waves to cause cavitation therein, a reducing agent containing solution, which contains an aldehyde as a reducing agent, is mixed with the water reaction system to deposit silver particles, the solid-liquid separation of which is carried out, and thereafter, the separated silver particles are washed and dried to produce a spherical silver powder which has a closed cavity in each particle thereof.
    Type: Grant
    Filed: February 12, 2013
    Date of Patent: August 23, 2022
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Koji Hirata, Noriaki Nogami
  • Patent number: 11270810
    Abstract: There is provided an electrically conductive paste which can prevent the increase of the volume resistivity of an electrically conductive film formed from the electrically conductive paste even if the electrically conductive film is heated to a soldering temperature of about 380° C. when the electrically conductive paste is a resin type electrically conductive paste using a silver powder and a silver-coated copper powder. In an electrically conductive paste containing a resin, a silver powder and a silver-coated copper powder having a copper powder, the surface of which is coated with a silver layer, the resin is an epoxy resin having a naphthalene skeleton, and there is added a dicarboxylic acid, preferably a dicarboxylic acid having a rational formula of HOOC—(CH2)n—COOH (n=1-8), and more preferably a dicarboxylic acid having a rational formula of HOOC—(CH2)n—COOH (n=4-7).
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: March 8, 2022
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Aiko Hirata, Noriaki Nogami
  • Patent number: 11081253
    Abstract: There is provided an inexpensive silver particle dispersing solution being usable as a slurry for ink jet, a method for producing the same, and a method for producing a conductive film using the silver particle dispersing solution. In a silver particle dispersing solution containing a silver powder and a solvent, the silver powder has an average primary particle diameter (DSEM) of 0.15 to 0.5 ?m, and the ratio (D50/DSEM) of a particle diameter (D50), which corresponds to 50% of accumulation in volume-based cumulative distribution of the silver powder, to the average primary particle diameter (DSEM) is not less than 1.7, the silver powder having a fatty acid adhered to the surface thereof, and the solvent containing a monohydric higher alcohol having a carbon number of 6 to 12, butyl carbitol or butyl carbitol acetate as the main component thereof.
    Type: Grant
    Filed: June 11, 2017
    Date of Patent: August 3, 2021
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Taku Okano, Noriaki Nogami
  • Patent number: 10833209
    Abstract: A conductive paste including: a conductive powder containing silver; an indium powder; a silver-tellurium-coated glass powder; a solvent; and an organic binder, wherein the silver-tellurium-coated glass powder is a silver-tellurium-coated glass powder including a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more, and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: November 10, 2020
    Assignee: DOWA Electronics Materials Co., Ltd.
    Inventors: Kenichi Harigae, Hiroshi Kamiga, Noriaki Nogami
  • Patent number: 10807161
    Abstract: A silver powder, wherein the silver powder satisfies D50-IPA>D50-W, where in measurement of a volume-based particle size distribution of the silver powder by a laser diffraction particle size distribution analysis, D50-IPA (?m) is a cumulative 50% point of particle diameter of the silver powder when isopropyl alcohol (IPA) is used as a measurement solvent for dispersing the silver powder, and D50-W (?m) is a cumulative 50% point of particle diameter of the silver powder when water is used as a measurement solvent for dispersing the silver powder, and wherein a phosphorus content in the silver powder is 0.01% by mass or more but 0.3% by mass or less.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: October 20, 2020
    Assignee: DOWA Electronics Materials Co., Ltd.
    Inventors: Naoki Tahara, Noriaki Nogami, Hiroshi Kamiga
  • Patent number: 10773961
    Abstract: To provide a silver-coated graphite mixed powder including: silver-coated graphite particles each including a graphite particle and silver coated on a surface of the graphite particle, where when a solution obtained by dissolving the silver-coated graphite mixed powder in nitric acid is analyzed through inductively coupled plasma (ICP) emission spectrometry, an amount of silver is 5% by mass or more but 90% by mass or less, an amount of tin is 0.01% by mass or more but 5% by mass or less, and an amount of zinc is 0.002% by mass or more but 1% by mass or less.
    Type: Grant
    Filed: December 6, 2016
    Date of Patent: September 15, 2020
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Kairi Otani, Noriaki Nogami, Yoshio Moteki, Taku Okano
  • Publication number: 20200118703
    Abstract: There is provided an electrically conductive paste which can prevent the increase of the volume resistivity of an electrically conductive film formed from the electrically conductive paste even if the electrically conductive film is heated to a soldering temperature of about 380° C. when the electrically conductive paste is a resin type electrically conductive paste using a silver powder and a silver-coated copper powder. In an electrically conductive paste containing a resin, a silver powder and a silver-coated copper powder having a copper powder, the surface of which is coated with a silver layer, the resin is an epoxy resin having a naphthalene skeleton, and there is added a dicarboxylic acid, preferably a dicarboxylic acid having a rational formula of HOOC—(CH2)n—COOH (n=1-8), and more preferably a dicarboxylic acid having a rational formula of HOOC—(CH2)n—COOH (n=4-7).
    Type: Application
    Filed: June 27, 2018
    Publication date: April 16, 2020
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Aiko Hirata, Noriaki Nogami
  • Patent number: 10580910
    Abstract: There is provided a silver-coated copper powder which can improve the conversion efficiency of a solar cell in comparison with conventional silver-coated copper powders when it is used in an electrically conductive paste used for forming the busbar electrodes of the solar cell, the silver-coated copper powder being capable of producing a solar cell having a high conversion efficiency which is the same degree as that of a solar cell using silver powder, and a method for producing the same.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: March 3, 2020
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Hiroshi Kamiga, Noriaki Nogami, Aiko Hirata
  • Patent number: 10460851
    Abstract: Provided is a silver-tellurium-coated glass powder including: a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more; and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component. Preferable aspects include an aspect where the coating layer containing silver and tellurium as a main component further contains a component that is other than silver and tellurium and contained in the tellurium-based glass powder, and an aspect where the component that is lo other than silver and tellurium and contained in the tellurium-based glass powder contains one or more kinds selected from zinc, lead, bismuth, silicon, lithium, and aluminum.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: October 29, 2019
    Assignee: DOWA Electronics Materials Co., Ltd.
    Inventors: Hiroshi Kamiga, Taro Nakanoya, Noriaki Nogami, Kenichi Harigae
  • Publication number: 20190259510
    Abstract: There is provided an inexpensive silver particle dispersing solution being usable as a slurry for ink jet, a method for producing the same, and a method for producing a conductive film using the silver particle dispersing solution. In a silver particle dispersing solution containing a silver powder and a solvent, the silver powder has an average primary particle diameter (DSEM) of 0.15 to 0.5 ?m, and the ratio (D50/DSEM) of a particle diameter (D50), which corresponds to 50% of accumulation in volume-based cumulative distribution of the silver powder, to the average primary particle diameter (DSEM) is not less than 1.7, the silver powder having a fatty acid adhered to the surface thereof, and the solvent containing a monohydric higher alcohol having a carbon number of 6 to 12, butyl carbitol or butyl carbitol acetate as the main component thereof.
    Type: Application
    Filed: June 11, 2017
    Publication date: August 22, 2019
    Applicant: Dowa Electronics Materials Co., Ltd.
    Inventors: Taku Okano, Noriaki Nogami
  • Publication number: 20190247920
    Abstract: A silver powder, wherein the silver powder satisfies D50-IPA>D50-W, where in measurement of a volume-based particle size distribution of the silver powder by a laser diffraction particle size distribution analysis, D50-IPA (?m) is a cumulative 50% point of particle diameter of the silver powder when isopropyl alcohol (IPA) is used as a measurement solvent for dispersing the silver powder, and D50-W (?m) is a cumulative 50% point of particle diameter of the silver powder when water is used as a measurement solvent for dispersing the silver powder, and wherein a phosphorus content in the silver powder is 0.01% by mass or more but 0.3% by mass or less.
    Type: Application
    Filed: March 11, 2019
    Publication date: August 15, 2019
    Inventors: Naoki TAHARA, Noriaki NOGAMI, Hiroshi KAMIGA
  • Patent number: 10376962
    Abstract: After preparing a silver-coated copper powder wherein the surface of a copper powder having an average particle diameter of 0.1 to 100 ?m is coated with silver, the silver-coated copper powder is sprayed into the tail flame region of a thermal plasma to cause silver on the surface of the copper powder to diffuse in the grain boundaries of copper on the inside of the copper powder, and thereafter, the surface of the copper powder is coated with silver to produce a metal composite powder wherein the percentage of the area occupied by silver on a cross section of the metal composite powder is 3 to 20% and wherein the surface thereof is coated with silver.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: August 13, 2019
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Hiroaki Koubu, Noriaki Nogami
  • Publication number: 20190189810
    Abstract: A conductive paste including: a conductive powder containing silver; an indium powder; a silver-tellurium-coated glass powder; a solvent; and an organic binder, wherein the silver-tellurium-coated glass powder is a silver-tellurium-coated glass powder including a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more, and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component.
    Type: Application
    Filed: September 5, 2017
    Publication date: June 20, 2019
    Inventors: Kenichi Harigae, Hiroshi Kamiga, Noriaki Nogami
  • Patent number: 10272490
    Abstract: A silver powder, wherein the silver powder satisfies D50-IPA>D50-W, where in measurement of a volume-based particle size distribution of the silver powder by a laser diffraction particle size distribution analysis, D50-IPA (?m) is a cumulative 50% point of particle diameter of the silver powder when isopropyl alcohol (IPA) is used as a measurement solvent for dispersing the silver powder, and D50-W (?m) is a cumulative 50% point of particle diameter of the silver powder when water is used as a measurement solvent for dispersing the silver powder, and wherein a phosphorus content in the silver powder is 0.01% by mass or more but 0.3% by mass or less.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: April 30, 2019
    Assignee: DOWA Electronics Materials Co., Ltd.
    Inventors: Naoki Tahara, Noriaki Nogami, Hiroshi Kamiga
  • Publication number: 20190080815
    Abstract: Provided is a silver-tellurium-coated glass powder including: a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more; and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component. Preferable aspects include an aspect where the coating layer containing silver and tellurium as a main component further contains a component that is other than silver and tellurium and contained in the tellurium-based glass powder, and an aspect where the component that is lo other than silver and tellurium and contained in the tellurium-based glass powder contains one or more kinds selected from zinc, lead, bismuth, silicon, lithium, and aluminum.
    Type: Application
    Filed: March 15, 2017
    Publication date: March 14, 2019
    Inventors: Hiroshi Kamiga, Taro Nakanoya, Noriaki Nogami, Kenichi Harigae
  • Publication number: 20190027620
    Abstract: There is provided a silver-coated copper powder which can improve the conversion efficiency of a solar cell in comparison with conventional silver-coated copper powders when it is used in an electrically conductive paste used for forming the busbar electrodes of the solar cell, the silver-coated copper powder being capable of producing a solar cell having a high conversion efficiency which is the same degree as that of a solar cell using silver powder, and a method for producing the same.
    Type: Application
    Filed: January 26, 2017
    Publication date: January 24, 2019
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Hiroshi Kamiga, Noriaki Nogami, Aiko Hirata
  • Publication number: 20180362348
    Abstract: To provide a silver-coated graphite mixed powder including: silver-coated graphite particles each including a graphite particle and silver coated on a surface of the graphite particle, where when a solution obtained by dissolving the silver-coated graphite mixed powder in nitric acid is analyzed through inductively coupled plasma (ICP) emission spectrometry, an amount of silver is 5% by mass or more but 90% by mass or less, an amount of tin is 0.01% by mass or more but 5% by mass or less, and an amount of zinc is 0.002% by mass or more but 1% by mass or less.
    Type: Application
    Filed: December 6, 2016
    Publication date: December 20, 2018
    Inventors: Kairi Otani, Noriaki Nogami, Yoshio Moteki, Taku Okano
  • Publication number: 20180308603
    Abstract: To provide a conductive paste including: a filler containing a silver powder and a graphite powder; a polymer; and a solvent, where a 1%-weight-reduction starting temperature of the graphite powder, which is determined through a thermogravimetry-differential thermal analysis method, is 300° C. or more but 640° C. or less.
    Type: Application
    Filed: September 23, 2016
    Publication date: October 25, 2018
    Inventors: Taku Okano, Noriaki Nogami, Yoshio Moteki
  • Publication number: 20180272425
    Abstract: A silver-coated copper powder obtained by coating the surface of a copper powder, which is obtained by the atomizing method or the like, with 5 wt % or more (with respect to the silver-coated copper powder) of a silver containing layer of silver or a silver compound, is added to a silver supporting solution of a potassium silver cyanide solution (or a potassium silver cyanide solution containing at least one selected from the group consisting of potassium pyrophosphate, boric acid, tripotassium citrate monohydrate, anhydrous citric acid and L-aspartic acid) to cause 0.01 wt % or more (with respect to the silver-coated copper powder) of silver to be supported on the surface of the copper powder coated with the silver containing layer.
    Type: Application
    Filed: January 6, 2016
    Publication date: September 27, 2018
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Noriaki Nogami, Hiroshi Kamiga
  • Publication number: 20180096747
    Abstract: While a water reaction system containing silver ions is irradiated with ultrasonic waves to cause cavitation therein, a reducing agent containing solution, which contains an aldehyde as a reducing agent, is mixed with the water reaction system to deposit silver particles, the solid-liquid separation of which is carried out, and thereafter, the separated silver particles are washed and dried to produce a spherical silver powder which has a closed cavity in each particle thereof.
    Type: Application
    Filed: December 5, 2017
    Publication date: April 5, 2018
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Koji Hirata, Noriaki Nogami