Abstract: A lead frame for LOC to which a semiconductor chip is fixed within a semiconductor chip-mounting region. In addition to applying insulative adhesives to the conventional portions or spots which are on the bottom surfaces of the leading edges of respective inner leads for wire bonding to the pads for the semiconductor ship, the insulative adhesives are applied to other portions of the inner leads in the vicinity of the semiconductor chip-mounting region. Accordingly, the area for bonding the semiconductor chip can be enlarged resulting in improvements in the stability of adhesion between the leads and the semiconductor chip, and in the stabilities of wire bonding and resin molding.

Abstract: A lead frame is provided which enables a coating of an insulating adhesive for fixing a semiconductor chip to be evenly and thickly foamed on inner leads. In a lead frame wherein an insulating adhesive for fixing a semiconductor chip is applied to a semiconductor chip mounting region, inner leads 1 are set to a value of w/s of not more than 1 wherein w represents the lead width and s represents the lead spacing.

Abstract: A lead frame for LOC is provided which can reduce a variation in coverage of an insulating adhesive, permitting the fixation of a semiconductor chip and wire bonding to be stably performed. In a lead frame for LOC 10 wherein an insulating adhesive for fixing a semiconductor chip is applied to inner leads 11 in their semiconductor chip mounting region, a coverage regulating lead 14 is provided outside the semiconductor chip mounting region and adjacent to inner leads 11a, 11b located at the end of the semiconductor chip mounting region, permitting the insulting adhesive to be homogeneously applied to each of the inner leads 11 without creating any variation in coverage of the adhesive.

Abstract: A lead frame for LOC is provided which, even when an adhesive is applied to a lead prepared by stamping, can ensure insulation of a semiconductor element mounted from the lead. In applying an adhesive to a predetermined position of an inner lead 1 in a lead frame prepared by stamping to form an adhesive layer 4, the adhesive layer 4 is provided on the droop face of the inner lead 1. The droop face has no burr and a bulged center portion, permitting contact, derived from the burr, between a lead face and a semiconductor element, to be avoided, which ensures satisfactory insulation of the semiconductor element mounted from the lead.

Abstract: A plastic optical fiber comprising a core and a clad, said core being formed by an amorphous and optically transparent polymer and said clad being formed by a polymer having a refractive index lower than that of the core by at least 0.3%, at least one of the core and the clad being formed by an amorphous and optically transparent polymer containing metal elements and halogen atoms, is low in light loss and excellent in heat resistance.

Abstract: An optical transmitting system comprising a light source, an optical transmitting portion from the light source, and an optical detecting portion characterized in that a fraction of deuterium substitution for hydrogen in a repeat unit of an organic polymer composing the optical transmitting portion is at most 40%, fluorine content in said organic polymer is less than 40% by weight, and said organic polymer comprises an amorphous polymer which satisfies the equation (I):(.rho./M)(9.1.times.10.sup.-5.n.sub.CH +9.1.times.10.sup.-4.n.sub.NH +1.5.times.10.sup.-3.n.sub.OH)<5.3.times.10.sup.-6 (I)[where, .rho. is density of the polymer (g/cm.sup.3), M is molecular weight of the repeat unit (g/mol), n.sub.CH, n.sub.NH, and n.sub.OH indicates number of combination of C--H bond, N--H bond, and O--H bond in the repeat unit respectively].

Abstract: An optical part for light transmission comprises a light conductor formed of a core of a transparent material and a clad of a material having a smaller refractive index than that of the core material, and a light emitting and/or receiving element, wherein the light emitting and/or receiving element is integrally combined with the core of the light conductor by a same material as the core material or by a material having a same refractive index as that of the core material and having a greater rigidity than that of the material forming the clad and/or jacket. The optical part can be used in a high temperature environment as well as a room temperature environment without involving any appreciable loss in light transmission.

Abstract: A synthetic resin optical fiber having the structure simplified and a stable light transmission characteristic is disclosed. The synthetic resin optical fiber comprises a transparent core and a cladding formed around the core, and the cladding has an inner transparent portion and an outer peripheral portion containing a light interruption substance such as a pigment and the like.

Abstract: There is provided a resinous optical transmitting element in which a core, through which light is transmitted, is formed into a predetermined non-linear configuration, and a cladding lower in refractive index than the core is in close contact with the core. A method of manufacturing the optical transmitting element comprises the steps of polymerizing polymeric material forming the core, within a mold having a predetermined non-linear cavity, subsequently removing the mold, and forming the cladding about the core. The resinous optical transmitting element obtained by the method can be formed into a selected one of various configurations in compliance with the purpose. In addition, the resinous optical transmitting element is less in distortion, making it possible to reduce the transmission loss.

Abstract: This invention comprises unifying circuits with a base on which mechanical parts are mounted and relates to a mechanical part mounting chassis provided with a substrate and a circuit buried in the substrate and/or spread out on the substrate surface.

Abstract: A transparent resin material containing metallic atoms (except for alkali metals) which are ionic-bonded to a vitreous polymeric material constituting the substance of said resin material, in an amount of at least 8% by weight based on the total weight of the resin material, said resin material having a transparency of at least 80% in terms of a light transmittance, and a refractive index n.sub.D.sup.25 of at least 1.55.