Abstract: A polyorganosiloxane may be high in elasticity and/or strength. The polyorganosiloxane may include an M unit (R1R2R3SiO1/2) at a content of 10 mol. % or more relative to the total of silicon and a T unit (R6SiO3/2) at a content of 80 mol. % or less relative to the total of silicon. The polyorganosiloxane may have an alkoxy group bound, at a content of 0.07 to 4 wt. %, based on total polyorganosiloxane weight, and a reactive functional group bound to silicon, with 3 to 12 of the reactive functional groups bound on a number basis per a molecular weight of 1000 of the polyorganosiloxane. The weight loss of the polyorganosiloxane at 110° C. under 0.15 torr for 2 hours may be 5 wt. % or less.

Abstract: Provided are a polyorganosiloxane high in elasticity, high in strength and the like. The polyorganosiloxane is a polyorganosiloxane including an M unit (R1R2R3SiO1/2) at a content of 10% by mol or more relative to the total of silicon and a T unit (R6SiO3/2) at a content of 80% by mol or less relative to the total of silicon, the polyorganosiloxane having an alkoxy group bound and a reactive functional group bound to silicon, wherein the polyorganosiloxane has the alkoxy group bound at a content of 0.07 to 4% by weight based on the total weight of the polyorganosiloxane and has 3 to 12 of the reactive functional groups bound on a number basis per a molecular weight of 1000 of the polyorganosiloxane, and the weight loss of the polyorganosiloxane in heating at 110° C. under a reduced pressure of 0.15 torr for 2 hours is 5% by weight or less.

Abstract: A polyorganosiloxane with an epoxy group, a curable resin composition, and a cured product having high compatibility with an initiator and another resin is described. The polyorganosiloxane has a low viscosity, a high curing rate, and high adhesiveness and impact resistance. The polyorganosiloxane has an M unit (R1R2R3SiO1/2), a D unit (R4R5SiO2/2), and a Q unit (SiO4/2). A T unit (R6SiO3/2) content of the polyorganosiloxane is 80% or less by mole of total silicon. The epoxy group has a group of formula (2) and a group of formula (3). Here, R8 is an optionally substituted divalent organic group having 1 to 20 carbon atoms, g is 0 or 1, R9 is an optionally substituted divalent organic group having 1 to 20 carbon atoms, h is 0 or 1, 0?i?8, and 0?j?8.

Abstract: A thermoplastic resin composition, may include a thermoplastic resin (A) and, per 100 parts by mass of the thermoplastic resin (A), from 0 to 0.2 parts by mass of a metal salt-containing flame retardant (B), and not less than 0.05 parts by mass and less than 3 parts by mass of an organopolysiloxane (C), wherein the organopolysiloxane (C) has a molecular weight distribution (Mw/Mn) in a range of from 1.01 to 1.4.

Abstract: An object of the present invention is to provide an epoxy group-containing polyorganosiloxane, a curable resin composition and a cured product which are excellent in curability, surface nature of a coating film, adhesiveness, and impact resistance. The epoxy group-containing polyorganosiloxane of the present invention contains an M unit (R1R2R3SiO1/2), a D unit (R4R5O2/2), and a Q unit (SiO4/2), wherein a content of a T unit (R6SiO3/2) with respect to total silicon is 80 mol % or less. The curable resin composition of the present invention contains the epoxy group-containing polyorganosiloxane (A) and a curing agent (B).

Abstract: Provided are a polyorganosiloxane high in elasticity, high in strength and the like. The polyorganosiloxane is a polyorganosiloxane including an M unit (R1R2R3SiO1/2) at a content of 10% by mol or more relative to the total of silicon and a T unit (R6SiO3/2) at a content of 80% by mol or less relative to the total of silicon, the polyorganosiloxane having an alkoxy group bound and a reactive functional group bound to silicon, wherein the polyorganosiloxane has the alkoxy group bound at a content of 0.07 to 4% by weight based on the total weight of the polyorganosiloxane and has 3 to 12 of the reactive functional groups bound on a number basis per a molecular weight of 1000 of the polyorganosiloxane, and the weight loss of the polyorganosiloxane in heating at 110° C. under a reduced pressure of 0.15 torr for 2 hours is 5% by weight or less.