Abstract: An optical fiber comprises a glass fiber including a core and a cladding, and a coating resin layer for coating the glass fiber; the coating resin layer has a primary resin layer in contact with the glass fiber for coating the glass fiber, and a secondary resin layer for coating the primary resin layer; the primary resin layer includes a silicone resin; the secondary resin layer includes a urethane (meth)acrylate resin; and the amount of platinum contained in the primary resin layer is 25 ppm or more and 280 ppm or less in a mass ratio.

Abstract: A grid controller is communicably connected to controllers of a plurality of power storage units. The grid controller: obtains transmission power transmitted from the smart grid system to an external power system, the transmission power being a sum of electric power generated by power generating units, electric power consumed by loads in the smart grid system, and electric power charged into and discharged from the power storage units; calculates differential power between the transmission power and a smoothing operation output, the smoothing operation output being obtained by performing smoothing operation on the transmission power by using a smoothing filter; and performs control of smoothing the transmission power by performing allocation of the differential power of the transmission power in accordance with a charge-discharge state of each of power storage parts of the plurality of power storage units.

Abstract: A grid controller is communicably connected to controllers of a plurality of power storage units. The grid controller: obtains transmission power transmitted from the smart grid system to an external power system, the transmission power being a sum of electric power generated by power generating units, electric power consumed by loads in the smart grid system, and electric power charged into and discharged from the power storage units; calculates differential power between the transmission power and a smoothing operation output, the smoothing operation output being obtained by performing smoothing operation on the transmission power by using a smoothing filter; and performs control of smoothing the transmission power by performing allocation of the differential power of the transmission power in accordance with a charge-discharge state of each of power storage parts of the plurality of power storage units.

Abstract: A control system adjusts the exposure of a wafer according to the transfer error of a pattern line width caused when a certain integrated exposure over the whole shot areas is made a desired value when a pattern is transferred to a wafer and according to information corresponding to the desired value of the integrated exposure stored in a storage device, then performing scanning exposure. As a result, influences such as of fog exposure due to flare are mitigated, and the uniformity of line width distribution with high precision is ensure over the shot regions on the wafer, achieving pattern transfer to each shot region.

Abstract: An exposure apparatus for exposing a substrate with an image of a pattern formed on a mask, including an illumination system or irradiation for illuminating or irradiating the mask with exposure light. A projection optical system is included for projecting, onto the substrate, an image of the pattern illuminated by the exposure light. The mask is securely supported on a movable mask stage. In one example, a mask holder is provided for supporting the mask from below. A pressing member is also included for applying, from above, a prescribed force to the mask, outside of the points supported by the mask holder.

Abstract: A control system adjusts the exposure of a wafer according to the transfer error of a pattern line width caused when a certain integrated exposure over the whole shot areas is made a desired value when a pattern is transferred to a wafer and according to information corresponding to the desired value of the integrated exposure stored in a storage device, then performing scanning exposure. As a result, influences such as of fog exposure due to flare are mitigated, and the uniformity of line width distribution with high precision is ensure over the shot regions on the wafer, achieving pattern transfer to each shot region.

Abstract: A scan type projection exposure apparatus which includes an illumination optical system for forming a slit-shaped illumination area on a pattern on a mask by using illuminating light, and a projection optical system for forming an image of a portion of the pattern in the illumination area on a substrate, includes: a mask stage which moves at least in one direction while holding the mask; a substrate stage which moves two-dimensionally while holding the substrate; a control system for synchronously scanning the mask stage and the substrate stage; and an image forming performance adjusting system for adjusting image forming performance of the projection optical system and having a component placed in an area through which the illuminating light incident from the illumination area on the mask to the projection optical system does not pass.

Abstract: An exposure apparatus for exposing a substrate with an image of a pattern formed on a mask, including an illumination system or irradiation for illuminating or irradiating the mask with exposure light. A projection optical system is included for projecting, onto the substrate, an image of the pattern illuminated by the exposure light. The mask is securely supported on a movable mask stage. In one example, a mask holder is provided for supporting the mask from below. A pressing member is also included for applying, from above, a prescribed force to the mask, outside of the points supported by the mask holder.

Abstract: An exposure apparatus for exposing a substrate with an image of a pattern formed on a mask, including an illumination system or irradiation for illuminating or irradiating the mask with exposure light. A projection optical system is included for projecting, onto the substrate, an image of the pattern illuminated by the exposure light. The mask is securely supported on a movable mask stage. In one example, a mask holder is provided for supporting the mask from below. A pressing member is also included for applying, from above, a prescribed force to the mask, outside of the points supported by the mask holder.

Abstract: A control system adjusts the exposure of a wafer according to the transfer error of a pattern line width caused when a certain integrated exposure over the whole shot areas is made a desired value when a pattern is transferred to a wafer and according to information corresponding to the desired value of the integrated exposure stored in a storage device, then performing scanning exposure. As a result, influences such as of fog exposure due to flare are mitigated, and the uniformity of line width distribution with high precision is ensure over the shot regions on the wafer, achieving pattern transfer to each shot region.

Abstract: A control system adjusts the exposure of a wafer according to the transfer error of a pattern line width caused when a certain integrated exposure over the whole shot areas is made a desired value when a pattern is transferred to a wafer and according to information corresponding to the desired value of the integrated exposure stored in a storage device, then performing scanning exposure. As a result, influences such as of fog exposure due to flare are mitigated, and the uniformity of line width distribution with high precision is ensure over the shot regions on the wafer, achieving pattern transfer to each shot region.

Abstract: A power fluctuation monitoring unit which monitors and detects the power fluctuation at a receiving point 9 by means of the measurement results of the voltage at injection point 14 of an intermediate-order harmonic current and the current at incoming line 10, a power compensation unit which forms the compensation power injection signal for canceling out the power fluctuation based on the detection results of the power fluctuation, and an inverter device 18 which is driven and controlled by the signal resulting from the addition of the intermediate-order harmonic current injection signal and the compensation power injection signal and injects the intermediate-order harmonic current and the compensation power into the injection point, are equipped.

Abstract: An exposure system of the invention comprises: a first unit incorporating a first apparatus for transferring an image of a pattern of a mask onto a substrate, a second unit incorporating a second apparatus having a function different from that of the first apparatus, and a connection unit for connecting the first unit and the second unit, and is characterized in that an internal pressure of the connecting section is set to be lower that an internal pressure of either of the first unit and the second unit, and is set to be higher than a pressure of the surroundings in which the connection unit is installed.

Abstract: A scan type projection exposure apparatus which includes an illumination optical system for forming a slit-shaped illumination area on a pattern on a mask by using illuminating light, and a projection optical system for forming an image of a portion of the pattern in the illumination area on a substrate, includes: a mask stage which moves at least in one direction while holding the mask; a substrate stage which moves two-dimensionally while holding the substrate; a control system for synchronously scanning the mask stage and the substrate stage; and an image forming performance adjusting system for adjusting image forming performance of the projection optical system and having a component placed in an area through which the illuminating light incident from the illumination area on the mask to the projection optical system does not pass.

Abstract: A scan type projection exposure apparatus which includes an illumination optical system for forming a slit-shaped illumination area on a pattern on a mask by using illuminating light, and a projection optical system for forming an image of a portion of the pattern in the illumination area on a substrate, includes: a mask stage which moves at least in one direction while holding the mask; a substrate stage which moves two-dimensionally while holding the substrate; a control system for synchronously scanning the mask stage and the substrate stage; and an image forming performance adjusting system for adjusting image forming performance of the projection optical system and having a component placed in an area through which the illuminating light incident from the illumination area on the mask to the projection optical system does not pass.

Abstract: A power fluctuation monitoring unit which monitors and detects the power fluctuation at a receiving point 9 by means of the measurement results of the voltage at injection point 14 of an intermediate-order harmonic current and the current at incoming line 10, a power compensation unit which forms the compensation power injection signal for canceling out the power fluctuation based on the detection results of the power fluctuation, and an inverter device 18 which is driven and controlled by the signal resulting from the addition of the intermediate-order harmonic current injection signal and the compensation power injection signal and injects the intermediate-order harmonic current and the compensation power into the injection point, are equipped.

Abstract: A scan type projection exposure apparatus which includes an illumination optical system for forming a slit-shaped illumination area on a pattern on a mask by using illuminating light, and a projection optical system for forming an image of a portion of the pattern in the illumination area on a substrate, includes: a mask stage which moves at least in one direction while holding the mask; a substrate stage which moves two-dimensionally while holding the substrate; a control system for synchronously scanning the mask stage and the substrate stage; and an image forming performance adjusting system for adjusting image forming performance of the projection optical system and having a component placed in an area through which the illuminating light incident from the illumination area on the mask to the projection optical system does not pass.

Abstract: In a current-limiting device, a plurality of current-limiting elements are connected in series to one another, and are inserted between the system power source of an electric power system and the load thereof. In the device, transformers, the number of which is equal to that of the current-limiting element S1 through Sn, are arranged. The primary windings of the transformers are connected to the current-limiting elements in the same polarity, respectively, and all the secondary wings thereof are connected in parallel to one another.

Abstract: A system interconnection device connected between two systems, such as a commercial bus line carrying power from a commercial power line and a private bus line carrying power from a private power generator, is able to connect and disconnect the two systems, and, in the event of a fault, has a current-limiting effect, thus preventing instantaneous voltage drop of the respective bus lines. In the system interconnection device, unit parallel circuits made up of diodes and DC reactors are serially connected so that the diodes thereof have opposite directions. With this structure, in realizing operations equivalent to those of a conventional system interconnection device having a DC reactor between DC terminals of a single-phase rectifying bridge circuit, the number of diodes, which are rectifying elements, can be halved.

Abstract: Even when there is a large change in unevenness on the surface of an area to be exposed, scanning exposure is carried out without reducing the throughput by accurately bringing the surface of the area into focus to the image plane. Focus position measuring areas (15F and 15R) are set apart from a slit-shaped illumination field (3) by respective sections (16F and 16R) with a predetermined width in the scanning direction. To carry out scanning exposure for a shot area on a wafer, the shot area is covered by the measuring area (15F), for example, at an approach start point of the wafer, and the focus position of the surface of the shot area is measured at detecting points (P.sub.11 to P.sub.53) in the measuring area (15F). On the basis of the result of the measurement, controlled variables for the surface position of the wafer are determined to bring the wafer surface in the illumination field (3) into focus to the image plane during scanning exposure by an autofocusing method and an autoleveling method.