Abstract: A method of manufacturing a substrate includes applying solder resist ink containing a mixing resin of epoxy-based resin and acrylic-based resin on at least one surface of a substrate body to form a solder resist layer, and irradiating a predetermined portion of the solder resist layer with ultraviolet rays and controlling an amount of irradiation of the ultraviolet rays irradiated to the predetermined of the solder resist layer to form the predetermined portion in transmissivity that transmits light.

Abstract: A method of manufacturing a substrate includes applying solder resist ink containing a mixing resin of epoxy-based resin and acrylic-based resin on at least one surface of a substrate body to form a solder resist layer, and irradiating a predetermined portion of the solder resist layer with ultraviolet rays and controlling an amount of irradiation of the ultraviolet rays irradiated to the predetermined of the solder resist layer to form the predetermined portion in transmissivity that transmits light.

Abstract: The foam sheet of the present invention is biodegradable, can be recycled, has good processability, is lightweight, exhibits excellent appearance, has practically satisfactory heat resistance and is more acceptable to the environment. There is provided a crosslinked biodegradable resin continuous foam sheet comprising biodegradable resin, and has an expansion rate of about 1.5 to about 50 and a gel fraction of about 3% or more. There is further provided a method for producing the foam sheet comprising the steps of: (1) preparing a sheet from a resin composition comprising a biodegradable resin, a thermal decomposable blowing agent, and a crosslinking promoter; (2) irradiating the resulting sheet with an ionizing radiation to crosslink the resin composition; and (3) subjecting the crosslinked sheet to heat treatment to continuously prepare a crosslinked foam sheet.

Abstract: The foam sheet of the present invention is biodegradable, can be recycled, has good processability, is lightweight, exhibits excellent appearance, has practically satisfactory heat resistance and is more acceptable to the environment. There is provided a crosslinked biodegradable resin continuous foam sheet comprising biodegradable resin, and has an expansion rate of about 1.5 to about 50 and a gel fraction of about 3% or more. There is further provided a method for producing the foam sheet comprising the steps of: (1) preparing a sheet from a resin composition comprising a biodegradable resin, a thermal decomposable blowing agent, and a crosslinking promoter; (2) irradiating the resulting sheet with an ionizing radiation to crosslink the resin composition; and (3) subjecting the crosslinked sheet to heat treatment to continuously prepare a crosslinked foam sheet.

Abstract: It is to provide a high-frequency component using a small coupling line, capable of easily adjusting an electrical characteristic. A first transmission line including three line sections constructs a ¼-wavelength strip line. A second transmission line including three line sections also constructs a ¼-wavelength strip line. The line section on one-end side in the first transmission line is faced to the line section on one-end side in the second transmission line, while a dielectric sheet is disposed between both of the line sections, thereby mutually coupling both transmission lines electro-magnetically. The line section on another-end side in the first transmission line is also faced to the line section on another-end side in the second transmission line. While the dielectric sheet is disposed between both of the line sections, thereby mutually coupling both transmission lines electro-magnetically.

Abstract: A Cu plated ceramic substrate is used in a semiconductor. On a ceramic substrate layer, a thin-film Cr layer is put, and a thin-firm Au layer is put on the Cr layer. The Au layer is plated with Cu. By providing the Au and Cr layers between the ceramic plate and Cu layer, adhesibility is increased. A Pertier element which includes the Cu plated ceramic layer is employed in a semiconductor to absorb and generate heat efficiently.

Abstract: A Cu plated ceramic substrate is used in a semiconductor. On a ceramic substrate layer, a thin-film Cr layer is put, and a thin-firm Au layer is put on the Cr layer. The Au layer is plated with Cu. By providing the Au and Cr layers between the ceramic plate and Cu layer, adhesibility is increased. A Pertier element which includes the Cu plated ceramic layer is employed in a semiconductor to absorb and generate heat efficiently.

Abstract: A frequency multiple outgoing light is obtained by intensity-modulating a frequency multiple incident light in frequency domain, after irradiating a pump beam to an optical recording medium consisting of photochromic material and the like to generate optical Stark effect thereon and shifting the light absorption spectrum of the optical recording medium by optical Stark effect.

Abstract: A light responsive semiconductor device includes a p-i-n structure incorporating a multiple quantum well structure buried within the intrinsic layer and an external resistance and voltage source serially connected across the device for adjusting a critical wavelength at which the light absorption characteristic of the device dramatically changes. By properly choosing the resistance and/or voltage, the photocurrent changes discontinuously at the critical wavelength and the photocurrent exhibits a hysteresis characteristic. A light responsive structure may include individual, serially aligned p-i-n devices or an integrated, unitary semiconductor body inculding a plurality of p-i-n devices.

Abstract: A semiconductor laser having an active layer of quantum well structure, where the resonator loss is enhanced thereby to conduct an oscillation at a high quantum level.