Abstract: A tip 230 holds a liquid and discharges the liquid to a well 310. A dispensing unit 220 performs a dispensing process by discharging a constant dispensing amount of the liquid out of the liquid that is held by the tip 230 to the well 310. An arithmetic unit 10 calculates a dispensing position with respect to the well 310 based on container information on the well 310 and information on the dispensing amount, and causes the dispensing unit 220 to perform the dispensing process at the dispensing position.

Abstract: A method and an apparatus of forming a multilayer printed circuit board which can positively remove voids in the prepregs in the printed board and enhance the reliability of the produced printed circuit board and is superior in economy, wherein a laminated assembly of a plurality of printed circuit board components and a plurality of prepregs alternately laminated on each other is sandwiched between upper and lower jig plates, and the laminated assembly sandwiched between the jig plates is clamped between heating plates of a bonding press to heat the assembly to a predetermined temperature, and, thereafter, a pressure is applied to the upper and lower jig plates so as to urge them against each other for bonding the printed circuit board component and the prepregs.

Abstract: Method and apparatus for detecting wiring patterns wherein a printed circuit board is irradiated with a light ray which excites a substrate of the printed circuit board to generate a fluorescent radiation from the substrate, the fluorescent radiation generated from portions other than a wiring pattern of the printed circuit board is imaged by means of an image detector, and a negative pattern of the wiring pattern is detected on the basis of an image signal generated from the image detector.

Abstract: A pattern detecting apparatus for inspecting a printed wiring board is disclosed in which a fluorescent image formed by the fluorescent light from the substrate of the printed wiring board and an image formed by the reflected light from the wiring pattern of the printed wiring board are both used because a wiring material which is left on an undesired portion of the substrate and has low reflectivity, is detected only at the fluorescent image and a defective portion of the wiring pattern where a surface layer thereof peels off, is detected only at the image formed by the reflected light, the image used for detecting the above defective portion is preferably formed by the reflected infrared light from the wiring pattern for the reason that infrared light is insensitive to a shallow flaw in the surface of the wiring pattern, and the fluorescent image and the infrared image are processed by a detection circuit, and then compared with each other to detect a pattern defect on the basis of a difference between the