Patents by Inventor Noriaki Yamaji

Noriaki Yamaji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Triazole silane compound, method for synthesizing said compound and use thereof
    Patent number: 11680076
    Abstract: The purpose of the present invention is to provide: a novel triazole silane compound and a method for synthesizing the same, and a silane coupling agent containing the triazole silane compound as a component; and a surface treatment solution, a surface treatment method, and a method for bonding two different materials, which use said triazole silane compound.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: June 20, 2023
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Takayuki Murai, Miya Tanioka, Shusaku Iida, Masato Katsumura, Noriaki Yamaji, Takahito Imamine, Masahiko Tsujino, Hirohiko Hirao
  • Tetrazole silane compound, method for synthesizing said compound and use thereof
    Patent number: 11472823
    Abstract: The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: October 18, 2022
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Noriaki Yamaji, Takayuki Murai, Miya Tanioka, Shusaku Iida, Masato Katsumura, Takahito Imamine, Masahiko Tsujino, Tomoya Mae, Hirohiko Hirao
  • METAL SURFACE TREATMENT LIQUID AND LIQUID CONCENTRATE THEREOF, METAL SURFACE TREATMENT LIQUID SET, METAL SURFACE TREATMENT METHOD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    Publication number: 20220306656
    Abstract: The present invention provides a surface treatment liquid for metal having a sufficiently high film-forming property. The present invention relates to a surface treatment liquid for metal comprising an azole silane coupling agent, the surface treatment liquid further comprises (A) an organic acid ion having one to three acidic groups in one molecule; (B) an inorganic acid (or mineral acid) ion; (C) an alkali metal ion and/or an ammonium ion; and (D) a copper ion.
    Type: Application
    Filed: September 1, 2020
    Publication date: September 29, 2022
    Inventors: Noriaki YAMAJI, Tatsuya KOGA, Hirohiko HIRAO
  • TETRAZOLE SILANE COMPOUND, METHOD FOR SYNTHESIZING SAID COMPOUND AND USE THEREOF
    Publication number: 20210179642
    Abstract: The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.
    Type: Application
    Filed: February 24, 2021
    Publication date: June 17, 2021
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Noriaki YAMAJI, Takayuki MURAl, Miya TANIOKA, Shusaku IIDA, Masato KATSUMURA, Takahito IMAMINE, Masahiko TSUJINO, Tomoya MAE, Hirohiko HIRAO
  • Tetrazole silane compound, method for synthesizing said compound and use thereof
    Patent number: 11014946
    Abstract: The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: May 25, 2021
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Noriaki Yamaji, Takayuki Murai, Miya Tanioka, Shusaku Iida, Masato Katsumura, Takahito Imamine, Masahiko Tsujino, Tomoya Mae, Hirohiko Hirao
  • Tetrazole silane compound, method for synthesizing said compound and use thereof
    Patent number: 10975108
    Abstract: The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: April 13, 2021
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Noriaki Yamaji, Takayuki Murai, Miya Tanioka, Shusaku Iida, Masato Katsumura, Takahito Imamine, Masahiko Tsujino, Tomoya Mae, Hirohiko Hirao
  • TETRAZOLE SILANE COMPOUND, METHOD FOR SYNTHESIZING SAID COMPOUND AND USE THEREOF
    Publication number: 20200223875
    Abstract: The objectives of the present invention are: to provide a novel tetrazole silane compound, a method for synthesizing the same, and a silane coupling agent containing the tetrazole silane compound as a component; and to provide a surface treatment solution using the tetrazole silane compound, a method for surface treatment, and a method for adhering two different materials. The tetrazole silane compound according to the present invention is a compound represented by chemical formula (I). (In formula (I), X, R, and n are respectively the same as defined in the specification.
    Type: Application
    Filed: July 31, 2018
    Publication date: July 16, 2020
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Noriaki YAMAJI, Takayuki MURAl, Miya TANIOKA, Shusaku IIDA, Masato KATSUMURA, Takahito IMAMINE, Masahiko TSUJINO, Tomoya MAE, Hirohiko HIRAO
  • TRIAZOLE SILANE COMPOUND, METHOD FOR SYNTHESIZING SAID COMPOUND AND USE THEREOF
    Publication number: 20200031852
    Abstract: The abstract of the international application is being replace by the following abstract: The purpose of the present invention is to provide: a novel triazole silane compound and a method for synthesizing the same, and a silane coupling agent containing the triazole silane compound as a component; and a surface treatment solution, a surface treatment method, and a method for bonding two different materials, which use said triazole silane compound.
    Type: Application
    Filed: April 5, 2018
    Publication date: January 30, 2020
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Takayuki MURAI, Miya TANIOKA, Shusaku IIDA, Masato KATSUMURA, Noriaki YAMAJI, Takahito IMAMINE, Masahiko TSUJINO, Hirohiko HIRAO
  • Surface treating composition for copper and copper alloy and utilization thereof
    Patent number: 10398028
    Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: August 27, 2019
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Hirohiko Hirao, Noriaki Yamaji, Masato Nakanishi, Takayuki Murai
  • Azole silane compound, surface treatment solution, surface treatment method, and use thereof
    Patent number: 9688704
    Abstract: Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: June 27, 2017
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Shozo Miura, Takayuki Murai, Naoto Okumura, Miya Tanioka, Masato Katsumura, Noriaki Yamaji
  • Surface treating composition for copper and copper alloy and utilization thereof
    Patent number: 9649713
    Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: May 16, 2017
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Hirohiko Hirao, Noriaki Yamaji, Masato Nakanishi, Takayuki Murai
  • SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF
    Publication number: 20170064823
    Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
    Type: Application
    Filed: November 15, 2016
    Publication date: March 2, 2017
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Hirohiko HIRAO, Noriaki YAMAJI, Masato NAKANISHI, Takayuki MURAI
  • Surface treating composition for copper and copper alloy and utilization thereof
    Patent number: 9532493
    Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
    Type: Grant
    Filed: May 23, 2012
    Date of Patent: December 27, 2016
    Assignee: SHIKOKU CHEMICALS CORPORATION
    Inventors: Hirohiko Hirao, Noriaki Yamaji, Masato Nakanishi, Takayuki Murai
  • AZOLE SILANE COMPOUND, SURFACE TREATMENT SOLUTION, SURFACE TREATMENT METHOD, AND USE THEREOF
    Publication number: 20160368935
    Abstract: Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).
    Type: Application
    Filed: June 30, 2014
    Publication date: December 22, 2016
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Shozo MIURA, Takayuki MURAI, Naoto OKUMURA, Miya TANIOKA, Masato KATSUMURA, Noriaki YAMAJI
  • SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF
    Publication number: 20140131080
    Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
    Type: Application
    Filed: May 23, 2012
    Publication date: May 15, 2014
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Hirohiko Hirao, Noriaki Yamaji, Masato Nakanishi, Takayuki Murai
  • SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF
    Publication number: 20140097231
    Abstract: A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
    Type: Application
    Filed: May 23, 2012
    Publication date: April 10, 2014
    Applicant: SHIKOKU CHEMICALS CORPORATION
    Inventors: Hirohiko Hirao, Noriaki Yamaji, Masato Nakanishi, Takayuki Murai