Patents by Inventor Noriaki Yoshida

Noriaki Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060200974
    Abstract: In accordance with a component mounting method, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The method includes, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, the operation of holding the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.
    Type: Application
    Filed: May 11, 2006
    Publication date: September 14, 2006
    Inventors: Noriaki Yoshida, Takeshi Takeda, Akira Kabeshita
  • Publication number: 20060200975
    Abstract: A component mounting apparatus has a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a horizontal axis, component suction nozzles attached to the rotary member, driving mechanisms for rotating corresponding component suction nozzles, and a recognition section for recognizing components sucked by the component suction nozzle. Each of the first and second mounting head sections performs successive suction, recognition, posture adjustment, and mounting of the components.
    Type: Application
    Filed: May 8, 2006
    Publication date: September 14, 2006
    Inventors: Kanji Hata, Noriaki Yoshida
  • Publication number: 20060200979
    Abstract: Disclosed is a component mounting method. Moved in first and second orthogonal directions is a first mounting head section having first nozzles. The first mounting head is rotated such that the first nozzles rotate and successively pickup components from a first component supply table arranged on one side of a board transfer path. These components are then successively mounted onto a board positioned in the board transfer path. Moved in third and fourth orthogonal directions is a second mounting head section having second nozzles. The second mounting head section is rotated such that the second nozzles rotate and successively pickup components from a second component supply table arranged on an opposite side of the board transfer path. These components are then successively mounted onto the board while positioned in the board transfer path.
    Type: Application
    Filed: May 15, 2006
    Publication date: September 14, 2006
    Inventors: Kanji Hata, Noriaki Yoshida
  • Patent number: 7100278
    Abstract: A component mounting apparatus have a pair of component supply sections, and first and second mounting head sections. Each of the first and second head sections has a rotary member driven about a horizontal axis, component suction nozzles attached to the rotary member, driving mechanisms for rotating corresponding component suction nozzle, and a recognition section for recognizing components sucked by the component suction nozzle. Each of the first and second mounting head section performs successive suction, recognition, posture adjustment, and mounting of the components.
    Type: Grant
    Filed: February 22, 2002
    Date of Patent: September 5, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kanji Hata, Noriaki Yoshida
  • Publication number: 20060179645
    Abstract: In component mounting for executing component feed operation and component holding and pickup operation, a recipe for the component holding and pickup operation that is an operation program for executing the component holding and pickup operation is received in a head unit, and the component holding and pickup operation is executed on the basis of the recipe. In addition, a timing signal based on the execution is transmitted to a component feed unit, the recipe for the component feed operation for executing the component feed operation is received in the component feed unit, and the component feed operation is completed on the basis of the recipe and the timing signal transmitted from the head unit.
    Type: Application
    Filed: February 20, 2004
    Publication date: August 17, 2006
    Inventors: Toru Chikuma, Hiroto Miyazaki, Junichi Kawashima, Youichi Tanaka, Noriaki Yoshida
  • Patent number: 7069648
    Abstract: Disclosed is a component mounting method. Moved in first and second orthogonal directions is a first mounting head section having first nozzles. The first mounting head is rotated such that the first nozzles rotate and successively pickup components from a first component supply table arranged on one side of a board transfer path. These components are then successively mounted onto a board positioned in the board transfer path. Moved in third and fourth orthogonal directions is a second mounting head section having second nozzles. The second mounting head section is rotated such that the second nozzles rotate and successively pickup components from a second component supply table arranged on an opposite side of the board transfer path. These components are then successively mounted onto the board while positioned in the board transfer path.
    Type: Grant
    Filed: July 2, 2004
    Date of Patent: July 4, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kanji Hata, Noriaki Yoshida
  • Patent number: 7065866
    Abstract: In accordance with a component mounting method, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The method includes, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, the operation of holding the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: June 27, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Noriaki Yoshida, Takeshi Takeda, Akira Kabeshita
  • Patent number: 7036213
    Abstract: A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.
    Type: Grant
    Filed: August 21, 2001
    Date of Patent: May 2, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Akira Kabeshita, Naoto Mimura, Noriaki Yoshida, Yoshihiko Misawa, Takeyuki Kawase, Tetsutarou Hachimura, Toshiro Nishiwaki, Taira Ishii, Mitsuo Kawate, Hideaki Watanabe
  • Publication number: 20060016067
    Abstract: When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition operation is performed in either one of the two mounting units, the component placing or component holding operation is not performed in the other of the mounting units.
    Type: Application
    Filed: September 23, 2005
    Publication date: January 26, 2006
    Inventors: Noriaki Yoshida, Osamu Okuda, Akira Kabeshita, Takeyuki Kawase
  • Publication number: 20060000085
    Abstract: A first mounting unit and a second mounting unit capable of performing component holding, component recognition, and component placement for two boards independently of each other are provided. A first conveyance path for loading and unloading the first board, and a second conveyance path for loading and unloading the second board, are independently arranged.
    Type: Application
    Filed: September 9, 2005
    Publication date: January 5, 2006
    Inventors: Akira Kabeshita, Naoto Mimura, Noriaki Yoshida, Yoshihiko Misawa, Takeyuki Kawase, Tetsutarou Hachimura, Toshiro Nishiwaki, Taira Ishii, Mitsuo Kawate, Hideaki Watanabe
  • Patent number: 6971157
    Abstract: When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition operation is performed in either one of the two mounting units, the component placing or component holding operation is not performed in the other of the mounting units.
    Type: Grant
    Filed: October 30, 2000
    Date of Patent: December 6, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Noriaki Yoshida, Osamu Okuda, Akira Kabeshita, Takeyuki Kawase
  • Patent number: 6935017
    Abstract: There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.
    Type: Grant
    Filed: March 24, 2000
    Date of Patent: August 30, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kanji Hata, Noriaki Yoshida
  • Publication number: 20050135296
    Abstract: The invention provides a mobile communication system capable of swiftly performing handover involved in the change of wireless communication area in the minimum switching time required. Each of the base stations acquires from other base stations the traffic channel information of peripheral base stations in order to specify a user specific channel (USC) that can be used for the communication with the mobile station, and sends this traffic channel information to the mobile station located within its local wireless communication area by use of a slow associated control channel of its local traffic channel. The mobile station detects the receiving level of signal from the base station with which it is currently communicating. When the communication status is deteriorated, it switches to the USC of another base station on the basis of the traffic channel information of the peripheral base stations sent from the base station, and continues to communicate.
    Type: Application
    Filed: November 22, 2004
    Publication date: June 23, 2005
    Inventors: Noriaki Yoshida, Mitsuo Morita, Atsuyoshi Niki, Takamitsu Higano, Akihisa Miyakawa
  • Patent number: 6862803
    Abstract: A parts mounting method employing a suction section having a plurality of suction nozzles is provided. The suction section is moved to a parts supply section in which a plurality of parts are suctioned by the suction nozzles at the same time. The parts are then mounted onto a board. The suction nozzles are divided into groups: a first group having a shift amount within an allowable range in which simultaneous suction is possible; and a second group having a shift amount outside the allowable range in which simultaneous suction is possible. The parts are then sucked at the same time for each of the groups.
    Type: Grant
    Filed: August 28, 2001
    Date of Patent: March 8, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takeyuki Kawase, Junkei Shimizu, Hiroshi Uchiyama, Noriaki Yoshida
  • Publication number: 20040255453
    Abstract: There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.
    Type: Application
    Filed: July 23, 2004
    Publication date: December 23, 2004
    Inventors: Kanji Hata, Noriaki Yoshida
  • Publication number: 20040237297
    Abstract: There is provided a plurality of mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.
    Type: Application
    Filed: July 2, 2004
    Publication date: December 2, 2004
    Inventors: Kanji Hata, Noriaki Yoshida
  • Patent number: 6789310
    Abstract: There is provided a plurality of component mounting apparatuses for sucking a plurality of components by a mounting head section and successively mounting the components onto a board located at a board positioning section. The component mounting apparatuses are arranged in parallel to one another, and a board transfer path is provided so that it penetrates the component mounting apparatuses. Even when the number of components to be mounted onto the board increases, the components are mounted on the component supply tables of the component mounting apparatuses as distributed thereto, and therefore, the whole apparatus is not dimensionally increased. The component supply tables are fixedly installed so as to become free of vibration, and the mounting head section executes the suction and the mounting of the plurality of components. Therefore, the component mounting operation speed can be remarkably increased.
    Type: Grant
    Filed: January 21, 1998
    Date of Patent: September 14, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kanji Hata, Noriaki Yoshida
  • Patent number: 6785008
    Abstract: An offset measuring board is formed of a rectangular metal plate which can be positioned at a component mounting position by a positioning device and which has at least in proximity to one corner portion thereof a recognition through hole, serving as a recognition mark, having a black bottom face within a recessed portion.
    Type: Grant
    Filed: August 17, 2001
    Date of Patent: August 31, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Hiroshi Uchiyama, Tetsutarou Hachimura, Osamu Okuda, Noriaki Yoshida
  • Patent number: 6735856
    Abstract: The present invention includes a component placement apparatus that can obtain information on the presence/absence of hold members inexpensively and easily, and a component placement method carried out by the component placement apparatus. A replacement hold member detector for detecting the presence/absence of replacement hold members at a hold member change part is installed at a placement head. The presence/absence is detected by moving an XY-robot so as to scan the hold member change part equipped with the replacement hold member detector. At the same time, type information attached to the replacement hold members is rendered readable by the replacement hold member detector. One replacement hold member detector is enough according to the apparatus and method of the present invention. The presence/absence information of the hold members can be obtained inexpensively and easily.
    Type: Grant
    Filed: November 8, 1999
    Date of Patent: May 18, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Naoyuki Kitamura, Osamu Okuda, Noriaki Yoshida, Akira Kabeshita
  • Publication number: 20040033128
    Abstract: A first mounting unit (101) and a second mounting unit (102) capable of performing component holding, component recognition, and component placement for two boards (2a, 2b) independently of each other are provided. A first conveyance path for loading and unloading the first board (2a) and a second conveyance path for loading and unloading the second board (2b) are independently arranged.
    Type: Application
    Filed: June 26, 2003
    Publication date: February 19, 2004
    Inventors: Akira Kabeshita, Naoto Mimura, Noriaki Yoshida, Yoshihiko Misawa, Takeyuki Kawase, Tetsutarou Hachimura, Toshiro Nishiwaki, Taira Ishii, Mitsuo Kawate, Hideaki Watanabe