Abstract: A heat pipe includes a laminate formed by laminating a plurality of flat plates and having capillary tubes formed in the interior thereof, and a working fluid contained in the capillary tubes and operable to transfer heat. In the heat pipe, the laminate has insulating layers made of an insulating material and metal layers made of a metal material, which are alternately laminated.

Abstract: A power module includes a semiconductor device having a first and second arms, and gate driving circuit board. The first arm includes a first extending electrode, a first gate electrode of a first power device extending in a direction different from the first extending electrode, and a first output electrode extending in the different direction from the first gate electrode. The second arm stacked on the first arm includes a second extending electrode extending in the first extending electrode extending direction in an insulating state, a second gate electrode of a second power device, extending in the first gate electrode extending direction, and a second output electrode extending in the first output electrode extending direction with electrical connection thereto. The gate driving circuit board is disposed at the first and second gate electrodes extending side so as to face the semiconductor device.

Abstract: A power module includes a pair of power devices that are stacked with a plate-shaped output electrode arranged therebetween, and an N-electrode and a P-electrode that are stacked with the pair of power devices arranged therebetween. The output electrode is anisotropic such that the thermal conductivity in a direction orthogonal to the stacking direction is greater than the thermal conductivity in the stacking direction. Also, the output electrode extends in the orthogonal direction from a stacked area where the pair of power devices are stacked. The N-electrode and the P-electrode extend in the orthogonal direction while maintaining an opposing positional relationship.

Abstract: A heat pipe comprises a housing that has a heating section that is made of metal and is contacted by a heating element, a cooling section that is made of metal and is cooled by a cooling element, and a plurality of refrigerant flow channels formed inside the housing from the heating section to the cooling section; refrigerant that is enclosed inside the plurality of refrigerant flow channels; and heat-insulating layers that are disposed between the plurality of refrigerant flow channels located at least at the heating section in the housing.

Abstract: A power semiconductor element and a capacitor have their electrodes joined to each other in a module. The power semiconductor element is formed on a semiconductor substrate having first and second main surfaces. A power semiconductor module includes an electrode through which a main current flows, joined to the first main surface, an electrode through which the main current flows, joined to the second main surface, and a resin portion sealing the semiconductor substrate, the capacitor and the electrodes. The capacitor includes electrodes. The electrode of the capacitor and the electrode of the semiconductor element are joined to each other by solder such that surfaces exposed through the resin portion are arranged on one continuous surface on which a cooler can be attached. Therefore, a power semiconductor module can be provided in which the capacitor and the power semiconductor element can effectively be cooled and the surge voltage can be reduced.

Abstract: A power module includes a semiconductor device having a first and second arms, and gate driving circuit board. The first arm includes a first extending electrode, a first gate electrode of a first power device extending in a direction different from the first extending electrode, and a first output electrode extending in the different direction from the first gate electrode. The second arm stacked on the first arm includes a second extending electrode extending in the first extending electrode extending direction in an insulating state, a second gate electrode of a second power device, extending in the first gate electrode extending direction, and a second output electrode extending in the first output electrode extending direction with electrical connection thereto. The gate driving circuit board is disposed at the first and second gate electrodes extending side so as to face the semiconductor device.

Abstract: A power module includes a pair of power devices that are stacked with a plate-shaped output electrode arranged therebetween, and an N-electrode and a P-electrode that are stacked with the pair of power devices arranged therebetween. The output electrode is anisotropic such that the thermal conductivity in a direction orthogonal to the stacking direction is greater than the thermal conductivity in the stacking direction. Also, the output electrode extends in the orthogonal direction from a stacked area where the pair of power devices are stacked. The N-electrode and the P-electrode extend in the orthogonal direction while maintaining an opposing positional relationship.

Abstract: Electrode plates acting as a heat sink are arranged to sandwich a power transistor and a diode. Electrode plates at their surfaces opposite cooling elements at a portion opposite power transistor and diode are formed to be smaller in thickness at a portion adjacent to power transistor and diode substantially at the center than at a periphery. Cooling elements are disposed geometrically along electrode plates to sandwich electrode plates.

Abstract: A connector includes a fitting hole into which a signal line is fitted, a tapered portion formed to lead a tip portion of the signal line to the fitting hole, and a bonded portion for bonding the connector to a control substrate. The tapered portion has a tapered shape on a side where the signal line is inserted. The tapered shape is tilted from a peripheral portion of the tapered portion to the fitting hole in a direction along which the signal line is inserted, with the fitting hole set as a center.

Abstract: A PCU having an inverter and the like includes a connector electrically connecting the PCU and external equipment located outside the PCU, a safety bar attaching the connector for preventing the connector from being touched, and an ECU detecting that an interlock circuit is opened via an interlock signal line in response to detachment of the safety bar to shut off supply of electric power to the PCU.

Abstract: A power semiconductor element and a capacitor have their electrodes joined to each other in a module. The power semiconductor element is formed on a semiconductor substrate having first and second main surfaces. A power semiconductor module includes an electrode through which a main current flows, joined to the first main surface, an electrode through which the main current flows, joined to the second main surface, and a resin portion sealing the semiconductor substrate, the capacitor and the electrodes. The capacitor includes electrodes. The electrode of the capacitor and the electrode of the semiconductor element are joined to each other by solder such that surfaces exposed through the resin portion are arranged on one continuous surface on which a cooler can be attached. Therefore, a power semiconductor module can be provided in which the capacitor and the power semiconductor element can effectively be cooled and the surge voltage can be reduced.

Abstract: Electrode plates (52, 54) acting as a heat sink are arranged to sandwich a power transistor (Q1) and a diode (D1). Electrode plates (52, 54) at their surfaces opposite cooling elements (62, 64) at a portion opposite power transistor (Q1) and diode (D1) are formed to be smaller in thickness at a portion adjacent to power transistor (Q1) and diode (D1) substantially at the center than at a periphery.

Abstract: A connector includes a fitting hole into which a signal line is fitted, a tapered portion formed to lead a tip portion of the signal line to the fitting hole, and a bonded portion for bonding the connector to a control substrate. The tapered portion has a tapered shape on a side where the signal line is inserted. The tapered shape is tilted from a peripheral portion of the tapered portion to the fitting hole in a direction along which the signal line is inserted, with the fitting hole set as a center.

Abstract: A PCU having an inverter and the like includes a connector electrically connecting the PCU and external equipment located outside the PCU, a safety bar attaching the connector for preventing the connector from being touched, and an ECU detecting that an interlock circuit is opened via an interlock signal line in response to detachment of the safety bar to shut off supply of electric power to the PCU.