Abstract: A technique of accurately recognizing a semiconductor device and of specifying a package type thereof. By forming, on the package surface, projections having a geometric pattern such as a circle pattern using an ejector pin and by judging only presence or absence of the circular projections using an image processor, it is possible to reduce a risk of recognition failure of the geometric pattern even if the pattern has some omission in the constitutive line thereof or has any addition of a new line. For example, when the circular projections are provided on the surface of a package, an image processor reads only presence or absence of the circular projections even if disconnection of the line or addition of a line should occur, and this allows the circular projections to be always read as being “present”.

Abstract: A technique of accurately recognizing a semiconductor device and of specifying a package type thereof will be provided. By forming, on the package surface, projections having a geometric pattern such as a circle pattern using an ejector pin 11 and by judging only presence or absence of the circular projections using an image processor, it is made possible to reduce a risk of recognition failure of the geometric pattern even if the pattern has some omission in the constitutive line thereof or has any addition of a new line. For example, when the circular projections are provided on the surface of a package as shown in FIG. 6A, an image processor 17 reads only presence or absence of the circular projections even if disconnection of the line shown in FIG. 6B or addition of a line shown in FIG. 6C should occur, and this allows the circular projections to be always read as being “present”.