Abstract: A positive photoresist composition includes 3 to 80 parts by mass of a novolac phenol resin (B) relative to 100 parts by mass of a cresol novolac resin (A).

Abstract: An object of the present invention is to provide a radically curable compound which produces cured products with excellent heat resistance, and in order to achieve the object, the present invention provides a radically curable compound represented by general formula (1) below. (In the formula, R1 and R2 are each independently an alkyl group having 1 to 8 carbon atoms, R3 and R4 are each independently a hydrogen atom or a methyl group, m and n are each independently an integer of 1 to 4, and X is an aromatic hydrocarbon group or an aromatic hydrocarbon group substituted by an alkyl group having 1 to 8 carbon atoms.

Abstract: A positive photoresist composition includes 3 to 80 parts by mass of a novolac phenol resin (B) relative to 100 parts by mass of a cresol novolac resin (A).

Abstract: Provided is a positive photoresist composition containing a cresol novolac resin (A) manufactured using m-cresol, p-cresol, and formaldehyde as essential raw materials and a novolac phenolic resin (B) manufactured using o-cresol, resorcinol, and formaldehyde as essential raw materials. This positive photoresist composition has high sensitivity and high heat resistance at the same time, which have so far been difficult to achieve at the same time, at a higher level and is suitable for use as a resist in, for example, the manufacture of semiconductor devices such as ICs and LSIs, which have required formation of finer patterns with the increasing packing density in recent years, the manufacture of displays such as LCDs, and the manufacture of printing plates.

Abstract: Provided is a positive photoresist composition containing, as an essential component, a novolac phenolic resin (C) prepared by condensing an aromatic compound (A) represented by general formula (1) or (2) with an aliphatic aldehyde (B). This positive photoresist composition has high sensitivity and high heat resistance at the same time, and is suitable for use as a positive photoresist in, for example, the manufacture of semiconductor devices such as ICs and LSIs, the manufacture of displays such as LCDs, and the manufacture of printing plates. (In the formulas, R1, R2, and R3 are each independently an alkyl group having 1 to 8 carbon atoms; m, n, and p are each independently an integer of 0 to 4; q is an integer of 1 to (5?p); and s is an integer of 1 to (9?p).

Abstract: An object of the present invention is to provide a radically curable compound which produces cured products with excellent heat resistance, and in order to achieve the object, the present invention provides a radically curable compound represented by general formula (1) below. (In the formula, R1 and R2 are each independently an alkyl group having 1 to 8 carbon atoms, R3 and R4 are each independently a hydrogen atom or a methyl group, m and n are each independently an integer of 1 to 4, and X is an aromatic hydrocarbon group or an aromatic hydrocarbon group substituted by an alkyl group having 1 to 8 carbon atoms.

Abstract: Provided is a positive photoresist composition containing, as an essential component, a novolac phenolic resin (C) prepared by condensing an aromatic compound (A) represented by general formula (1) or (2) with an aliphatic aldehyde (B). This positive photoresist composition has high sensitivity and high heat resistance at the same time, and is suitable for use as a positive photoresist in, for example, the manufacture of semiconductor devices such as ICs and LSIs, the manufacture of displays such as LCDs, and the manufacture of printing plates. (In the formulas, R1, R2, and R3 are each independently an alkyl group having 1 to 8 carbon atoms; m, n, and p are each independently an integer of 0 to 4; q is an integer of 1 to (5?p); and s is an integer of 1 to (9?p).

Abstract: Provided is a positive photoresist composition containing a cresol novolac resin (A) manufactured using m-cresol, p-cresol, and formaldehyde as essential raw materials and a novolac phenolic resin (B) manufactured using o-cresol, resorcinol, and formaldehyde as essential raw materials. This positive photoresist composition has high sensitivity and high heat resistance at the same time, which have so far been difficult to achieve at the same time, at a higher level and is suitable for use as a resist in, for example, the manufacture of semiconductor devices such as ICs and LSIs, which have required formation of finer patterns with the increasing packing density in recent years, the manufacture of displays such as LCDs, and the manufacture of printing plates.