Abstract: In accordance with the invention, a disk chucking mechanism comprises a spindle for engaging the center hole of a metallic hub fastened in the center portion of a disk and a turntable that rotates as a single unit with the spindle. A drive pin is provided for engaging an off-center hole provided in the hub at a location off-center with respect to the center of the hub for regulating the movement of the hub. A chucking magnet is included which is fastened to the turntable for magnetically attracting the hub. The chucking magnet has a plurality of magnetic pieces.

Abstract: A holder for holding a magnetic sensitive element by which the magnetic sensitive element may be secured at a desired position so as to obtain favorable output characteristics and to reduce the area which the element occupies. The holder positions the magnetic sensitive element opposite a magnetic drum, within a magnetic encoder, and comprises a movable holder for holding a magnetic sensitive element connected to a flexible signal input/output member, a fixed holder fixed to a circuit board for holding the movable holder, and a guide which is biased against the movable holder to permit movement of the movable holder in a direction perpendicular to the magnetic sensitive surface of the magnetic sensitive element to a desired set position to thereby adjust the gap between the magnetic sensitive element and the magnetic drum.

Abstract: A brushless motor improving the structure for connecting the stator coil to the substrate to facilitate the operation of connection and assembling. The constitution comprises a rotor having a rotor magnet (11), a stator core (2) on which the stator coil (7) is wound to be opposed to the rotor magnet (11), a circuit substrate (4) connected to the stator coil (7), and an insulating core holder (3) which holds a terminal to which the coil will be connected and which mounts the stator core (2), the core holder (3) being placed on said circuit substrate (4) and said terminal being soldered to terminal portions on the circuit substrate (4).