Patents by Inventor Norihiko Ikai

Norihiko Ikai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Paste for through-hole filling and printed wiring board using the same
    Patent number: 6193910
    Abstract: A paste for filling through-holes of a printed wiring board contains 100 parts by weight of an epoxy resin composition containing 90 to 99.5 parts by weight of an epoxy resin and 0.5 to 10 parts by weight of a curing agent; and (B) 500 to 1000 parts by weight of a metallic filler having an average particle size of 0.5 to 20 &mgr;m. The paste has a viscosity of not higher than 20,000 poise at 25° C. and a volatile content of not more than 1.0% when heated in a filling step. The paste exhibits such shrink-resistance properties that when a first cured resin obtained by heating in a filling step is re-heated and cooled in a solder reflow step to obtain a second cured resin, the shrinkage percentage of the first cured resin to the second cured resin in the longitudinal direction of the through-hole is not greater than 0.1%.
    Type: Grant
    Filed: November 12, 1998
    Date of Patent: February 27, 2001
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Norihiko Ikai, Hiroshi Sumi, Masahiko Okuyama, Toshifumi Kojima