Abstract: The present disclosure provides an optical waveguide capable of enhancing the suppression of crosstalk. This optical waveguide includes: under claddings; cores for light propagation arranged in side-by-side relation on surfaces of the respective under claddings; over claddings covering the cores; and a light absorbing part provided between adjacent ones of the cores and adjacent to light exit member connecting portions for connection to light exit members, the light exit member connecting portions being disposed in first end portions of the adjacent cores, the light absorbing part being in non-contacting relationship with the cores. The light absorbing part contains a light absorbing agent having an ability to absorb light exiting the light exit members. The optical waveguide is produced on a surface of a substrate.

Abstract: The present disclosure provides an optical waveguide capable of enhancing the suppression of crosstalk. The optical waveguide includes: under claddings; cores for light propagation arranged in side-by-side relation on surfaces of the respective under claddings; over claddings covering the cores; and a light absorbing part provided between adjacent ones of the cores, the light absorbing part being in non-contacting relationship with the cores. The light absorbing part contains a light absorbing agent having an ability to absorb light propagating in the cores. The optical waveguide is produced on a surface of a substrate.

Abstract: The present disclosure provides an optical waveguide capable of enhancing the suppression of crosstalk. This optical waveguide includes: under claddings; cores for light propagation arranged in side-by-side relation on surfaces of the respective under claddings; over claddings covering the cores; and a light absorbing part provided between adjacent ones of the cores and adjacent to light exit member connecting portions for connection to light exit members, the light exit member connecting portions being disposed in first end portions of the adjacent cores, the light absorbing part being in non-contacting relationship with the cores. The light absorbing part contains a light absorbing agent having an ability to absorb light exiting the light exit members. The optical waveguide is produced on a surface of a substrate.

Abstract: A coating film removing apparatus includes: a substrate holding mechanism that holds a substrate; an end surface detection mechanism that detects an end surface of the substrate; an end portion removing mechanism that removes an end portion of the coating film applied on the substrate; and a moving mechanism that moves the substrate holding mechanism or the end portion removing mechanism, wherein the end portion removing mechanism removes the end portion of the coating film applied on the substrate while the moving mechanism is relatively moving the substrate holding mechanism and the end portion removing mechanism according to the end surface of the substrate detected by the end surface detection mechanism.

Abstract: A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal supporting layer; roughening the surface of the insulating layer; forming a conductive pattern on the insulating layer; and inspecting the presence or absence of a defect of the conductive pattern by using an inspection device provided with a light emitting portion emitting incident light that enters the insulating layer and the conductive pattern and a light receiving portion receiving reflected light that is reflected from the incident light. The incident light has a wavelength in the range of 435 to 500 nm and includes inclined light that inclines so as to form an angle of more than 0° to not more than 30° with respect to the optical axis thereof.

Abstract: The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit.

Abstract: A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal supporting layer; roughening the surface of the insulating layer; forming a conductive pattern on the insulating layer; and inspecting the presence or absence of a defect of the conductive pattern by using an inspection device provided with a light emitting portion emitting incident light that enters the insulating layer and the conductive pattern and a light receiving portion receiving reflected light that is reflected from the incident light. The incident light has a wavelength in the range of 435 to 500 nm and includes inclined light that inclines so as to form an angle of more than 0° to not more than 30° with respect to the optical axis thereof.

Abstract: A coating film removing apparatus includes: a substrate holding mechanism that holds a substrate; an end surface detection mechanism that detects an end surface of the substrate; an end portion removing mechanism that removes an end portion of the coating film applied on the substrate; and a moving mechanism that moves the substrate holding mechanism or the end portion removing mechanism, wherein the end portion removing mechanism removes the end portion of the coating film applied on the substrate while the moving mechanism is relatively moving the substrate holding mechanism and the end portion removing mechanism according to the end surface of the substrate detected by the end surface detection mechanism.

Abstract: A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal supporting layer; roughening the surface of the insulating layer; forming a conductive pattern on the insulating layer; and inspecting the presence or absence of a defect of the conductive pattern by using an inspection device provided with a light emitting portion emitting incident light that enters the insulating layer and the conductive pattern and a light receiving portion receiving reflected light that is reflected from the incident light. The incident light has a wavelength in the range of 435 to 500 nm and includes inclined light that inclines so as to form an angle of more than 0° to not more than 30° with respect to the optical axis thereof.

Abstract: This bonding system comprises a bonding processing station and a carry in/out station which carries a substrate to be processed, a supporting substrate or a bonded substrate that is obtained by bonding a substrate to be processed and a supporting substrate into/out of the bonding processing station. The bonding processing station comprises a coating device which applies an adhesive to the substrate to be processed or the supporting substrate and a heat treatment device that heats the substrate, to which the adhesive has been applied. In addition, a bonding device turns over one of the substrates, and presses the overturned substrate against the other substrate with an adhesive therebetween, thereby bonding the substrates together. A conveyance region conveys the substrate(s) to the coating device, the heat treatment device and the bonding device.

Abstract: The present disclosure includes: a joint processing station including a coating unit applying an adhesive to a processing target substrate or a supporting substrate, a first heat processing unit heating the substrates coated with the adhesive, a second heat processing unit heating the substrates to a higher temperature, a reversing unit reversing front and rear surfaces of the substrate, a joint unit joining the processing target substrate and the supporting substrate together by pressing them, and a transfer region for transferring the substrates to the units; and a transfer-in/out station transferring the substrates into/from the joint processing station.

Abstract: The present invention is used for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive into the processing target substrate and the supporting substrate, and includes: a separation processing station performing predetermined processing on the processing target substrate, the supporting substrate, and the superposed substrate; a transfer-in/out station transferring the substrates into/from the separation processing station; and a transfer unit transferring the substrates between the separation processing station and the transfer-in/out station, wherein the separation processing station includes: a separation unit separating the superposed substrate into the processing target substrate and the supporting substrate; a first cleaning unit cleaning the processing target substrate separated in the separation unit; and a second cleaning unit cleaning the supporting substrate separated in the separation unit.

Abstract: A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal supporting layer; roughening the surface of the insulating layer; forming a conductive pattern on the insulating layer; and inspecting the presence or absence of a defect of the conductive pattern by using an inspection device provided with a light emitting portion emitting incident light that enters the insulating layer and the conductive pattern and a light receiving portion receiving reflected light that is reflected from the incident light. The incident light has a wavelength in the range of 435 to 500 nm and includes inclined light that inclines so as to form an angle of more than 0° to not more than 30° with respect to the optical axis thereof.

Abstract: In a lockup control system of an automatic transmission with a lockup torque converter, a controller pre-stores a predetermined lockup control map including at least a predetermined coast slip lockup area, within which the system executes a slip lockup control mode under the vehicle's coasting condition, so that a speed difference between input and output speeds of the torque converter is brought closer to a predetermined value. The controller determines whether a first transition from the vehicle's driving condition to the predetermined coast slip lockup area occurs in a release mode of the lockup clutch or a second transition from the vehicle's coasting condition to the predetermined coast slip lockup area occurs in the release mode. When the first transition occurs, the lockup clutch is conditioned in the slip lockup control mode. When the second transition occurs, the lockup clutch is conditioned in the release mode.

Abstract: In a lockup control system of an automatic transmission with a lockup torque converter, a controller pre-stores a predetermined lockup control map including at least a predetermined coast slip lockup area, within which the system executes a slip lockup control mode under the vehicle's coasting condition, so that a speed difference between input and output speeds of the torque converter is brought closer to a predetermined value. The controller determines whether a first transition from the vehicle's driving condition to the predetermined coast slip lockup area occurs in a release mode of the lockup clutch or a second transition from the vehicle's coasting condition to the predetermined coast slip lockup area occurs in the release mode. When the first transition occurs, the lockup clutch is conditioned in the slip lockup control mode. When the second transition occurs, the lockup clutch is conditioned in the release mode.

Abstract: An artificial pancreas includes a blood sugar determination unit for measuring the blood sugar of the living body, an injection unit including a container for a blood sugar control agent and a feed pump for the control agent and adapted to inject the control agent into the living body and an arithmetic control unit for calculating the dose of the control agent and controlling the pump of the injection unit in accordance with the results of the calculation. The pump includes a disc-shaped roller holder which holds a plurality of rollers around its periphery. Each roller includes flanges at opposite ends. An elastic tube extends around the rollers under tension. Magnets are embedded along the periphery of the roller supports and are sensed to determine the amount of pumping which has occurred. Tubular stoppers are provided within stepped grooves in the pump housing to receive the ends of the elastic tubes.

Abstract: An artificial pancreas comprising a blood sugar determination unit for measuring the blood sugar of the living body, an injection unit including a container for a blood sugar control agent and a feed pump for the control agent and adapted to inject the control agent into the living body, and an arithmetic control unit for calculating the dose of the control agent based on the blood sugar measurement and controlling the pump of the injection unit in accordance with the result of calculation. The blood sugar determination unit has an electrode assembly to be inserted into the living body for measuring the blood sugar. The feed pump comprises a plurality of rollers rotatably mounted on a rotatable roller holder along the outer periphery of the holder and an elastic tube having an intermediate portion reeved around some of the rollers under tension.