Patents by Inventor Norihiko Takada
Norihiko Takada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130205586Abstract: An elastic wave device includes a substrate, a vibrating portion located on a first main surface of the substrate, pads located on the first main surface of the substrate and electrically connected to electrodes of the vibrating portion, a supporting layer arranged on the first main surface of the substrate so as to enclose the vibrating portion, a sheet-shaped cover layer composed of resin including synthetic rubber and disposed on the supporting layer so as to form a hollow space around the periphery of the vibrating portion, a protective layer composed of resin having resistance to flux and disposed on a side of the cover layer remote from the supporting layer, via conductors extending through the protective layer, the cover layer, and the supporting layer and connected to the pads, and external electrodes including solder bumps, disposed at ends of the via conductors adjacent to the protective layer.Type: ApplicationFiled: August 10, 2012Publication date: August 15, 2013Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Norihiko TAKADA, Atsushi KADOI, Hayami KUDO
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Patent number: 8461940Abstract: An elastic wave device has a structure that prevents flux from flowing into a hollow space of the device during mounting of the device using solder bumps.Type: GrantFiled: August 5, 2010Date of Patent: June 11, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Norihiko Takada, Atsushi Kadoi, Hayami Kudo
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Patent number: 8072118Abstract: A highly reliable surface acoustic wave device includes wiring lines that do not easily rupture at a three-dimensional wiring portion. The surface acoustic wave device includes a plurality of surface acoustic wave elements located on a piezoelectric substrate, a supporting member arranged on the piezoelectric substrate so as to enclose vibrating portions including electrodes such as IDT electrodes, and a cover member stacked so as to cover openings of the supporting member and to define hollow spaces facing vibrating electrodes. Furthermore, a three-dimensional wiring portion at which a first wiring line and a second wiring line are stacked with an insulating layer interposed therebetween is provided on the piezoelectric substrate. The three-dimensional wiring portion is enclosed by the supporting member, and thereby disposed inside a space enclosed by the piezoelectric substrate, the supporting member, and the cover member.Type: GrantFiled: September 9, 2010Date of Patent: December 6, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Ryoichi Omote, Norihiko Takada
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Patent number: 7944125Abstract: A surface acoustic wave device causing less wear of a dicing blade and causing less drop in a dicing speed is manufactured from a mother laminate with high yield and high precision. The surface acoustic wave device is manufactured by dicing a piezoelectric wafer. The surface acoustic wave device includes a piezoelectric substrate resulting from dicing the piezoelectric wafer, IDT electrodes and pad electrodes located on a top surface of the piezoelectric substrate. A support layer having an opening opened to the IDT electrodes is provided. An outline edge of the support layer is inside an outline edge of the top surface of the piezoelectric substrate. A cover made of an insulating material is disposed on the support layer to close the opening of the support layer. In plan view, the outline edge of the cover is aligned with the outline edge of the piezoelectric substrate.Type: GrantFiled: June 11, 2010Date of Patent: May 17, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Norihiko Takada, Hayami Kudo
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Publication number: 20100327694Abstract: A highly reliable surface acoustic wave device includes wiring lines that do not easily rupture at a three-dimensional wiring portion. The surface acoustic wave device includes a plurality of surface acoustic wave elements located on a piezoelectric substrate, a supporting member arranged on the piezoelectric substrate so as to enclose vibrating portions including electrodes such as IDT electrodes, and a cover member stacked so as to cover openings of the supporting member and to define hollow spaces facing vibrating electrodes. Furthermore, a three-dimensional wiring portion at which a first wiring line and a second wiring line are stacked with an insulating layer interposed therebetween is provided on the piezoelectric substrate. The three-dimensional wiring portion is enclosed by the supporting member, and thereby disposed inside a space enclosed by the piezoelectric substrate, the supporting member, and the cover member.Type: ApplicationFiled: September 9, 2010Publication date: December 30, 2010Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Ryoichi OMOTE, Norihiko TAKADA
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Publication number: 20100289600Abstract: An elastic wave device has a structure that prevents flux from flowing into a hollow space of the device during mounting of the device using solder bumps.Type: ApplicationFiled: August 5, 2010Publication date: November 18, 2010Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Norihiko TAKADA, Atsushi KADOI, Hayami KUDO
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Publication number: 20100253182Abstract: A surface acoustic wave device causing less wear of a dicing blade and causing less drop in a dicing speed is manufactured from a mother laminate with high yield and high precision. The surface acoustic wave device is manufactured by dicing a piezoelectric wafer. The surface acoustic wave device includes a piezoelectric substrate resulting from dicing the piezoelectric wafer, IDT electrodes and pad electrodes located on a top surface of the piezoelectric substrate. A support layer having an opening opened to the IDT electrodes is provided. An outline edge of the support layer is inside an outline edge of the top surface of the piezoelectric substrate. A cover made of an insulating material is disposed on the support layer to close the opening of the support layer. In plan view, the outline edge of the cover is aligned with the outline edge of the piezoelectric substrate.Type: ApplicationFiled: June 11, 2010Publication date: October 7, 2010Applicant: Murata Manufacturing Co., Ltd.Inventors: Norihiko TAKADA, Hayami Kudo
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Patent number: 6940369Abstract: A surface acoustic wave filter has one or more surface acoustic wave filter elements having at least two comb-shaped electrode portions disposed along a propagation direction of a surface acoustic wave and first and second balanced terminals connected to the comb-shaped electrode portions provided on a piezoelectric substrate. The surface acoustic wave filter is housed in a packaging member such that the difference in capacitance between electrodes on the piezoelectric substrate, which are connected to the first and second balanced terminals, is greatly reduced.Type: GrantFiled: May 16, 2003Date of Patent: September 6, 2005Assignee: Murata Manufacturing Co., Ltd.Inventors: Norihiko Nakahashi, Masaru Yata, Norihiko Takada
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Publication number: 20040260580Abstract: A facility reservation apparatus (1) that includes a reservation receiving portion (11) that receives input of reservation information including a reservation date/time from a user terminal (2) external to the system, a related-information portion (12) that obtains information related to facility use from related-information storage devices (3 to 6) enabling a user to use the time until the reservation effectively, and an information providing portion (13) that, in the event of input of a request for information related to facility use from the user terminal (2), causes the related-information portion (12) to obtain information related to facility use, and provides the obtained information related to facility use to the user terminal (2).Type: ApplicationFiled: September 16, 2003Publication date: December 23, 2004Inventor: Norihiko Takada
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Patent number: 6815834Abstract: An electronic component includes an electronic element and a substrate to which the electronic element is mounted, the electronic element and the substrate being electrically or mechanically connected to each other by at least three bumps. Both the value obtained by dividing the total bonding-area of the bumps bonded to the electronic element by the mass of the electronic element and the value obtained by dividing the total bonding-area of the bumps bonded to the substrate by the mass of the electronic element are at least about 8.8 mm2/g.Type: GrantFiled: April 22, 2003Date of Patent: November 9, 2004Assignee: Murata Manufacturing Co., Ltd.Inventors: Kazunobu Shimoe, Mitsuo Takeda, Toshiaki Takata, Norihiko Takada
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Patent number: 6757946Abstract: A wire bonding method for ultrasonically joining two connecting electrodes with a wire includes the steps of forming at least one of the connecting electrodes with tantalum and forming the wire of one of a metallic wire having a fracture load of about 21 g or greater and a metallic wire having a fracture stress of 290 N/mm2 or greater.Type: GrantFiled: March 8, 2001Date of Patent: July 6, 2004Assignee: Murata Manufacturing Co., Ltd.Inventors: Norihiko Takada, Hisamitsu Kamenaga, Shingo Iwasa
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Publication number: 20040012465Abstract: A surface acoustic wave filter has one or more surface acoustic wave filter elements having at least two comb-shaped electrode portions disposed along a propagation direction of a surface acoustic wave and first and second balanced terminals connected to the comb-shaped electrode portions provided on a piezoelectric substrate. The surface acoustic wave filter is housed in a packaging member such that the difference in capacitance between electrodes on the piezoelectric substrate, which are connected to the first and second balanced terminals, is greatly reduced.Type: ApplicationFiled: May 16, 2003Publication date: January 22, 2004Inventors: Norihiko Nakahashi, Masaru Yata, Norihiko Takada
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Publication number: 20030160334Abstract: An electronic part is provided (1) containing an electronic element (2) and a substrate (3) to which the electronic element (2) is mounted, the electronic element (2) and the substrate (3) being electrically or mechanically connected to each other by means of at least three bumps (4). Both the value obtained by dividing the total bonding-area of the bumps (4) bonded to the electronic element (2) by the mass of the electronic element (2) and the value obtained by dividing the total bonding-area of the bumps (4) bonded to the substrate (3) by the mass of the electronic element (2) are at least 8.8 mm2/g.Type: ApplicationFiled: April 22, 2003Publication date: August 28, 2003Inventors: Kazunobu Shimoe, Mitsuo Takeda, Toshiaki Takata, Norihiko Takada
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Patent number: 6557225Abstract: A method of producing a surface acoustic wave device by use of a flip chip process, includes the steps of forming on a piezoelectric substrate at least one interdigital transducer and a plurality of electrode pads electrically connected to the interdigital transducer, forming bumps on the respective electrode pads, and providing an insulating film at a region other than a region where the bumps are formed.Type: GrantFiled: April 12, 2001Date of Patent: May 6, 2003Assignee: Murata Manufacturing Co., Ltd.Inventors: Toshiaki Takata, Shuji Yamato, Norihiko Takada
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Publication number: 20010029650Abstract: A method of producing a surface acoustic wave device by use of a flip chip process, includes the steps of forming on a piezoelectric substrate at least one interdigital transducer and a plurality of electrode pads electrically connected to the interdigital transducer, forming bumps on the respective electrode pads, and providing an insulating film at a region other than a region where the bumps are formed.Type: ApplicationFiled: April 12, 2001Publication date: October 18, 2001Applicant: Murata Manufacturing Co., Ltd.Inventors: Toshiaki Takata, Shuji Yamato, Norihiko Takada
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Publication number: 20010022484Abstract: A wire bonding method for ultrasonically joining two connecting electrodes with a wire includes the steps of forming at least one of the connecting electrodes with tantalum and forming the wire of one of a metallic wire having a fracture load of about 21 g or greater and a metallic wire having a fracture stress of 290 N/mm2 or greater.Type: ApplicationFiled: March 8, 2001Publication date: September 20, 2001Applicant: Murata Manufacturing Co., Ltd.Inventors: Norihiko Takada, Hisamitsu Kamenaga, Shingo Iwasa