Patents by Inventor Norihiko Yamazaki

Norihiko Yamazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6942156
    Abstract: In an IC card, an IC module constructed by mounting an IC chip and an antenna circuit on a substrate is sandwiched between at least a pair of exterior films. The IC chip is sealed with resin on its outside and reinforced by a reinforcement material having a substantially circular shape with a diameter greater than a longest dimension value of the IC chip. The height variation amount of the shape of the reinforcement material on a surface thereof is within a range of 20 ?m or less. The reliability of the IC chip is ensured while the outer appearance of the card and print characteristic are not degraded.
    Type: Grant
    Filed: November 22, 2001
    Date of Patent: September 13, 2005
    Assignee: Sony Corporation
    Inventors: Eiji Ohta, Norihiko Yamazaki, Shinichi Matsumura
  • Publication number: 20030062420
    Abstract: In an IC card, an IC module constructed by mounting an IC chip and an antenna circuit on a substrate is sandwiched between at least a pair of exterior films. The IC chip is sealed with resin on its outside and reinforced by a reinforcement material having a substantially circular shape with a diameter greater than a longest dimension value of the IC chip. The height variation amount of the shape of the reinforcement material on a surface thereof is within a range of 20 &mgr;m or less. The reliability of the IC chip is ensured while the outer appearance of the card and print characteristic are not degraded.
    Type: Application
    Filed: July 25, 2002
    Publication date: April 3, 2003
    Inventors: Eiji Ohta, Norihiko Yamazaki, Shinichi Matsumura