Abstract: A polishing pad for polishing a silicon carbide substrate contains polyurethane and abrasive grains fixed by the polyurethane, and has a loss tangent (tan ?) represented by loss modulus (E?)/storage modulus (E?) of 0.1 to 0.35 at 30° C. and a glass transition temperature of 40° C. to 65° C. Also, a polishing method for polishing the silicon carbide substrate includes a holding step of holding a workpiece having the silicon carbide substrate by a chuck table and a polishing step of polishing the silicon carbide substrate by the polishing pad.

Abstract: A setting method of a protective component includes a resin supply step of supplying a thermoplastic resin to a flat support surface of a support table, and a protective component forming step of shaping the thermoplastic resin into a sheet shape through pressing and spreading the thermoplastic resin along the support surface while heating and softening the thermoplastic resin to form a protective component of the thermoplastic resin in the sheet shape on the support surface. The setting method includes also a protective component bonding step of bringing a front surface that is one surface of the workpiece into tight contact with one surface of the protective component in the sheet shape and heating the protective component in tight contact to bond the protective component to the workpiece, and a post-bonding cooling step of cooling the protective component heated in the protective component bonding step.

Abstract: A method of placing a protective member on a workpiece includes a sheet producing step of heating a plate-shaped thermoplastic resin to soften or melt the same while gripping and pulling outer edges of the thermoplastic resin in at least four directions to produce a sheet-like protective member, and after the sheet producing step, an integrating step of heating and bringing the sheet-like protective member into intimate contact with the workpiece to integrate the workpiece and the protective member with each other.

Abstract: There is provided a manufacturing method of a protective-component-provided workpiece. The manufacturing method of a protective-component-provided workpiece includes a step of dissolving a thermoplastic resin whose solubility parameter is equal to or higher than 8.5, in a liquid ultraviolet-curable resin, to prepare a liquid mixed resin, a step of supplying the mixed resin to a support surface of a support table to form a resin layer with a predetermined thickness, a step of irradiating the resin layer with ultraviolet rays and curing the resin layer to form a protective component with a sheet shape, and a step of heating the sheet-shaped protective component before or after one surface of the sheet-shaped protective component and one surface of the workpiece are brought into close contact with each other, and causing the sheet-shaped protective component to come into close contact with the workpiece and integrate with the workpiece.

Abstract: Provided is a polishing liquid that is used when one surface of a wafer is polished by use of a fixed abrasive grain polishing pad with abrasive grains fixed in the pad, in which an organic salt that exhibits a basic property by hydrolysis and contains no metal and an organic base that contains no metal are dissolved, and no abrasive grains are contained. Preferably, the organic salt includes a strong basic cation and a weak acidic anion, and the organic base contains at least one of ammonia, an amine, and a basic amino acid.

Abstract: A setting method of a protective component includes a resin supply step of supplying a thermoplastic resin to a flat support surface of a support table, and a protective component forming step of shaping the thermoplastic resin into a sheet shape through pressing and spreading the thermoplastic resin along the support surface while heating and softening the thermoplastic resin to form a protective component of the thermoplastic resin in the sheet shape on the support surface. The setting method includes also a protective component bonding step of bringing a front surface that is one surface of the workpiece into tight contact with one surface of the protective component in the sheet shape and heating the protective component in tight contact to bond the protective component to the workpiece, and a post-bonding cooling step of cooling the protective component heated in the protective component bonding step.

Abstract: A package substrate cutting jig table for use in cutting a package substrate is provided. The jig table includes a jig base and a holding member adapted to be detachably mounted on the jig base. The holding member includes a holding surface for holding the package substrate, a plurality of escape grooves formed on the holding surface for preventing the interference of a cutting blade with the holding member, the escape grooves corresponding to a plurality of division lines formed on the package substrate, and a plurality of suction holes formed in a plurality of separate regions defined by the escape grooves on the holding surface. The holding member is formed of a material having a dynamic viscoelastic modulus ranging from 0.16 to 0.41.

Abstract: A method of polishing an SiC substrate in contact with a polishing pad containing abrasive grains includes the steps of polishing the SiC substrate while supplying an acid polishing liquid to an area where the SiC substrate and the polishing pad contact each other, and thereafter, polishing the SiC substrate while supplying only water to the area while stopping supplying the acid polishing liquid.

Abstract: A method of manufacturing a small-diameter wafer from a wafer having one face and the other face, the one face being mirror-polished, is provided. The method includes a protective member covering step of covering the one face of the wafer with a first protective member and the other face of the wafer with a second protective member, a cut-out step of cutting out a plurality of small-diameter wafers from the wafer covered with the first protective member and the second protective member, a chamfering step of chamfering an outer periphery portion of each of the plurality of small-diameter wafers, and a protective member removing step of removing the first protective member and the second protective member from each of the plurality of small-diameter wafers.

Abstract: A polishing pad of a polishing apparatus contains abrasive grains, and is formed with a plurality of grooves in an adhesion surface to be adhered to a support base. The polishing pad has a plurality of communication holes penetrating to a flat polishing surface, and a polishing liquid is distributed into the plurality of grooves and is supplied to the polishing surface through the plurality of communication holes.

Abstract: A package substrate cutting jig table for use in cutting a package substrate is provided. The jig table includes a jig base and a holding member adapted to be detachably mounted on the jig base. The holding member includes a holding surface for holding the package substrate, a plurality of escape grooves formed on the holding surface for preventing the interference of a cutting blade with the holding member, the escape grooves corresponding to a plurality of division lines formed on the package substrate, and a plurality of suction holes formed in a plurality of separate regions defined by the escape grooves on the holding surface. The holding member is formed of a material having a dynamic viscoelastic modulus ranging from 0.16 to 0.41.