Patents by Inventor Norihisa Eguchi

Norihisa Eguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of replenishing an oxidation suppressing element in a solder bath
    Patent number: 7628308
    Abstract: The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten solder in the bath with a replenishment solder alloy which supplies the oxidation suppressing element to the solder bath at at least the rate at which the oxidation suppressing element is consumed during soldering. When the oxidation suppressing element is P, the concentration of P in the replenishment solder alloy is preferably 60-100 ppm.
    Type: Grant
    Filed: January 8, 2003
    Date of Patent: December 8, 2009
    Assignees: Senju Metal Industry Co., Ltd., Matushita Electric Industrial Co., Ltd.
    Inventors: Masayuki Ojima, Haruo Suzuki, Hirofumi Nogami, Norihisa Eguchi, Osamu Munekata, Minoru Ueshima