Abstract: The present invention provides a phenolic resin molding material comprising:a phenolic resin composition comprising 100 parts by weight of a phenolic resin, 10-70 parts by weight of an organic filler and 10-70 parts by weight of an inorganic filler, anda releasant consisting of 0.2-4 parts by weight of an amide wax having a melting point of 130.degree.-150.degree. C. and 0.1-2 parts by weight of an ester wax and/or a partially saponified ester wax each having a melting point of 80.degree.-105.degree. C.This phenolic resin molding material can provide a molded article which has good releasability and which shows excellent adherence to coating film formed thereon and excellent surface smoothness even after treatment at a high temperature and a high humidity.

Abstract: A phenolic resin molding material comprising a phenolic resin, an organic filler, an inorganic filler and a liquid substance having a boiling point of 80.degree.-150.degree. C., said phenolic resin comprising, as its main component, a novolac type phenolic resin wherein the ratio of the o-methylene bond to the p-methylene bond with respect to the phenol nucleus ranges from 1.0 to 2.5.