Patents by Inventor Norihisa HARANO

Norihisa HARANO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shape measurement method and shape measurement device
    Patent number: 10371503
    Abstract: A measurement unit measures a cross-sectional shape of an edge part of a semiconductor wafer. The measurement unit measures a cross-sectional shape of an edge part of a support member. The measurement unit measures a cross-sectional shape of an edge part of a laminated wafer. An analysis unit calculates a thickness of an adhesive agent by subtracting a thickness of the semiconductor wafer and a thickness of the support member from a thickness of the laminated wafer.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: August 6, 2019
    Assignee: KOBELCO RESEARCH INSTITUTE, INC.
    Inventors: Hidehisa Hashizume, Shunsuke Takami, Norihisa Harano
  • SHAPE MEASUREMENT METHOD AND SHAPE MEASUREMENT DEVICE
    Publication number: 20180321027
    Abstract: A measurement unit measures a cross-sectional shape of an edge part of a semiconductor wafer. The measurement unit measures a cross-sectional shape of an edge part of a support member. The measurement unit measures a cross-sectional shape of an edge part of a laminated wafer. An analysis unit calculates a thickness of an adhesive agent by subtracting a thickness of the semiconductor wafer and a thickness of the support member from a thickness of the laminated wafer.
    Type: Application
    Filed: October 5, 2016
    Publication date: November 8, 2018
    Applicant: KOBELCO RESEARCH INSTITUTE, INC.
    Inventors: Hidehisa HASHIZUME, Shunsuke TAKAMI, Norihisa HARANO