Abstract: A sensor element control device which is connectable to a sensor element including a drive unit and a detection unit, includes a drive circuit that outputs a drive signal to the drive unit; a detection circuit that generates a detection signal based on a signal output from the detection unit; a diagnostic signal generation circuit that generates a diagnostic signal having a frequency component corresponding to a detuning frequency which is a difference frequency between a drive frequency which is a frequency at which the drive unit vibrates and a detection frequency which is a frequency at which the detection unit vibrates; and a fault diagnosis circuit that performs fault diagnosis based on a signal output from the detection unit when the diagnostic signal is superimposed on the drive signal.

Abstract: A sensor element control device which is connectable to a sensor element including a drive unit and a detection unit, includes a drive circuit that outputs a drive signal to the drive unit; a detection circuit that generates a detection signal based on a signal output from the detection unit; a diagnostic signal generation circuit that generates a diagnostic signal having a frequency component corresponding to a detuning frequency which is a difference frequency between a drive frequency which is a frequency at which the drive unit vibrates and a detection frequency which is a frequency at which the detection unit vibrates; and a fault diagnosis circuit that performs fault diagnosis based on a signal output from the detection unit when the diagnostic signal is superimposed on the drive signal.

Abstract: An electronic device includes a vibrating element that detects a predetermined physical quantity, an integrated circuit that is electrically connected to the vibrating element, and a ceramic package. The ceramic package is provided with a first external terminal and a second external terminal to which a constant potential is supplied. The first external terminal is electrically connected to the second external terminal in a first mode, and is electrically connected to an internal node of the integrated circuit in a second mode.

Abstract: An electronic device includes a vibrating element that detects a predetermined physical quantity, an integrated circuit that is electrically connected to the vibrating element, and a ceramic package. The ceramic package is provided with a first external terminal and a second external terminal to which a constant potential is supplied. The first external terminal is electrically connected to the second external terminal in a first mode, and is electrically connected to an internal node of the integrated circuit in a second mode.

Abstract: A vibrating device has a package having an accommodating space in the interior thereof and a gyro element and an IC chip accommodated in the accommodating space. The package has a plate-like bottom plate having an IC chip mounting area and a vibrating element mounting area. The IC chip mounting area includes an IC chip mounting surface on which the IC chip is mounted. The vibrating element mounting area is arranged in parallel with the IC chip mounting area and includes a vibrating element mounting surface on which the gyro element is mounted. The thickness of the IC chip mounting area is smaller than that of the vibrating element mounting area. The IC chip mounting surface is located closer to a bottom side than the vibrating element mounting surface.

Abstract: A vibrating device has a package having an accommodating space in the interior thereof and a gyro element and an IC chip accommodated in the accommodating space. The package has a plate-like bottom plate having an IC chip mounting area and a vibrating element mounting area. The IC chip mounting area includes an IC chip mounting surface on which the IC chip is mounted. The vibrating element mounting area is arranged in parallel with the IC chip mounting area and includes a vibrating element mounting surface on which the gyro element is mounted. The thickness of the IC chip mounting area is smaller than that of the vibrating element mounting area. The IC chip mounting surface is located closer to a bottom side than the vibrating element mounting surface.

Abstract: A voltage control type temperature compensation piezoelectric oscillator, includes: a voltage control type oscillation circuit; an automatic frequency control (AFC) circuit outputting a control voltage for controlling an oscillation frequency of the voltage control type oscillation circuit based on an external control voltage; a temperature compensation voltage generating circuit generating a temperature compensation voltage; and a gain variable circuit varying a gain of the temperature compensation voltage. In the oscillator, the gain variable circuit is controlled by the control voltage outputted from the AFC circuit, and the oscillation frequency of the voltage control type oscillation circuit is controlled by an output voltage of the gain variable circuit.

Abstract: A voltage control type temperature compensation piezoelectric oscillator, includes: a voltage control type oscillation circuit; an automatic frequency control (AFC) circuit outputting a control voltage for controlling an oscillation frequency of the voltage control type oscillation circuit based on an external control voltage; a temperature compensation voltage generating circuit generating a temperature compensation voltage; and a gain variable circuit varying a gain of the temperature compensation voltage. In the oscillator, the gain variable circuit is controlled by the control voltage outputted from the AFC circuit, and the oscillation frequency of the voltage control type oscillation circuit is controlled by an output voltage of the gain variable circuit.