Patents by Inventor Norihito Umehara

Norihito Umehara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device in BGA package and manufacturing method thereof
    Patent number: 6232661
    Abstract: The purpose is to improve the assembly reliability of the BGA package. The present invention provides a type of BGA semiconductor device having plural conductor bumps arranged two-dimensionally on one surface of the insulating substrate. In this semiconductor device, there is adhesive layer (8) for attaching semiconductor chip (2) to said insulating substrate (3). According to the present invention, the outer edge of said adhesive layer (8) extends beyond the outer edge of said semiconductor chip (2).
    Type: Grant
    Filed: July 14, 1999
    Date of Patent: May 15, 2001
    Assignee: Texas Instruments Incorporated
    Inventors: Masazumi Amagai, Norihito Umehara, Kiyoshi Yajima