Abstract: In one aspect, provided is a polishing liquid composition for a silicon oxide film that is able to improve the polishing selectivity in the polishing of a silicon oxide film. An aspect of the present disclosure relates to a polishing liquid composition for a silicon oxide film. The polishing liquid composition contains cerium oxide particles (component A), a water-soluble anionic condensate (component B), and an aqueous medium. The component B is a co-condensate of monomers including a monomer (constituent monomer b1) represented by the following formula (I) and a monomer (constituent monomer b2) represented by the following formula (II). A molar ratio (%) of the constituent monomer b1 to the total of the constituent monomer b1 and the constituent monomer b2 in the component B is more than 30%.

Abstract: Provided is a polishing liquid composition that is able to improve the polishing rate of a silicon oxide film in one aspect. An aspect of the present disclosure relates to a polishing liquid composition for a silicon oxide film. The polishing liquid composition contains cerium oxide particles (component A), an additive (component B), and an aqueous medium. The component B is a compound having a reduction potential of 0.45 V or more when a 10 ppm aqueous solution of the component B is measured by cyclic voltammetry (with an Ag/AgCl electrode as a reference).

Abstract: In one aspect, the present disclosure provides a polishing liquid composition for a silicon oxide film that can achieve both of an improved polishing rate for a silicon oxide film and a reduced line width dependence of the polishing rate at raised areas in a pattern layer of raised and trench areas. One aspect of the present disclosure is directed to a polishing liquid composition for a silicon oxide film that contains: cerium oxide particles (component A); a compound represented by Formula (I) or Formula (II) below (component B); a nitrogen-containing heteroaromatic compound in which at least one hydrogen atom is substituted with a hydroxyl group (component C); and an aqueous medium.

Abstract: Provided is a polishing liquid composition that is able to improve the polishing selectivity while maintaining the polishing rate of a silicon oxide film in one aspect. An aspect of the present disclosure relates to a polishing liquid composition for a silicon oxide film. The polishing liquid composition contains cerium oxide particles (component A), a water-soluble polymer (component B), an anionic condensate (component C), and an aqueous medium. The component B is a polymer containing a constitutional unit b1 represented by the following formula (I).

Abstract: Provided is a polishing liquid composition that is able to improve the polishing rate of a silicon oxide film in one aspect. An aspect of the present disclosure relates to a polishing liquid composition for a silicon oxide film. The polishing liquid composition contains cerium oxide particles (component A), an additive (component B), and an aqueous medium. The component B is a compound having a reduction potential of (145 V or more when a 10 ppm aqueous solution of the component B is measured by cyclic voltammetry (with an Ag/AgCl electrode as a reference).

Abstract: A polishing composition containing a silica, an acid, a surfactant, and water, wherein (a) the acid has solubility in water at 25° C. of 1 g or more per 100 g of an aqueous saturated solution; (b) the surfactant is a sulfonic acid represented by the formula (1) or (2), or a salt thereof; and (c) the polishing composition has a pH of a specified range; and a polishing process of a substrate using the polishing composition are provided. The polishing composition is suitably used, for example in polishing a substrate for disk recording media such as magnetic disks, optical disks and opto-magnetic disks.

Abstract: A polishing composition for a magnetic disk substrate of the present invention includes water, silica particles, and at least one or more selected from an acid, a salt of the acid, and an oxidizing agent. The silica particles are observed with a transmission electron microscope to measure a maximum diameter and a projected area of each particle, and a value obtained by dividing the area of a circle whose diameter is the maximum diameter of a silica particle by the projected area of the silica particle and multiplying the result by 100, is in the range of 100 to 130.

Abstract: The present invention provides a polishing composition for a magnetic disk substrate that can reduce scratches and surface roughness of a polished substrate without impairing the productivity, and a method for manufacturing a magnetic disk substrate using the polishing composition. The polishing composition for a magnetic disk substrate includes colloidal silica having a ?CV value of 0 to 10% and water.

Abstract: A polishing composition for a magnetic disk substrate of the present invention includes water, silica particles, and at least one or more selected from an acid, a salt of the acid, and an oxidizing agent. The silica particles are observed with a transmission electron microscope to measure a maximum diameter and a projected area of each particle, and a value obtained by dividing the area of a circle whose diameter is the maximum diameter of a silica particle by the projected area of the silica particle and multiplying the result by 100, is in the range of 100 to 130.

Abstract: The present invention provides a polishing composition for a magnetic disk substrate that can reduce scratches and surface roughness of a polished substrate without impairing the productivity, and a method for manufacturing a magnetic disk substrate using the polishing composition. The polishing composition for a magnetic disk substrate includes colloidal silica having a ? CV value of 0 to 10% and water.

Abstract: The present invention relates to a method for polishing a substrate to be polished, including polishing a Ni—P-plated aluminum alloy substrate as the substrate to be polished while keeping a polishing composition in contact with a polishing pad. The polishing composition contains an abrasive, an acid, an oxidizing agent, a heterocyclic aromatic compound, an aliphatic amine compound or alicyclic amine compound, and water. The heterocyclic aromatic compound includes two or more nitrogen atoms in its ring structure, the aliphatic amine compound or alicyclic amine compound includes two to four nitrogen atoms in its molecules, and the polishing composition has a pH of 3.0 or less.

Abstract: A polishing composition containing a silica, an acid, a surfactant, and water, wherein (a) the acid has solubility in water at 25° C. of 1 g or more per 100 g of an aqueous saturated solution; (b) the surfactant is a sulfonic acid represented by the formula (1) or (2), or a salt thereof; and (c) the polishing composition has a pH of a specified range; and a polishing process of a substrate using the polishing composition are provided. The polishing composition is suitably used, for example in polishing a substrate for disk recording media such as magnetic disks, optical disks and opto-magnetic disks.

Abstract: A polishing composition for a magnetic disk substrate of the present invention includes water, silica particles, and at least one or more selected from an acid, a salt of the acid, and an oxidizing agent. The silica particles are observed with a transmission electron microscope to measure a maximum diameter and a projected area of each particle, and a value obtained by dividing the area of a circle whose diameter is the maximum diameter of a silica particle by the projected area of the silica particle and multiplying the result by 100, is in the range of 100 to 130.

Abstract: A polishing composition containing a silica, an acid, a surfactant, and water, wherein (a) the acid has solubility in water at 25° C. of 1 g or more per 100 g of an aqueous saturated solution; (b) the surfactant is a sulfonic acid represented by the formula (1) or (2), or a salt thereof; and (c) the polishing composition has a pH of a specified range; and a polishing process of a substrate using the polishing composition are provided. The polishing composition is suitably used, for example in polishing a substrate for disk recording media such as magnetic disks, optical disks and opto-magnetic disks.