Abstract: In a gamma camera, a plurality of radiation detector elements having a rod-shaped first electrode, a semiconductor device surrounds the first electrode to contact with it for entering a radiation, and a second electrode provided for the side surface of the semiconductor device are detachably attached to a holding member. The holding member has a first electrode contact portion contacted with the first electrode and a second electrode contact portion contacted with the second electrode. A collimator in which a plurality of radiation paths provided corresponding to the plurality of radiation detector elements are formed is arranged on the radiation entering side of the plurality of radiation detector elements. A ?-ray detection signal outputted from the first electrode contact portion is sent to a signal processing integrated circuit. A high voltage is applied to the second electrode via the second electrode contact portion.

Abstract: In a gamma camera, a plurality of radiation detector elements having a rod-shaped first electrode, a semiconductor device surrounds the first electrode to contact with it for entering a radiation, and a second electrode provided for the side surface of the semiconductor device are detachably attached to a holding member. The holding member has a first electrode contact portion contacted with the first electrode and a second electrode contact portion contacted with the second electrode. A collimator in which a plurality of radiation paths provided corresponding to the plurality of radiation detector elements are formed is arranged on the radiation entering side of the plurality of radiation detector elements. A ?-ray detection signal outputted from the first electrode contact portion is sent to a signal processing integrated circuit. A high voltage is applied to the second electrode via the second electrode contact portion.

Abstract: A radiological imaging apparatus of the present invention comprises an image pickup device and a medical examinee holding device that is provided with a bed. The image pickup device includes a large number of radiation detectors and radiation detector support plates. A large number of radiation detectors are mounted around the circumference of a through-hole and arranged in the axial direction of the through-hole. The radiation detectors are arranged in three layers formed radially with respect to the center of the through-hole and mounted on the lateral surfaces of the radiation detector support plates. Since the radiation detectors are not only arranged in the axial direction and circumferential direction of the through-hole but also arrayed in the radial direction, it is possible to obtain accurate information about a ?-ray arrival position in the radial direction of the through-hole (the positional information about a radiation detector from which a ?-ray image pickup signal is output).

Abstract: A ?-ray signal processing section 60? determines a detection time of a ? ray based on a ?-ray detection signal outputted from a semiconductor radiation detector for detecting the ? ray, and determines the energy of the ? ray. Then, a time correction circuit 70 obtains, based on the energy of the ? ray, a detection value of the detection time that corresponds to the energy of the ? ray from a time correction table indicating the relationship between the energy of the ? ray and the correction value of the detection time of the ? ray, and corrects the detection time according to the obtained correction value of the detection time. Coincidence counting is performed on the ? ray in a coincidence counting circuit 80 based on the corrected detection time.

Abstract: A positron emission tomography apparatus installs a plurality of detector units in the circumference of a bed. The detector unit installs a plurality of combined substrates including detectors, analogue ASICs, and a digital ASIC and a voltage adjustment device inside a housing. A partition plate installed inside the housing separates the region inside the housing into a first region installed with the combined substrates and a second region installed with the voltage adjustment device. The partition plate blocks noise generated in the voltage adjustment device so as not to affect ?-ray detection signals outputted from the detectors, thereby preventing the effect of the noise generated in the voltage adjustment device toward ?-ray detection signals and shortening the examination time.

Abstract: The image pickup apparatus of the radiological imaging apparatus of the present invention includes many detector units, a ring-shaped detector support member and an X-ray source circumferential transport apparatus. Each of the detector units is attached to the detector support section in a detachable manner. A plurality of radiation detectors provided for the detector units are arranged in three layers in the radius direction of the detector support member and in three columns in the axial direction of the detector support member. Since the radiation detectors are arranged in three layers in the radius direction, it is possible to recognize the detection position of radiation in the radius direction in detail. Furthermore, since the detector units are attached in a detachable manner, it is easy to replace damaged radiation detectors.

Abstract: A radiological imaging apparatus allowing semiconductor radiation detectors to be easily replaced with new ones and densely arranged. Terminals (31cjk) and (33cjk) are provided on a bottom surface of a detector aggregate (40mn) including a plurality of semiconductor radiation detectors (1); the terminals is connected to electrodes (3 and 4) of the detectors (1). A plurality of zero insertion force connectors (56) are provided on a connecting device (33jk) installed on a support substrate (32h). The terminals (31cjk and 33cjk) are detachably attached to the zero insertion force connectors (56) to mount the detector aggregates (40mn) that are the semiconductor radiation detectors (1), on the support substrate (32h). When the detector aggregates (40mn) are attached to the zero insertion force connectors (56), since no frictional force acts on the terminals, the size of the gap between the detector aggregates (40mn) is reduced.

Abstract: A radiological imaging apparatus of the present invention comprises an image pickup device and a medical examinee holding device that is provided with a bed. The image pickup device includes a large number of radiation detectors and radiation detector support plates. A large number of radiation detectors are mounted around the circumference of a through-hole and arranged in the axial direction of the through-hole. The radiation detectors are arranged in three layers formed radially with respect to the center of the through-hole and mounted on the lateral surfaces of the radiation detector support plates. Since the radiation detectors are not only arranged in the axial direction and circumferential direction of the through-hole but also arrayed in the radial direction, it is possible to obtain accurate information about a ?-ray arrival position in the radial direction of the through-hole (the positional information about a radiation detector from which a ?-ray image pickup signal is output).

Abstract: The present invention provides a semiconductor radiation detector and radiation detection apparatus capable of improving energy resolution and the semiconductor radiation detection apparatus includes a semiconductor radiation detector and a signal processing circuit which processes a radiation detection signal output from the semiconductor radiation detector. The semiconductor radiation detector is provided with anode electrodes A and cathode electrodes C disposed so as to face each other with semiconductor radiation detection elements placed in-between. The semiconductor radiation detection element is made up of a single crystal of thallous bromide containing trivalent thallium (e.g., tribromobis thallium). The semiconductor radiation detector containing such a semiconductor radiation detection element reduces lattice defects in the single crystal and thereby increases charge collection efficiency.

Abstract: A radiological imaging apparatus including a bed which supports an object to be examined and an imaging apparatus, wherein the imaging apparatus has a unit substrate including a first substrate including a radiation detector and a second substrate including a signal processing apparatus to which detection signals of the radiation detector are inputted and the first substrate is connected through a connector, and is provided with a heat insulating member of separating mutually a first area where the radiation detector is disposed from a second area where the signal processing apparatus is disposed, both of which are formed inside the imaging apparatus.

Abstract: In a radiological imaging apparatus, a radiation detecting section includes semiconductor detectors arranged in four columns and four rows. Each of the semiconductor detectors includes a semiconductor base material, and an anode electrode film (first electrode film) and a cathode electrode film (second electrode film) lying opposite each other so as to sandwich the semiconductor base material between them. A first conductive member is installed on each first electrode film. Second electrode films of four semiconductor detectors within a row are connected together using one second conductive member. A shaping amplifier connected to the first conductive members with a wire executes a waveform shaping process using a shaping time shorter than that of a shaping amplifier connected to the second conductive member with a wire; the first conductive members are provided for the four semiconductor detectors within a column.

Abstract: A radiation detection module and radiological imaging apparatus capable of improving spatial resolution. A semiconductor radiation detector includes a plurality of semiconductor radiation detector elements and conductive members which are copper plates. A detector element provides an anode electrode on one of facing sides of a semiconductor region and a cathode electrode on the other side. The respective detector elements are arranged in parallel in such a way that the cathode electrodes and anode electrodes face each other respectively, and the anode electrodes are electrically connected together and the cathode electrodes are electrically connected together via the conductive members respectively.

Abstract: Each semiconductor radiation detector used for a nuclear medicine diagnostic apparatus (PET apparatus) is constructed with an anode electrode A facing a cathode electrode C sandwiching a CdTe semiconductor member S which generates charge through interaction with ?-rays. Then, a thickness t of the semiconductor member S sandwiched between these mutually facing anode electrode A and cathode electrode C is set to 0.2 to 2 mm. Furthermore, the devices are mounted (laid out) on substrates in such a way that the distance (distance of conductor) between the semiconductor radiation detector and an analog ASIC which processes the signal detected by this detector is shortened. Furthermore, the substrates on which the detectors are mounted are housed in a housing as a unit (detector unit).

Abstract: Each semiconductor radiation detector used for a nuclear medicine diagnostic apparatus (PET apparatus) is constructed with an anode electrode A facing a cathode electrode C sandwiching a CdTe semiconductor member S which generates charge through interaction with ?-rays. Then, a thickness t of the semiconductor member S sandwiched between these mutually facing anode electrode A and cathode electrode C is set to 0.2 to 2 mm. Furthermore, the devices are mounted (laid out) on substrates in such a way that the distance (distance of conductor) between the semiconductor radiation detector and an analog ASIC which processes the signal detected by this detector is shortened. Furthermore, the substrates on which the detectors are mounted are housed in a housing as a unit (detector unit).

Abstract: Each semiconductor radiation detector used for a nuclear medicine diagnostic apparatus (PET apparatus) is constructed with an anode electrode A facing a cathode electrode C sandwiching a CdTe semiconductor member S which generates charge through interaction with ?-rays. Then, a thickness t of the semiconductor member S sandwiched between these mutually facing anode electrode A and cathode electrode C is set to 0.2 to 2 mm. Furthermore, the devices are mounted (laid out) on substrates in such a way that the distance (distance of conductor) between the semiconductor radiation detector and an analog ASIC which processes the signal detected by this detector is shortened. Furthermore, the substrates on which the detectors are mounted are housed in a housing as a unit (detector unit).

Abstract: Each semiconductor radiation detector used for a nuclear medicine diagnostic apparatus (PET apparatus) is constructed with an anode electrode A facing a cathode electrode C sandwiching a CdTe semiconductor member S which generates charge through interaction with ?-rays. Then, a thickness t of the semiconductor member S sandwiched between these mutually facing anode electrode A and cathode electrode C is set to 0.2 to 2 mm. Furthermore, the devices are mounted (laid out) on substrates in such a way that the distance (distance of conductor) between the semiconductor radiation detector and an analog ASIC which processes the signal detected by this detector is shortened. Furthermore, the substrates on which the detectors are mounted are housed in a housing as a unit (detector unit).

Abstract: A radiological imaging apparatus capable of improving an arrangement density of semiconductor radiation detectors and detector units thereof, each detector unit consisting of a plurality of combined substrates having a detector substrate which includes semiconductor radiation detectors and a signal processing substrate which includes integrated circuits, housed in a housing. The detector substrate protrudes outward from an opening of the housing. A plurality of detector units are attached to a ring-shaped unit support section in a circumferential direction thereof. More specifically, the detector substrate protrudes inward from the unit support section and the housing is attached to the unit support section.

Abstract: A radiological imaging apparatus of the present invention comprises an image pickup device and a medical examinee holding device that is provided with a bed. The image pickup device includes a large number of radiation detectors and radiation detector support plates. A large number of radiation detectors are mounted around the circumference of a through-hole and arranged in the axial direction of the through-hole. The radiation detectors are arranged in three layers formed radially with respect to the center of the through-hole and mounted on the lateral surfaces of the radiation detector support plates. Since the radiation detectors are not only arranged in the axial direction and circumferential direction of the through-hole but also arrayed in the radial direction, it is possible to obtain accurate information about a ?-ray arrival position in the radial direction of the through-hole (the positional information about a radiation detector from which a ?-ray image pickup signal is output).

Abstract: A practical semiconductor radiation detector capable of collecting electrons rapidly with a large volume is disclosed. A multiple layers of grid electrodes around an anode formed on a semiconductor element limits the generation of the induced charge signal for the anode to the space in the neighborhood of the anode, while at the same time making it possible to collect the electrons rapidly. As a result of limiting the space for generating the induced charge by the grid electrodes, the energy resolution is improved even for a thick semiconductor element. Also, the capability of rapidly collecting the electrons due to the high field strength generated by the grid electrodes makes a sensitive volume of the whole semiconductor and thus achieves a high radiation detection efficiency.

Abstract: A ?-ray signal processing section 60? determines a detection time of a ? ray based on a ?-ray detection signal outputted from a semiconductor radiation detector for detecting the ? ray, and determines the energy of the ? ray. Then, a time correction circuit 70 obtains, based on the energy of the ? ray, a detection value of the detection time that corresponds to the energy of the ? ray from a time correction table indicating the relationship between the energy of the ? ray and the correction value of the detection time of the ? ray, and corrects the detection time according to the obtained correction value of the detection time. Coincidence counting is performed on the ? ray in a coincidence counting circuit 80 based on the corrected detection time.