Patents by Inventor Norihumi TASHIRO

Norihumi TASHIRO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9301399
    Abstract: A method of treating a wiring substrate according to an embodiment includes, in a semi-additive process: (1) contacting the wiring substrate with a pre-etching treatment liquid composition containing a chloride ion, the wiring substrate containing a seed layer formed of an electroless copper and a wiring pattern formed of an electrolytic copper; and (2) continuously, etching the wiring substrate with an etching liquid composition containing a hydrogen peroxide, a sulfuric acid, a tetrazole, a chloride ion, a copper ion and a water.
    Type: Grant
    Filed: April 18, 2014
    Date of Patent: March 29, 2016
    Assignees: MITSUBISHI GAS CHEMICAL COMPANY, INC., RYOKO CHEMICAL CO., LTD.
    Inventors: Tomoko Suzuki, Norihumi Tashiro, Yukihide Naito, Akari Hitotsugo
  • Publication number: 20140311778
    Abstract: A method of treating a wiring substrate according to an embodiment includes, in a semi-additive process: (1) contacting the wiring substrate with a pre-etching treatment liquid composition containing a chloride ion, the wiring substrate containing a seed layer formed of an electroless copper and a wiring pattern formed of an electrolytic copper; and (2) continuously, etching the wiring substrate with an etching liquid composition containing a hydrogen peroxide, a sulfuric acid, a tetrazole, a chloride ion, a copper ion and a water.
    Type: Application
    Filed: April 18, 2014
    Publication date: October 23, 2014
    Applicants: Mitsubishi Gas Chemical Company, Inc., Ryoko Chemical Co., Ltd.
    Inventors: Tomoko SUZUKI, Norihumi TASHIRO, Yukihide NAITO, Akari HITOTSUGO