Patents by Inventor Norikazu Sakai
Norikazu Sakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240147613Abstract: The present invention addresses the problem that, when applying pressure and heat to laminate substrates, to maintain the flatness of the substrates so as not to have the load concentrated in one part, and to prevent the occurrence of resistance value abnormalities by making the electrically conductive layers between terminal parts uniform over the entire substrate.Type: ApplicationFiled: April 14, 2022Publication date: May 2, 2024Applicant: FICT LIMITEDInventors: Takashi Nakagawa, Norikazu Ozaki, Taiji Sakai, Kenji Takano, Kenji Iida
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Patent number: 11929054Abstract: An object of the present invention is to provide a soundproof material having a practically useful high-level sound absorption coefficient that while maintaining thinness, and further having an expanded sound-absorbable frequency region. A means for solving the problem is a soundproof material comprising: a surface cover layer composed of a fiber material; a back-surface layer laminated onto the surface cover layer, and composed of a porous material with voids interconnected with each other; and a joining layer laminated between the surface cover layer and the back-surface layer, and composed of a joining material, wherein the fiber material has an average fiber diameter of 1 to 10 ?m and an air-permeation volume of 5 to 200 cm3/cm2·sec, and wherein the joining layer has a joint area percentage of 50 to 95% with respect to the entire surface where the surface cover layer and the back-surface layer face each other.Type: GrantFiled: July 26, 2019Date of Patent: March 12, 2024Assignee: MAXELL, LTD.Inventors: Norikazu Matsumoto, Shoko Sakai, Kenji Ohtani, Teruhisa Miyata
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Patent number: 11904416Abstract: Provided are a solder alloy, a solder powder, a solder paste, and a solder joint having a low liquidus temperature and not too low solidus temperature. The solder alloy has an alloy composition of, by mass: Ag: 2.0 to 4.0%; Cu: 0.51 to 0.79%; and Bi: more than 4.0% and 8.0% or less, with the balance being Sn. The solder alloy has a liquidus temperature of less than 217° C.Type: GrantFiled: March 9, 2022Date of Patent: February 20, 2024Assignee: Senju Metal Industry Co., Ltd.Inventors: Yoshie Tachibana, Tomoki Sasaki, Norikazu Sakai, Yoshihiro Yamaguchi
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Publication number: 20240047430Abstract: An object is to provide a technique capable of easily taking out a submodule from a semiconductor device to reuse the submodule. The semiconductor device includes: a submodule in which a conductive plate and a semiconductor element mounted to an upper surface of the conductive plate via a first bonding material are sealed with a first sealing material; an insulating substrate bonded to a lower surface of the submodule via a second bonding material; a case surrounding a periphery of the insulating substrate and the submodule; and a second sealing material sealing a region surrounded by the case so that at least an upper surface of the submodule is exposed.Type: ApplicationFiled: April 25, 2023Publication date: February 8, 2024Applicant: Mitsubishi Electric CorporationInventors: Yosuke NAKATA, Norikazu SAKAI, Yuji SATO, Yoshinori YOKOYAMA
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Publication number: 20230187308Abstract: A first principal electrode and a first control electrode pad are formed on a first principal surface of the semiconductor chip. A second principal electrode and a second control electrode pad are formed on a second principal surface of the semiconductor chip. The second principal electrode and the second control electrode pad are respectively bonded to first and second metal patterns of an insulating substrate. Bonding sections of first and second wires overlap a bonding section of the second principal electrode or the second control electrode pad in plan view. Thickness of the first and second metal patterns is 0.2 mm or less.Type: ApplicationFiled: July 5, 2022Publication date: June 15, 2023Applicant: Mitsubishi Electric CorporationInventors: Masanori TSUKUDA, Koichi NISHI, Shinya SONEDA, Koji TANAKA, Norikazu SAKAI, Taketoshi SHIKANO
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Publication number: 20220288725Abstract: Provided are a solder alloy, a solder powder, a solder paste, and a solder joint having a low liquidus temperature and not too low solidus temperature. The solder alloy has an alloy composition of, by mass: Ag: 2.0 to 4.0%; Cu: 0.51 to 0.79%; and Bi: more than 4.0% and 8.0% or less, with the balance being Sn. The solder alloy has a liquidus temperature of less than 217° C.Type: ApplicationFiled: March 9, 2022Publication date: September 15, 2022Inventors: Yoshie Tachibana, Tomoki Sasaki, Norikazu Sakai, Yoshihiro Yamaguchi
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Patent number: 11387352Abstract: An object of the present disclosure is to suppress a shrinkage cavity without affecting the layout or the insulation performance of the semiconductor element in a power semiconductor device. A power semiconductor device includes a heat radiation plate; an insulating substrate bonded in a bonding region on an upper surface of the heat radiation plate with a bonding material containing a plurality of elements having different solidification points; a semiconductor element mounted on an upper surface of the insulating substrate; and a bonding wire bonded in the bonding region on the upper surface of the heat radiation plate such that the bonding wire surrounds the semiconductor element in plan view.Type: GrantFiled: October 22, 2020Date of Patent: July 12, 2022Assignee: Mitsubishi Electric CorporationInventor: Norikazu Sakai
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Patent number: 11270982Abstract: A metal mask is disposed on a copper base plate. A solder paste is introduced into each of a plurality of openings in the metal mask, to thereby form a pattern of the solder paste on each of copper plates of the copper base plate. A semiconductor element and a conductive component are placed on the respective patterns of the solder pastes. A metal mask is disposed on the copper base plate. Then, a solder paste is introduced into each of a plurality of openings in the metal mask, to thereby form a pattern of the solder paste covering each of the semiconductor element and the conductive component. A large-capacity relay board is disposed so as to come into contact with a corresponding pattern of the solder paste. A power semiconductor device is completed by performing heat treatment under a temperature condition of 200° C. or higher.Type: GrantFiled: January 30, 2017Date of Patent: March 8, 2022Assignee: Mitsubishi Electric CorporationInventors: Norikazu Sakai, Hiroshi Yoshida, Hidetoshi Ishibashi, Nobuhiro Asaji
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Publication number: 20210249526Abstract: An object of the present disclosure is to suppress a shrinkage cavity without affecting the layout or the insulation performance of the semiconductor element in a power semiconductor device. A power semiconductor device includes a heat radiation plate; an insulating substrate bonded in a bonding region on an upper surface of the heat radiation plate with a bonding material containing a plurality of elements having different solidification points; a semiconductor element mounted on an upper surface of the insulating substrate; and a bonding wire bonded in the bonding region on the upper surface of the heat radiation plate such that the bonding wire surrounds the semiconductor element in plan view.Type: ApplicationFiled: October 22, 2020Publication date: August 12, 2021Applicant: Mitsubishi Electric CorporationInventor: Norikazu SAKAI
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Publication number: 20190348404Abstract: A metal mask is disposed on a copper base plate. A solder paste is introduced into each of a plurality of openings in the metal mask, to thereby form a pattern of the solder paste on each of copper plates of the copper base plate. A semiconductor element and a conductive component are placed on the respective patterns of the solder pastes. A metal mask is disposed on the copper base plate. Then, a solder paste is introduced into each of a plurality of openings in the metal mask, to thereby form a pattern of the solder paste covering each of the semiconductor element and the conductive component. A large-capacity relay board is disposed so as to come into contact with a corresponding pattern of the solder paste. A power semiconductor device is completed by performing heat treatment under a temperature condition of 200° C. or higher.Type: ApplicationFiled: January 30, 2017Publication date: November 14, 2019Applicant: Mitsubishi Electric CorporationInventors: Norikazu SAKAI, Hiroshi YOSHIDA, Hidetoshi ISHIBASHI, Nobuhiro ASAJI
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Patent number: 9485380Abstract: An image reading apparatus includes: an illumination unit that is disposed so as to be moved relative to a recording medium and illuminates the recording medium with light beams of plural colors that are circulated in predetermined order; a reading unit that reads an image recorded on the recording medium by receiving reflection light that is produced as a result of the illumination unit's illuminating the recording medium during the moving relative to the recording medium; and a control unit that controls the illumination unit so that a difference between a first illumination interval and a second illumination interval is determined based on a reading resolution of the reading unit.Type: GrantFiled: February 12, 2015Date of Patent: November 1, 2016Assignee: FUJI XEROX CO., LTD.Inventors: Kosuke Shimizu, Norikazu Sakai
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Publication number: 20150381846Abstract: An image reading apparatus includes: an illumination unit that is disposed so as to be moved relative to a recording medium and illuminates the recording medium with light beams of plural colors that are circulated in predetermined order; a reading unit that reads an image recorded on the recording medium by receiving reflection light that is produced as a result of the illumination unit's illuminating the recording medium during the moving relative to the recording medium; and a control unit that controls the illumination unit so that a difference between a first illumination interval and a second illumination interval is determined based on a reading resolution of the reading unit.Type: ApplicationFiled: February 12, 2015Publication date: December 31, 2015Inventors: Kosuke SHIMIZU, Norikazu SAKAI
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Patent number: 9001397Abstract: An image reading apparatus includes an apparatus body; a transport device that is openable and closable; an image reading unit disposed in one of the apparatus body and the transport device and reading an image of the document transported by the transport device; a member to be read that is disposed in the other of the apparatus body and the transport device at a position opposite the image reading unit when the transport device is closed, the member to be read being read by the image reading unit; and a control unit that causes the image reading unit to read the member to be read at a predetermined time, and if the transport device is open at the predetermined time, causes the image reading unit to read the member to be read when the document is transported by the transport device.Type: GrantFiled: May 20, 2011Date of Patent: April 7, 2015Assignee: Fuji Xerox Co., Ltd.Inventors: Norikazu Sakai, Kazunori Sato
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Patent number: 8730528Abstract: An image reading apparatus includes an image reading unit that includes plural photoelectric conversion elements arranged therein and that reads an image using light, the light being reflected by a document transported to a read position and being received by the plural photoelectric conversion elements, a reference plate that is disposed at the read position, a correction data generating unit that generates correction data by modifying second reference data on the basis of a ratio of first reference data to the second reference data, the first reference data being obtained by the image reading unit using light reflected by the reference plate in a clean state, the second reference data being obtained by the image reading unit using light reflected by the reference plate before reading an image, and an image correcting unit that corrects the image on the basis of the correction data generated by the correction data generating unit.Type: GrantFiled: May 11, 2011Date of Patent: May 20, 2014Assignee: Fuji Xerox Co., Ltd.Inventor: Norikazu Sakai
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Patent number: 8693068Abstract: An image reading apparatus includes a reading unit, an extraction unit and a generation unit. The reading unit outputs reference plate reading information. The extraction unit sets a pixel of the reference plate reading information as a notice pixel and repeatedly extracts one of the notice pixel as a target pixel until the number of the target pixels is more than a predetermined value when a ratio of a pixel value of the notice pixel to an initial value is more than a predetermined range. The generation unit generates correction information by substituting a pixel value of the target pixel with a correction value using the initial value when the extraction unit extracts all pixels of the reference plate reading information, and generates correction information by setting the pixel values of all the pixels as the initial value when the extraction unit does not extract all the pixels.Type: GrantFiled: February 8, 2012Date of Patent: April 8, 2014Assignee: Fuji Xerox Co., Ltd.Inventors: Norikazu Sakai, Mitsuo Shimizu
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Publication number: 20130070309Abstract: An image reading apparatus includes a reading unit, an extraction unit and a generation unit. The reading unit outputs reference plate reading information. The extraction unit sets a pixel of the reference plate reading information as a notice pixel and repeatedly extracts one of the notice pixel as a target pixel until the number of the target pixels is more than a predetermined value when a ratio of a pixel value of the notice pixel to an initial value is more than a predetermined range. The generation unit generates correction information by substituting a pixel value of the target pixel with a correction value using the initial value when the extraction unit extracts all pixels of the reference plate reading information, and generates correction information by setting the pixel values of all the pixels as the initial value when the extraction unit does not extract all the pixels.Type: ApplicationFiled: February 8, 2012Publication date: March 21, 2013Applicant: FUJI XEROX CO., LTD.Inventors: Norikazu SAKAI, Mitsuo SHIMIZU
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Publication number: 20120113479Abstract: An image reading apparatus includes an image reading unit that includes plural photoelectric conversion elements arranged therein and that reads an image using light, the light being reflected by a document transported to a read position and being received by the plural photoelectric conversion elements, a reference plate that is disposed at the read position, a correction data generating unit that generates correction data by modifying second reference data on the basis of a ratio of first reference data to the second reference data, the first reference data being obtained by the image reading unit using light reflected by the reference plate in a clean state, the second reference data being obtained by the image reading unit using light reflected by the reference plate before reading an image, and an image correcting unit that corrects the image on the basis of the correction data generated by the correction data generating unit.Type: ApplicationFiled: May 11, 2011Publication date: May 10, 2012Applicant: FUJI XEROX CO., LTD.Inventor: Norikazu SAKAI
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Publication number: 20120113482Abstract: An image reading apparatus includes an apparatus body; a transport device that is openable and closable; an image reading unit disposed in one of the apparatus body and the transport device and reading an image of the document transported by the transport device; a member to be read that is disposed in the other of the apparatus body and the transport device at a position opposite the image reading unit when the transport device is closed, the member to be read being read by the image reading unit; and a control unit that causes the image reading unit to read the member to be read at a predetermined time, and if the transport device is open at the predetermined time, causes the image reading unit to read the member to be read when the document is transported by the transport device.Type: ApplicationFiled: May 20, 2011Publication date: May 10, 2012Applicant: FUJI XEROX CO., LTD.Inventors: Norikazu SAKAI, Kazunori SATO
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Patent number: 7701623Abstract: An image reading device includes: a first light source that irradiates light on a first side of an object; a memory that stores a plurality of parameters for controlling an intensity of the light emitting devices, each of the plurality of parameters corresponding to one of a plurality of groups; a controller that controls an intensity of the light emitting devices in response to one of the plurality of parameters stored in the memory; a first image reading unit that reads reflected light from the first side and generates monochrome image data on the basis of the read reflected light; and a second image reading unit that reads reflected light from the second side and generates monochrome image data on the basis of the read reflected light.Type: GrantFiled: June 13, 2007Date of Patent: April 20, 2010Assignee: Fuji Xerox Co., Ltd.Inventors: Mitsuo Shimizu, Norikazu Sakai
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Patent number: 7663787Abstract: A document deciding apparatus includes: a light source; a light-quantity detection unit detecting a reference light quantity based on irradiation of the light source, and respective light quantities of plural colors based on reflection from or transmission through a document; a decision unit deciding whether the document is colorless or colored, in accordance with a predetermined criterion on the basis of the light quantities of plural colors detected by the light-quantity detection unit; and a control unit performing a control so as to alter the criterion of the decision unit or a value corresponding to the light quantities detected by the light-quantity detection unit, on the basis of a change of the reference light quantity detected by the light-quantity detection unit.Type: GrantFiled: March 10, 2006Date of Patent: February 16, 2010Assignee: Fuji Xerox Co., Ltd.Inventor: Norikazu Sakai