Patents by Inventor Norikimi Moriuchi

Norikimi Moriuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11399431
    Abstract: Provided is a land for a surface mounted component that includes a plurality of land regions respectively having different width. Land regions included in the plurality of land regions are combined with one another with centers in a width direction aligned in order conforming to the widths and are jointed into one land. A cutout shape is provided in a center in the width direction on a side opposed to an adjacent or overlapping side of a land region having a larger width of adjacent or partially overlapping two land regions in the plurality of land regions joined into the one land.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: July 26, 2022
    Assignee: SONY CORPORATION
    Inventor: Norikimi Moriuchi
  • Publication number: 20210307166
    Abstract: A land for a surface mounted component according to an embodiment includes a land (10) for a surface mounted component includes a plurality of land regions (11a, 11b) respectively having different width. Land regions included in the plurality of land regions are combined with one another with centers in a width direction aligned in order conforming to the widths and are jointed into one land. A cutout shape (12) is provided in a center in the width direction on a side opposed to an adjacent or overlapping side of a land region having a larger width of adjacent or partially overlapping two land regions in the plurality of land regions joined into the one land.
    Type: Application
    Filed: August 16, 2019
    Publication date: September 30, 2021
    Inventor: NORIKIMI MORIUCHI
  • Patent number: 9113564
    Abstract: There is provided a circuit board including a land provided on a mounting surface for joining a distal end portion of a connection terminal of a lead component by a solder, wherein the land is formed to extend in a predetermined direction such that the predetermined direction is a longitudinal direction and a lateral direction orthogonal to the longitudinal direction is a width direction, wherein the land includes a terminal-facing portion facing the distal end portion of the connection terminal and a distal end side continuous portion continuously extending from the terminal-facing portion in the distal end portion of the connection terminal, and wherein the land includes a narrow portion having a width smaller than a width of the distal end side continuous portion in the terminal-facing portion.
    Type: Grant
    Filed: December 18, 2012
    Date of Patent: August 18, 2015
    Assignee: SONY CORPORATION
    Inventors: Motohiko Ootani, Norikimi Moriuchi