Abstract: An acoustic wave type touch panel is equipped with: a substrate that objects contact; reflective arrays having a great number of inclined lines provided on the substrate; acoustic wave generating sections provided on the substrate; and detecting sections provided on the substrate. An array of micro reflectors, which are shorter than the inclined lines, for attenuating spurious waves generated by reflection of the acoustic waves by the reflective arrays, is provided in the reflective array regions between the inclined lines at least one end thereof.

Abstract: An acoustic wave type touch panel is equipped with: a substrate that objects contact; reflective arrays having a great number of inclined lines provided on the substrate; acoustic wave generating sections provided on the substrate; and detecting sections provided on the substrate. An array of micro reflectors, which are shorter than the inclined lines, for attenuating spurious waves generated by reflection of the acoustic waves by the reflective arrays, is provided in the reflective array regions between the inclined lines at least one end thereof.

Abstract: An object of the present invention is to present a fabrication method for electronic components that allows further reduction in the size of electronic components by making the semiconductor substrate thinner, and at the same time allows operation as an electronic circuit with no problems, and further, has a durability sufficient to endure even use in a mobile telephone. In order to attain this object, the present invention has a first application process (process S12) in which encapsulating resin is applied to the surface of the substrate on which the posts are formed, a back surface grinding process (process S18) in which the back surface of said substrate is ground, a second application process (process S20) in which an encapsulating resin is applied to the back surface of said substrate after being ground, and a separation process (process S26) in which said substrate is cut along with said encapsulating resin and at the same time individual electronic components are separated.

Abstract: The invention provides a method for producing semiconductor packages comprising the steps of forming electronic circuits for a plurality of semiconductor chips 11 on a wafer 1, forming bumps 2 on the plurality of semiconductor chips 11, encapsulating the circuit-forming surface 111 of the wafer 1 and the bumps 2 with a sealant by screen printing means to form a sealant layer 4, curing the sealant layer 4, grinding the surface of the sealant layer 4 until the upper end surface of the bump 2 becomes exposed, placing solder balls on said upper end surface of bumps 2 to weld the balls to the surface thereof, and dicing the wafer 1 and the sealant layer 4 as united into individual semiconductor chips 11. Screen printing means is used to encapsulate the entire surface of the wafer with a resin, so that the equipment costs can be markedly reduced as compared with conventional methods using a mold.

Abstract: A novel silver halide photographic element which contains a nondiffusible complex capable of releasing a diffusible, photographically useful material is disclosed.Said nondiffusible complex becomes active for ligand exchange upon reduction under alkalin conditions to release a diffusible, photographically useful material, said complex being represented by the following formula: ##STR1## wherein La is a quadridentate ligand group; Lb is a didentate ligand group; BALL is a ballast group; PHOTO is a photographically useful material group; Y is a counter ion; and r is the number of counter ions necessary for neutralizing the electric charge on the CO(III) complex.

Abstract: A photographic element comprising a support provided thereon with at least one light-sensitive silver halide emulsion layer containing a nondiffusible compound which receives at least one electron in an alkaline condition to release a photographically useful material and a nondiffusible electron donor or a precursor thereof having the following formula (I) or (II): ##STR1## wherein R.sup.1 represents hydrogen, an alkyl, an aryl or a heterocyclic group, R.sup.2 represents hydrogen, an alkyl, an aryl, a heterocyclic, an amino, a carbamide, a sulfonamide, a sulfamoyl, a carbamoyl or a ureido group, R.sup.3 and R.sup.4 each is hydrogen, --COR.sup.5, --SO.sub.2 R.sup.6 or --CSR.sup.7 wherein R.sup.5 and R.sup.6 each is a substituted or unsubstituted, respectively, alkyl, alkenyl, aryl, heterocyclic, alkylamino, alkyloxy, aryloxy, alkylthio, arylthio, alkyloxycarbonyl or aryloxycarbonyl group, and R.sup.7 is a substituted or unsubstituted alkyllamino or arylamino group, said R.sup.

Abstract: The invention provides a method for producing semiconductor packages comprising the steps of forming electronic circuits for a plurality of semiconductor chips 11 on a wafer 1, forming bumps 2 on the plurality of semiconductor chips 11, encapsulating the circuit-forming surface 111 of the wafer 1 and the bumps 2 with a sealant by screen printing means to form a sealant layer 4, curing the sealant layer 4, grinding the surface of the sealant layer 4 until the upper end surface of the bump 2 becomes exposed, placing solder balls on said upper end surface of bumps 2 to weld the balls to the surface thereof, and dicing the wafer 1 and the sealant layer 4 as united into individual semiconductor chips 11. Screen printing means is used to encapsulate the entire surface of the wafer with a resin, so that the equipment costs can be markedly reduced as compared with conventional methods using a mold.