Abstract: An object of the present invention is to provide a copper foil having excellent adhesion to an etching resist layer, without performing physical polishing such as buffing in pre-treatment of an etching process to form a circuit from the copper foil. To attain the object, in electroforming, a titanium material having a grain size number of 6.0 or more is employed as a copper deposition surface of the rotating drum cathode, and glue and/or gelatin is added in an amount of 0.2-20 mg/l to a copper sulfate solution, thereby producing a drum foil. An electrodeposited copper foil obtained from the drum foil, wherein 20% or more of the crystals present in a shiny side surface of the electrodeposited copper foil have a twin-crystal structure, is used for producing copper-clad laminates.

Abstract: A cathodic active material comprises a mixture of graphite particles and electrolytic manganese dioxide particles which are composed of needle-like crystals having an aspect ratio ranging from about 2 to about 20 and an alkaline manganese dioxide cell is provided with a cathode prepared from the cathodic active material. The cathodic active material for dry cells can be prepared by mixing, in advance, carbon powder with manganese dioxide powder in a weight ratio ranging from about 1:100 to about 15:100 and then pulverizing the resulting mixture. The novel cathodic active material for dry cells permits substantial improvement of the resulting dry cell in the high load-discharge quality.