Patents by Inventor Noriko KITAHAMA

Noriko KITAHAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Workpiece treating method, semiconductor device, process for manufacturing the same, and temporary fixing composition for shear peeling
    Patent number: 10679886
    Abstract: A workpiece treating method includes a step (1) of forming a stack including a support, a temporary fixing material and a workpiece wherein the material includes a layer containing a polymer (A) in a range of not less than 50 mass %, the polymer (A) including a structural unit represented by the formula (A1), and the workpiece is held on the material; a step (2) of processing the workpiece and/or transporting the stack; and a step (3) of applying a shear force to the material to thereby separate the workpiece from the support. R1 is a divalent organic group including at least one aromatic ring, each of two oxygen atoms bonded to R1 in (A1) is bonded to the aromatic ring, and, when R1 includes two or more aromatic rings, each of the two oxygen atoms is bonded to any one of the aromatic rings.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: June 9, 2020
    Assignee: JSR CORPORATION
    Inventors: Hiroyuki Ishii, Hitoshi Katou, Hiroki Ishikawa, Noriko Kitahama, Hirofumi Sasaki, Hikaru Mizuno
  • WORKPIECE TREATING METHOD, SEMICONDUCTOR DEVICE, PROCESS FOR MANUFACTURING THE SAME, AND TEMPORARY FIXING COMPOSITION FOR SHEAR PEELING
    Publication number: 20190157128
    Abstract: A workpiece treating method includes a step (1) of forming a stack including a support, a temporary fixing material and a workpiece wherein the material includes a layer containing a polymer (A) in a range of not less than 50 mass %, the polymer (A) including a structural unit represented by the formula (A1), and the workpiece is held on the material; a step (2) of processing the workpiece and/or transporting the stack; and a step (3) of applying a shear force to the material to thereby separate the workpiece from the support. R1 is a divalent organic group including at least one aromatic ring, each of two oxygen atoms bonded to R1 in (A1) is bonded to the aromatic ring, and, when R1 includes two or more aromatic rings, each of the two oxygen atoms is bonded to any one of the aromatic rings.
    Type: Application
    Filed: November 8, 2018
    Publication date: May 23, 2019
    Applicant: JSR CORPORATION
    Inventors: Hiroyuki ISHII, Hitoshi KATOU, Hiroki ISHIKAWA, Noriko KITAHAMA, Hirofumi SASAKI, Hikaru MIZUNO