Patents by Inventor Noriko Miyairi
Noriko Miyairi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240092658Abstract: A positive electrode active material with high charge and discharge capacity is provided. A novel positive electrode active material is provided. The positive electrode active material is manufactured in such a manner that after a cobalt compound (also referred to as a precursor) containing nickel, cobalt, and manganese is obtained by a coprecipitation method, a mixture obtained by mixing a lithium compound and the cobalt compound is heated at a first temperature; after the mixture is ground or crushed, heating at a second temperature that is a temperature higher than the first temperature is further performed; and after an additive is mixed, third heat treatment is performed. The first temperature is higher than or equal to 400° C. and lower than or equal to 700° C. The second temperature is higher than 700° C. and lower than or equal to 1050° C.Type: ApplicationFiled: February 1, 2022Publication date: March 21, 2024Inventors: Yusuke YOSHITANI, Takashi HIRAHARA, Noriko MIYAIRI, Masahiko HAYAKAWA, Yohei MOMMA
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Publication number: 20220223831Abstract: To provide a positive electrode active material with high charge and discharge capacity, or a novel positive electrode active material. The positive electrode active material is formed in the following manner: a cobalt compound (also referred to as a precursor) containing nickel, cobalt, and manganese is obtained by a coprecipitation method; a mixture obtained by mixing a lithium compound, the cobalt compound, and an additive is heated at first heating temperature; and the heated mixture is ground or crushed and further heated at second heating temperature that is higher than the first heating temperature. The first heating temperature is higher than or equal to 400° C. and lower than or equal to 700° C. The second heating temperature is higher than 700° C. and lower than or equal to 1050° C.Type: ApplicationFiled: December 29, 2021Publication date: July 14, 2022Inventors: Yusuke YOSHITANI, Takashi HIRAHARA, Noriko MIYAIRI, Masahiko HAYAKAWA, Yohei MOMMA
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Patent number: 10342124Abstract: Provided is a display device or an input/output device in which reflection of outside light is reduced. The display device includes a first substrate and a second substrate. The first substrate includes a first surface. A transistor is over the first surface. The second substrate includes a second surface. A first structure having a projection, a second structure having a projection, a black matrix covering the first structure and the second structure, and a color filter are over the second surface. The first surface faces the second surface. The black matrix has a plurality of projections reflecting the projection of the first structure and the projection of the second structure. A planar shape of the first structure is different from a planar shape of the second structure.Type: GrantFiled: June 10, 2015Date of Patent: July 2, 2019Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Mika Jikumaru, Daisuke Kubota, Noriko Miyairi, Takaaki Nagata
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Patent number: 10117331Abstract: Provided is a display device or an input/output device in which reflection of outside light is reduced. The display device includes a first substrate and a second substrate. The first substrate includes a first surface. A transistor is over the first surface. The second substrate includes a second surface. A first structure having a projection, a second structure having a projection, a black matrix covering the first structure and the second structure, and a color filter are over the second surface. The first surface faces the second surface. The black matrix has a plurality of projections reflecting the projection of the first structure and the projection of the second structure. A planar shape of the first structure is different from a planar shape of the second structure.Type: GrantFiled: June 10, 2015Date of Patent: October 30, 2018Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Mika Jikumaru, Daisuke Kubota, Noriko Miyairi, Takaaki Nagata
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Patent number: 9917274Abstract: To provide a light-emitting panel in which the occurrence of crosstalk is suppressed. To provide a method for manufacturing a light-emitting panel in which the occurrence of crosstalk is suppressed. The light-emitting panel includes a first electrode of one light-emitting element, a first electrode of the other light-emitting element, and an insulating partition which separates the two first electrodes. A portion with a thickness A1 smaller than a thickness A0 of a portion of the layer containing a light-emitting organic compound, which overlaps with a side surface of the partition, is included. The ratio (B1/B0) of a thickness B1 of a portion of the second electrode, which overlaps with a side surface of the partition, to a thickness B0 of a portion of the second electrode, which overlaps with the first electrode, is higher than the ratio (A1/A0).Type: GrantFiled: November 15, 2016Date of Patent: March 13, 2018Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Hideto Ohnuma, Noriko Miyairi, Naoyuki Senda
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Publication number: 20170062754Abstract: To provide a light-emitting panel in which the occurrence of crosstalk is suppressed. To provide a method for manufacturing a light-emitting panel in which the occurrence of crosstalk is suppressed. The light-emitting panel includes a first electrode of one light-emitting element, a first electrode of the other light-emitting element, and an insulating partition which separates the two first electrodes. A portion with a thickness A1 smaller than a thickness A0 of a portion of the layer containing a light-emitting organic compound, which overlaps with a side surface of the partition, is included. The ratio (B1/B0) of a thickness B1 of a portion of the second electrode, which overlaps with a side surface of the partition, to a thickness B0 of a portion of the second electrode, which overlaps with the first electrode, is higher than the ratio (A1/A0).Type: ApplicationFiled: November 15, 2016Publication date: March 2, 2017Applicant: Semiconductor Energy Laboratory Co., Ltd.Inventors: Hideto Ohnuma, Noriko MIYAIRI, Naoyuki SENDA
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Patent number: 9502676Abstract: To provide a light-emitting panel in which the occurrence of crosstalk is suppressed. To provide a method for manufacturing a light-emitting panel in which the occurrence of crosstalk is suppressed. The light-emitting panel includes a first electrode of one light-emitting element, a first electrode of the other light-emitting element, and an insulating partition which separates the two first electrodes. A portion with a thickness A1 smaller than a thickness A0 of a portion of the layer containing a light-emitting organic compound, which overlaps with a side surface of the partition, is included. The ratio (B1/B0) of a thickness B1 of a portion of the second electrode, which overlaps with a side surface of the partition, to a thickness B0 of a portion of the second electrode, which overlaps with the first electrode, is higher than the ratio (A1/A0).Type: GrantFiled: September 18, 2015Date of Patent: November 22, 2016Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Hideto Ohnuma, Noriko Miyairi, Naoyuki Senda
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Patent number: 9324971Abstract: A light-emitting module which efficiently extracts light emitted from a light-emitting element is provided. Alternatively, a light-emitting module having lower power consumption or improved reliability is provided. A light-emitting module includes a window material having a light-transmitting property, a light-emitting element that emits light transmitted from a light-transmitting layer to the window material, and an optical bonding layer between the window material and the light-transmitting layer. The optical bonding layer includes a thick part overlapping the light-emitting element and a thin part surrounding the thick part. The light-transmitting layer, the optical bonding layer, and the window material are provided in decreasing order of refractive index.Type: GrantFiled: March 18, 2014Date of Patent: April 26, 2016Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Shunpei Yamazaki, Yoshiharu Hirakata, Nozomu Sugisawa, Hisao Ikeda, Noriko Miyairi, Naoyuki Senda
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Publication number: 20160013437Abstract: To provide a light-emitting panel in which the occurrence of crosstalk is suppressed. To provide a method for manufacturing a light-emitting panel in which the occurrence of crosstalk is suppressed. The light-emitting panel includes a first electrode of one light-emitting element, a first electrode of the other light-emitting element, and an insulating partition which separates the two first electrodes. A portion with a thickness A1 smaller than a thickness A0 of a portion of the layer containing a light-emitting organic compound, which overlaps with a side surface of the partition, is included. The ratio (B1/B0) of a thickness B1 of a portion of the second electrode, which overlaps with a side surface of the partition, to a thickness B0 of a portion of the second electrode, which overlaps with the first electrode, is higher than the ratio (A1/A0).Type: ApplicationFiled: September 18, 2015Publication date: January 14, 2016Applicant: Semiconductor Energy Laboratory Co., Ltd.Inventors: Hideto Ohnuma, Noriko MIYAIRI, Naoyuki SENDA
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Publication number: 20150362776Abstract: Provided is a display device or an input/output device in which reflection of outside light is reduced. The display device includes a first substrate and a second substrate. The first substrate includes a first surface. A transistor is over the first surface. The second substrate includes a second surface. A first structure having a projection, a second structure having a projection, a black matrix covering the first structure and the second structure, and a color filter are over the second surface. The first surface faces the second surface. The black matrix has a plurality of projections reflecting the projection of the first structure and the projection of the second structure. A planar shape of the first structure is different from a planar shape of the second structure.Type: ApplicationFiled: June 10, 2015Publication date: December 17, 2015Applicant: Semiconductor Energy Laboratory Co., Ltd.Inventors: Mika Jikumaru, Daisuke KUBOTA, Noriko MIYAIRI, Takaaki NAGATA
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Patent number: 9142598Abstract: To provide a light-emitting panel in which the occurrence of crosstalk is suppressed. To provide a method for manufacturing a light-emitting panel in which the occurrence of crosstalk is suppressed. The light-emitting panel includes a first electrode of one light-emitting element, a first electrode of the other light-emitting element, and an insulating partition which separates the two first electrodes. A portion with a thickness A1 smaller than a thickness A0 of a portion of the layer containing a light-emitting organic compound, which overlaps with a side surface of the partition, is included. The ratio (B1/B0) of a thickness B1 of a portion of the second electrode, which overlaps with a side surface of the partition, to a thickness B0 of a portion of the second electrode, which overlaps with the first electrode, is higher than the ratio (A1/A0).Type: GrantFiled: June 20, 2012Date of Patent: September 22, 2015Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Hideto Ohnuma, Noriko Miyairi, Naoyuki Senda
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Publication number: 20140284642Abstract: A light-emitting module which efficiently extracts light emitted from a light-emitting element is provided. Alternatively, a light-emitting module having lower power consumption or improved reliability is provided. A light-emitting module includes a window material having a light-transmitting property, a light-emitting element that emits light transmitted from a light-transmitting layer to the window material, and an optical bonding layer between the window material and the light-transmitting layer. The optical bonding layer includes a thick part overlapping the light-emitting element and a thin part surrounding the thick part. The light-transmitting layer, the optical bonding layer, and the window material are provided in decreasing order of refractive index.Type: ApplicationFiled: March 18, 2014Publication date: September 25, 2014Applicant: Semiconductor Energy Laboratory Co., Ltd.Inventors: Shunpei YAMAZAKI, Yoshiharu HIRAKATA, Nozomu SUGISAWA, Hisao IKEDA, Noriko MIYAIRI, Naoyuki SENDA
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Publication number: 20120326201Abstract: To provide a light-emitting panel in which the occurrence of crosstalk is suppressed. To provide a method for manufacturing a light-emitting panel in which the occurrence of crosstalk is suppressed. The light-emitting panel includes a first electrode of one light-emitting element, a first electrode of the other light-emitting element, and an insulating partition which separates the two first electrodes. A portion with a thickness A1 smaller than a thickness A0 of a portion of the layer containing a light-emitting organic compound, which overlaps with a side surface of the partition, is included. The ratio (B1/B0) of a thickness B1 of a portion of the second electrode, which overlaps with a side surface of the partition, to a thickness B0 of a portion of the second electrode, which overlaps with the first electrode, is higher than the ratio (A1/A0).Type: ApplicationFiled: June 20, 2012Publication date: December 27, 2012Inventors: Hideto OHNUMA, Noriko MIYAIRI, Naoyuki SENDA
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Patent number: 6797626Abstract: The method of polishing a copper layer of a substrate is capable of improving a stock removal rate, etc. The method comprises the steps of: supplying a substrate onto an polishing pad of an polishing plate with a copper layer facing the polishing pad; pressing the substrate onto the polishing pad, with a backing pad, by a press head; relatively rotating the press head with respect to the polishing plate, with supplying polishing slurry onto the polishing pad. The backing pad is made of a material whose Asker C hardness is 75-95 and whose compressibility is 10% or less. The polishing slurry includes a chelating agent for chelating copper, an etching agent for etching the surface of copper layer, an oxidizing agent for oxidizing the surface of copper layer, and water.Type: GrantFiled: December 27, 2002Date of Patent: September 28, 2004Assignees: Fujikoshi Machinery Corp., Fujimi IncorporatedInventors: Noriko Miyairi, Yasuo Inada, Tsuyoshi Hasegawa, Yuji Terashima, Kenji Sakai, Tadahiro Kitamura, Takahiro Umeda
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Publication number: 20030124862Abstract: The method of polishing a copper layer of a substrate is capable of improving a stock removal rate, etc. The method comprises the steps of: supplying a substrate onto an polishing pad of an polishing plate with a copper layer facing the polishing pad; pressing the substrate onto the polishing pad, with a backing pad, by a press head; relatively rotating the press head with respect to the polishing plate, with supplying polishing slurry onto the polishing pad. The backing pad is made of a material whose Asker C hardness is 75-95 and whose compressibility is 10% or less. The polishing slurry includes a chelating agent for chelating copper, an etching agent for etching the surface of copper layer, an oxidizing agent for oxidizing the surface of copper layer, and water.Type: ApplicationFiled: December 27, 2002Publication date: July 3, 2003Applicant: Fujikoshi Machinery Corp.Inventors: Noriko Miyairi, Yasuo Inada, Tsuyoshi Hasegawa, Yuji Terashima, Kenji Sakai, Tadahiro Kitamura, Takahiro Umeda